Passive & Interconnecting Electronic Components Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2021-2031

The Global Passive & Interconnecting Electronic Components Market is projected to expand from USD 196.72 Billion in 2025 to USD 274.51 Billion by 2031, reflecting a compound annual growth rate of 5.71%. These components serve as the fundamental hardware for electrical circuits, with passive devices like resistors and capacitors regulating signals independent of external power, while interconnects such as printed circuit boards and connectors bridge various system elements. Growth is largely underpinned by the rising production of electric vehicles, the widespread adoption of industrial automation, and the development of advanced telecommunications infrastructure. As noted by the Electronic Components Industry Association (ECIA), the top 50 global authorized distributors realized a collective sales increase of 4.8 percent in 2024, a performance significantly bolstered by strong market activity in Asia.

Despite this upward trajectory, the market faces substantial obstacles stemming from ongoing global supply chain volatility triggered by geopolitical trade fragmentation. These disruptions introduce uncertainty regarding the availability of essential raw materials and logistical routes, resulting in unstable production costs. Such instability can disrupt manufacturing timelines and limit the industry's capacity to fully leverage growing demand. Consequently, these supply chain complications present a persistent barrier to broader market expansion, preventing stakeholders from maximizing the potential offered by current industrial and technological trends.

Market Drivers

The surge in electric and autonomous vehicles serves as a primary driver for the passive and interconnecting electronic components market, creating a need for highly reliable hardware that can withstand elevated voltages and thermal stress. Modern electric drivetrains demand a significantly higher volume of multilayer ceramic capacitors and power resistors to efficiently manage on-board chargers and battery systems. According to the International Energy Agency's 'Global EV Outlook 2024' released in April 2024, electric car sales reached approximately 14 million units in 2023, triggering a spike in demand for automotive-grade components. This shift in the automotive sector directly bolsters the component ecosystem, a trend highlighted by IPC data showing that total North American printed circuit board shipments rose by 35 percent in August 2024 compared to the same month the prior year.

Simultaneously, the rollout of 5G telecommunications infrastructure is generating substantial demand for radio frequency interconnects and high-frequency passive devices. The installation of small cells and dense antenna arrays requires miniaturized filters and inductors that maintain signal integrity across broader bandwidths without expanding the physical size of base stations. This infrastructure development is expanding rapidly to satisfy consumer connectivity requirements. As reported in the June 2024 'Ericsson Mobility Report', service providers added 160 million 5G subscriptions globally in the first quarter of 2024 alone, driving the ongoing acquisition of specialized connectors and passive elements necessary for network densification.

Market Challenges

Persistent volatility within the global supply chain, fueled by geopolitical trade fragmentation, stands as a primary impediment to the growth of the Global Passive & Interconnecting Electronic Components Market. This fragmentation disrupts established logistical networks, leading to irregular availability of finished interconnects and essential raw materials. As tariffs and trade barriers increase, manufacturers face sudden escalations in procurement costs and prolonged lead times, which destabilize pricing models and delay crucial production schedules. Consequently, suppliers often struggle to sustain the output levels required to meet the escalating demands of the industrial automation and electric vehicle sectors, forcing a reduction in potential market throughput.

The severity of these disruptions is reflected in recent industry assessments of operational risk. According to IPC data from August 2024, 44 percent of electronics manufacturers expressed being very or extremely concerned regarding the effects of tariffs and trade policies on their business operations. This statistic highlights how geopolitical instability compels companies to focus on risk mitigation rather than capacity expansion. By injecting substantial unpredictability into the manufacturing ecosystem, these trade dynamics directly constrain the industry's ability to take advantage of rising demand, effectively slowing overall market momentum.

Market Trends

The trend toward miniaturizing component footprints to ultra-small case sizes is accelerating, propelled by the increasing density demands of high-performance computing clusters and artificial intelligence accelerators. As data center architectures advance to manage immense processing workloads, manufacturers are ramping up production of ultra-compact multilayer ceramic capacitors that provide high capacitance without occupying excessive board space. This structural pivot toward high-density passive components is reflected in the revenue composition of key suppliers; according to a November 2025 Chosun article titled 'AI server and EV demand drives MLCC supercycle', Samsung Electro-Mechanics noted that the portion of its MLCC sales attributed to AI servers grew from 3 percent in 2023 to 9 percent in 2024, emphasizing the industry's shift toward miniaturized, high-value components.

Simultaneously, the transition toward eco-friendly and sustainable material compositions is redefining manufacturing priorities as the industry adapts to circular economy principles and global decarbonization mandates. Suppliers are progressively re-engineering their product lines to utilize recycled materials and bio-based polymers, while also enhancing component efficiency to reduce operational carbon footprints for end-users. This dedication to environmental stewardship is producing tangible reductions in greenhouse gas emissions. For instance, TDK Corporation's 'Sustainability Report 2025', released in August 2025, revealed that the CO2 reduction contribution from its products totaled 7.038 million tons for the fiscal year ending March 2025, a 35.2 percent increase over the prior year, highlighting the expanding impact of eco-efficient electronic solutions.

Key Players Profiled in the Passive & Interconnecting Electronic Components Market

• Murata Manufacturing Co., Ltd.
• TDK Corporation
• Yageo Corporation
• Vishay Intertechnology, Inc.
• KYOCERA AVX Components Corporation
• TE Connectivity Ltd.
• Panasonic Corporation
• Samsung Electronics Co., Ltd.
• Littelfuse, Inc.
• Rohm Co. Ltd.

Report Scope

In this report, the Global Passive & Interconnecting Electronic Components Market has been segmented into the following categories:

Passive & Interconnecting Electronic Components Market, by Type:

• Passive
• Interconnecting

Passive & Interconnecting Electronic Components Market, by Application:

• Consumer Electronics
• Automotive
• Healthcare
• IT & Telecom
• Industrial
• Aerospace & defense

Passive & Interconnecting Electronic Components Market, by Region:

• North America
• Europe
• Asia-Pacific
• South America
• Middle East & Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Passive & Interconnecting Electronic Components Market.

Available Customization

The analyst offers customization according to your specific needs. The following customization options are available for the report:

• Detailed analysis and profiling of additional market players (up to five).

This product will be delivered within 1-3 business days.