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E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Report: Trends, Forecast and Competitive Analysis to 2031

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    Report

  • 150 Pages
  • March 2025
  • Region: Global
  • Lucintel
  • ID: 6007998
The global E-scrap and printed circuit board (PCB) E-scrap market is expected to reach an estimated $102.9 billion by 2031 with a CAGR of 7.7% from 2025 to 2031. The major drivers for this market are the significantly growing consumer electronics market, increasing proliferation of electronic devices, and expansion of recycling and reuse infrastructure in emerging countries.

The future of the global E-scrap and printed circuit board (PCB) E-scrap market looks promising with opportunities in the household appliance, IT & telecommunication, entertainment device, smartphone & tablet, and computers & laptop markets.
  • Within the process type category, E-waste recycling is expected to witness the highest growth over the forecast period due to growing awareness of the importance of E-waste recycling, and governments around the world are implementing regulations to promote E-waste recycling.
  • Within the source category, household appliances will remain the largest segment due to the short lifespan of many household appliances, such as televisions, refrigerators, and washing machines.
  • In terms of regions, APAC will remain the largest region due to rising urbanization and population along with an increase in the consumption of electronic devices and a growing manufacturing sector, which produces a significant amount of electronic waste in the region.

Emerging Trends in the E-Scrap and Printed Circuit Board (PCB) E-Scrap Market

The E-scrap and PCB E-scrap market is characterized by various new issues that continue to change the industry. These changes are brought about by innovations in technology, new laws and policies, and rising trends in environmental protection. Such trends are important to stakeholders who wish to keep up with the developing e-waste recycling industry.
  • Increased Automation in Recycling Processes: Automated recycling technologies are providing speedier and more reliable means of performing e-waste recycling processes. Most often employed in PCB recycling facilities, automated sorting and processing systems optimize PCB retrieval and minimize manpower. This trend also promotes the construction of more sophisticated recycling plants, thereby enhancing the overall efficiency of e-scrap recovery activities.
  • Building Better Methods for Material Reclamation: Process techniques for material reclamation have dramatically improved, augmenting hydrometallurgy and biotechnological processes. These advances make sustainable practices achieve better recovery techniques from waste disposal rather than using traditional methods of PCB recycling.
  • Expansion and Strengthening of Existing E-Waste Regulations and Standards: Electronics waste management regulations and standards are on the rise. These regulations aim to enhance the rates of recycling, limit the adverse effects on the environment, and provide for the safe disposal of electronic waste. The widening of regulatory arms is resulting in investments in new recycling solutions and encouraging better practices in the management of e-scrap.
  • Growth of Circular Economy Practices: The circular economy is a new trend in the e-scrap business. It stresses the importance of recycling or reusing electronic components to cut down on waste generation and save on raw materials. Such trends are giving rise to the adoption of circular economy practices by companies as they seek to enhance the sustainability of their operations in the context of global environmental concerns.
  • Increased Focus on Consumer Electronics Recycling: With the increase in the use of consumer electronics, there is also an increasing interest in the recycling of such gadgets. Efforts are being made by both companies and governments to promote proper disposal and recycling of smartphones, followed by other electronics. This trend is advancing the establishment of dedicated e-waste recycling centers and enhancing the recovery of e-scrap from consumer electronic devices.
Such emerging trends are altering the dynamics of the e-scrap market and the PCB e-scrap market significantly. The trend toward automation, sophisticated recovery techniques, and regulatory scrutiny are creating a new industrial model with quicker and more efficient recycling methods. As these trends continue to advance, they will likely improve e-scrap management practices and play a role in environmental preservation.

Recent Developments in the E-Scrap and Printed Circuit Board (PCB) E-Scrap Market

Current trends in the E-scrap and PCB E-scrap market demonstrate rapid technological development, altering regulatory conditions, and increasing efforts to enhance recycling practices. Trends like these are changing the industry, positioning it towards progress in the management of e-waste in a more effective and environmentally sound manner.
  • Emphasis on Technologies for Material Recovery from PCBs: Sophisticated techniques, such as hydrometallurgy and bioleaching, are being integrated into processes to enhance metal recovery from PCBs. These advanced methods also yield greater efficiency and lower environmental impact compared to conventional methods. The development of these technologies helps overcome prejudices against e-scrap recycling practices.
  • Growth of E-Waste Processing Plants: The construction of additional e-waste recycling centers is a key advancement in the industry. These centers have also been upgraded with modern technology to meet the demand for increased turnover of electronic waste materials and improved recovery of materials contained in such waste. This expansion of recycling infrastructure is crucial in handling the increasing volumes of e-scrap and PCB waste efficiently.
  • Stricter Measures to Bar E-Waste: In many countries, there is a trend of implementing stricter strategies for e-waste management in response to environmental concerns. Directives of this kind are aimed at ensuring the proper disposal of electronic waste and preventing the generation of toxins during e-waste recovery. Adherence to these rules promotes a culture of advanced recycling technology and improved waste management systems.
  • Growth of Public-Private Partnerships: The involvement of public and private entities in e-scrap recycling is encouraging innovation and growth in the field. Such collaborative ventures aim not only at creating new technologies but also at enhancing recycling practices and educating the public about e-waste issues. This growth in public-private partnerships continues to improve the effectiveness of e-scrap and PCB recycling projects.
  • Adoption of Circular Economy Practices: In the e-scrap sector, the incorporation of circular economy practices is gaining ground. Companies are attempting to recycle electronic parts as much as possible and minimize waste generation in the process. The application of circular economy practices is helping advance more efficient and sustainable e-scrap management practices.
These key developments are improving the recycling efficiency in the E-scrap and PCB E-scrap markets, expanding infrastructure and enforcing regulatory oversight. As the industry continues to change, these advancements will be essential in ensuring that e-waste management practices become more sustainable and reliable in the future.

Strategic Growth Opportunities for E-Scrap and Printed Circuit Board (PCB) E-Scrap Market

The E-scrap and PCB E-scrap market has diverse strategic growth opportunities in different applications. Factors such as technological advancements, legal changes, and a growing need for better recycling options lay the foundation for these opportunities. Once mastered, these opportunities will allow stakeholders to enhance their market position and grow.
  • Expansion in Emerging Markets: In addition to these rapid developments, seeking new e-scrap recycling markets in emerging regions, particularly in transitioning markets such as India and Southeast Asia, presents considerable opportunities. As these areas grow as user markets, with an increase in gadget demographics and gadget usage, the need for advanced recycling systems also rises. One way of addressing this is by investing in these markets, as new business strategies will become available, helping to tackle global e-waste issues.
  • Development of Advanced Recycling Technologies: Growth opportunities include investment in the research and industrialization of advanced recycling technologies. Incorporating hydrometallurgy and bioleaching technology in PCB recycling not only reduces time but also increases ecological friendliness. Companies willing to invest in these technologies will distinguish themselves in the market and better compete by improving material recovery.
  • Integration of Circular Economy Practices: The introduction of circular economy practices, such as recycling and the re-use of waste electronic and electrical components, opens up growth opportunities in the e-scrap sector. These practices help minimize waste and save resources, contributing to solving sustainability problems. Companies that embrace these practices in their operations stand a chance to improve their environmental impact and appeal to environmentally conscious customers.
  • Public-Private Partnerships: Promoting e-scrap recycling may be difficult for the business sector alone, which is why e-scrap management requires collaboration. Partnerships between government, stakeholders, and technology resources could lead to the creation of new recyclable technologies and waste management methods. Such initiatives can help facilitate access to capital and the skills necessary for expanding market supply.
  • Focus on Consumer Electronics Recycling: The increased amount of consumer electronics waste presents an area where e-scrap recyclers can gain strategic advantages. With rising demand for devices such as smartphones, laptops, tablets, and more, the need for recycling becomes even more critical. Creating dedicated services and facilities for the collection and recycling of specific categories of products while managing the lifecycle of electronics is an effective and sustainable approach to seizing the available opportunities in electronic waste management.
These strategic growth opportunities demonstrate the key gaps in the expansion and innovation of the E-scrap and PCB E-scrap markets. This could also lead to better positioning of stakeholders in the market and promote more effective management of e-waste through targeted new markets, advanced technology, circular economy approaches, and partnerships.

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Drivers and Challenges

Various drivers and challenges impact the growth and development of the E-scrap and PCB E-scrap markets. These include technological changes, policy shifts, socioeconomic factors, and the rise of environmentalism. In understanding these drivers and challenges, it is evident that the landscape of e-waste recycling is continuously changing.

The factors responsible for driving the e-scrap and printed circuit board (PCB) E-scrap market include:
  • Technological Advancements in Recycling: Automated sorting and advanced material recovery technologies continue to improve e-scrap recycling, propelling the e-scrap market. These technological advancements encourage efficiency, reduce costs, and increase the amount of precious materials recovered from PCBs. As technology advances, e-waste recycling grows.
  • Increasing Environmental Regulations: Investments in efficiency and e-scrap recycling stations are rising due to new and stricter environmental policies. Regulation by respective authorities now governs how electronic devices are disposed of or recycled, encouraging businesses to adopt proper recycling methods. Compliance with these regulations protects the environment and improves e-waste management practices.
  • Growing Volume of Electronic Waste: High growth potential exists in the e-scrap market, driven primarily by the increasing volume of electronic waste due to rising technology use and consumer electronics. This creates a demand for efficient processes to recycle this waste, requiring advancements in recycling technologies.
  • Consumer Sensitization and Demand for Sustainability: Consumers are becoming more conscious of environmental threats, leading to increased demand for sustainable practices. This translates into market growth as consumers seek greener products and services, prompting companies to improve their recycling practices.
Investment in Recycling Infrastructure: Investment in recycling infrastructure is key to the growth of the e-scrap market. Establishing new facilities and upgrading existing ones helps improve the speed and efficiency of e-waste processing, increasing the recovery rate of materials and driving market growth.

Challenges in the e-scrap and printed circuit board (PCB) E-scrap market are:

  • High Cost of Advanced Recycling Techniques: The cost of modern recycling technology is a barrier to market growth. The market requires significant investment in advanced equipment and facilities, which can be prohibitively expensive for small and medium enterprises. Overcoming cost-related challenges is critical to expanding recycling options and market growth.
  • Regulatory Compliance and Complexity: E-waste management companies often face numerous legal and regulatory issues. Activities related to environmental management systems require significant investments, staff efforts, and specific competencies. Legal challenges can hinder business operations and raise costs.
The E-scrap and PCB E-scrap markets are subject to trends and barriers that affect their growth and evolution. Core driving forces include technological advancements, environmental protection regulations, and consumer trends toward sustainability. Barriers such as high operational costs, complex regulations, and the informal sector must be addressed for further progress. Socioeconomic and environmental factors also need to be thoroughly analyzed to navigate the market effectively.

List of E-Scrap and Printed Circuit Board (PCB) E-Scrap Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies E-scrap and printed circuit board (PCB) E-scrap companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base.

Some of the E-scrap and printed circuit board (PCB) E-scrap companies profiled in this report include:

  • Boliden Dowa
  • Holdings
  • Escrap
  • Greentec
  • MAIREC Edelmetallgesellschaft
  • MIS Electronics
  • Umicore
  • URT Recycling Technology
  • Freeco International
  • Qizheng

E-Scrap and Printed Circuit Board (PCB) E-Scrap by Segment

The study includes a forecast for the global E-scrap and printed circuit board (PCB) E-scrap market by process type, material, source, and region.

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type [Analysis by Value from 2019 to 2031]:
  • E-Waste Collection
  • E-Waste Management
  • E-Waste Recycling
E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material [Analysis by Value from 2019 to 2031]:
  • Plastics
  • Glass
  • Metals
  • Ferrous Components
  • Precious Metals
  • Rare Metals
E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source [Analysis by Value from 2019 to 2031]:
  • Household Appliances
  • IT & Telecommunication
  • Entertainment Devices
  • Smartphone & Tablets
  • Computers & Laptops
  • Others
E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region [Analysis by Value from 2019 to 2031]:
  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country-Wise Outlook for the E-Scrap and Printed Circuit Board (PCB) E-Scrap Market

The PCBs E-scrap and E-scrap markets are growing rapidly as countries improve their e-waste management and recycling technologies. Recent progress in the United States, China, Germany, India, and Japan illustrates how this global issue is being tackled and how material recovery is being improved to reduce ecological concerns.
  • United States: In the U.S., there is a trend toward technological improvement in e-waste management practices. Companies are enhancing PCB recycling and precious metals recovery by developing advanced processing plants. Strategies are also emerging to reduce the volume of waste electronics, addressing the growing concern for the environment and emphasizing resource recovery.
  • China: In the e-scrap market, China is focusing on expanding and improving the effectiveness of its recycling capacity. Recent efforts include the formation and expansion of specialized e-waste recycling centers and the adoption of stricter environmental regulations. The country is also adopting technology to assist in the recovery of precious metals from PCBs, minimizing pollution and enhancing material recovery.
  • Germany: Germany has implemented emerging technologies for recycling and has policies in place to manage e-waste. The country has made significant progress in developing new recycling technologies for PCBs, including hydrometallurgical recycling and automated sorting systems. Germany’s commitment to resource efficiency has resulted in increased recovery rates of noble metals and a decrease in hazardous waste generation.
  • India: India is developing its e-waste management capabilities to meet the demands of an emerging market. Recent developments include improved management of e-scrap and better access to formal recycling services for consumers. Efforts are also underway to educate consumers and businesses about proper waste disposal and recycling.
  • Japan: Japan has aggressively pushed for technological and regulatory improvements in e-scrap and PCB recycling. Recently, renewable technologies, such as pyrometallurgical and biotechnological methods for recovering precious metals from PCBs, have been implemented. Japan aims to reduce the negative impact on the environment while enhancing recycling efficiency, aligning with its strategic goals of sustainable growth and resource-efficient practices.

Features of this Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Report

  • Market Size Estimates: E-scrap and printed circuit board (PCB) E-scrap market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.
  • Segmentation Analysis: E-scrap and printed circuit board (PCB) E-scrap market size by process type, material, source, and region in terms of value ($B).
  • Regional Analysis: E-scrap and printed circuit board (PCB) E-scrap market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different process types, materials, sources, and regions for the E-scrap and printed circuit board (PCB) E-scrap market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the E-scrap and printed circuit board (PCB) E-scrap market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

This report answers the following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the E-scrap and printed circuit board (PCB) E-scrap market by process type (E-waste collection, E-waste management, and E-waste recycling), material (plastics, glass, metals, ferrous components, precious metals, and rare metals), source (household appliances, IT & telecommunication, entertainment devices, smartphone & tablets, computers & laptops, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary
2. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. Market Trends and Forecast Analysis from 2019 to 2031
3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
3.2. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Trends (2019-2024) and Forecast (2025-2031)
3.3: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type
3.3.1: E-waste Collection
3.3.2: E-waste Management
3.3.3: E-waste Recycling
3.4: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material
3.4.1: Plastics
3.4.2: Glass
3.4.3: Metals
3.4.4: Ferrous Components
3.4.5: Precious Metals
3.4.6: Rare Metals
3.5: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source
3.5.1: Household Appliances
3.5.2: IT & Telecommunication
3.5.3: Entertainment Devices
3.5.4: Smartphone & Tablets
3.5.5: Computers & Laptops
3.5.6: Others
4. Market Trends and Forecast Analysis by Region from 2019 to 2031
4.1: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region
4.2: North American E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
4.2.1: North American Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
4.2.2: North American Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
4.3: European E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
4.3.1: European Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
4.3.2: European Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
4.4: APAC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
4.4.1: APAC Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
4.4.2: APAC Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
4.5: ROW E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
4.5.1: RoW Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
4.5.2: RoW Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type
6.1.2: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material
6.1.3: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source
6.1.4: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region
6.2: Emerging Trends in the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Boliden Dowa
7.2: Holdings
7.3: Escrap
7.4: Greentec
7.5: MAIREC Edelmetallgesellschaft
7.6: MIS Eletronics
7.7: Umicore
7.8: URT Recycling Technology
7.9: Freeco International
7.10: Qizhen

Companies Mentioned

The leading players profiled in this E-Scrap and Printed Circuit Board (PCB) E-Scrap market report include:
  • Boliden Dowa
  • Holdings
  • Escrap
  • Greentec
  • MAIREC Edelmetallgesellschaft
  • MIS Electronics
  • Umicore
  • URT Recycling Technology
  • Freeco International
  • Qizheng

Methodology

The analyst has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets/applications and served over 1,000 clients worldwide. Each study is a culmination of four months of full-time effort performed by the analyst team. The analysts used the following sources for the creation and completion of this valuable report:

  • In-depth interviews of the major players in the market
  • Detailed secondary research from competitors’ financial statements and published data
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of professionals, who have analyzed and tracked the market over the years.

Extensive research and interviews are conducted in the supply chain of the market to estimate market share, market size, trends, drivers, challenges and forecasts.

Thus, the analyst compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. The analyst then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process.

 

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