With the growing popularity of advanced driver assistance systems (ADAS) and smart cockpits, manufacturers with strengths in information and communication technology (ICT) and semiconductor sectors, such as Taiwanese companies, are well-positioned to enter the automotive electronics supply chain.
This focus on ADAS and smart cockpit applications drives the evolution of future automotive technologies and the global automotive supply chain strategy.
This report analyzes the demand for automotive chips in ADAS and smart cockpits through global trends and major company case studies. It also examines the current deployment of Taiwanese manufacturers in the ADAS and smart cockpit supply chains across Europe, the United States, Japan, and China, to explore potential opportunities and challenges for chipmakers in this field.
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Table of Contents
1. Development of ADAS and Smart Cockpits
1.1 Integration of ADAS and Smart Cockpit Subsystems to Achieve Hardware Centralization
1.2 Computing Power of Chips Increases with the Demand Levels of Smart Vehicles
1.2.1 Development of ADAS/AD Chips
1.2.2 Development of Smart Cockpit Chips
1.3 Simplification of Chip Architecture from Distributed to Centralized Architecture Facilitates Subsequent Updates
1.3.1 Past: Distributed Architecture
1.3.2 Current: Domain Centralized Architecture
2. Chip Solutions for ADAS/Smart Cockpit by Major brands
2.1 Integration Trends of Texas Instruments TDAx
2.2 NVIDIA DRIVE Orin ™ Independently Controls ADAS and Smart Cockpit Functions
2.3 Qualcomm Snapdragon Ride Flex Integrates Autonomous Driving and Cockpit
3. Taiwanese Chipmakers and Their Deployment in ADAS and Smart Cockpit Supply Chains
3.1 ADAS and Smart Cockpit Applications
3.2 Regional ADAS/Smart Cockpit Supply Chains
3.2.1 Europe
3.2.2 U.S.
3.2.3 Japan
3.2.4 China
3.3 Taiwanese Manufacturers' Achievement of Automotive Safety Integrity Level (ASIL) Certification in 2023
3.4 Opportunities and Challenges
3.4.1 Collaborating with ICT Module/System Manufacturers to Enter the Automotive Electronics Supply Chain with Module and Subsystem Products
3.4.2 Acquiring Existing Automotive Electronics Suppliers to Directly Control Supply Channels and Customers, and Engage Directly with Automakers
Appendix
List of Companies
List of Tables
Table 1: Taiwanese Chipmakers in the ADAS and Smart Cockpit Supply Chain
List of Figures
Figure 1 System Configuration of SoC and ADAS/AD with Smart Cockpit
Figure 2: Overview of ADAS/AD Chips
Figure 3: Overview of Smart Cockpit Chips
Figure 4: Distributed Architecture vs. Domain-Centralized Architecture
Figure 5: Case Study of Texas Instruments SoC Chip Integration
Figure 6: NVIDIA DRIVE Orin™ Chip Diagram
Figure 7: Qualcomm Snapdragon Ride Flex SoC
Figure 8: Taiwanese Manufacturers Certified with ASIL in 20
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Aisin
- Anpec Electronics
- Audi
- AUO
- BHTC
- BMW
- Bosch
- BYD
- Changan Automobile
- Chimei Motor Electronics
- Chin Poon
- Clientron
- Continental
- Denso
- Elan Microelectronics
- Fitipower
- FocalTech
- Ford
- Foxcoon
- GM
- Himax
- Hisilicon
- Holtek Semiconductor
- Horizon Robotics
- Huawei
- Hyundai
- iCatch Technology
- Infineon
- Innolux
- Jaguar
- JASM
- LG Display
- Li Auto
- Magna
- Marvell
- MediaTek
- Mercedes-Benz
- Micron
- Mitsubishi
- Mobile Drive
- Mobileye
- MXIC
- Nanya Technology
- Nissan
- Novatek
- Nuvoton Technology
- Nvidia
- NXP
- Pegatron
- Phison
- Porsche
- PSMC
- Qualcomm
- Raydium
- Realtek
- Renesas
- SAIC Motor
- SBI
- Silicon Motion
- Silicon Optronics
- SiliconAuto
- Stellantis
- STMicroelectronics
- Sunplus Technology
- Tesla
- TI
- Tong Hsing Electronic
- Toyota
- TSMC
- TungThih Electronic
- Veoneer
- Visteon
- Volkswagen
- Volvo
- XPeng Motors
- YSheng Technology
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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