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Global Trends and Strategic Outlook of the Third-Generation Semiconductor Industry

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    Report

  • 90 Pages
  • September 2024
  • Region: Global
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 6008193
Amid escalating geopolitical risks, ongoing conflicts, and tightening monetary policies in Europe and the U.S., global economic performance is expected to remain flat compared to 2023. However, the semiconductor market is nearing the end of inventory adjustments, with demand in automotive, high-performance computing (HPC), and the Artificial Intelligence of Things (AIoT) sectors poised to support a return to growth, potentially leading to double-digit increases. Additionally, wide-bandgap compound semiconductors, or third-generation materials, are gaining attention for their high voltage resistance, temperature tolerance, and energy efficiency benefits, crucial for achieving net-zero emissions. Companies in Europe, the U.S., and Japan lead this market, with emerging competition from China, South Korea, and Taiwan.

This value pack provides an overview of global semiconductor market performance, analyzes the competitive landscape of leading DRAM suppliers - Samsung, SK Hynix, and Micron - and explores future developments in 3D NAND, major wafer foundries, and the third-generation semiconductor industry across key regions.

Table of Contents

Development and Strategic Position of the Global Semiconductor Industry Chain
1. Global Semiconductor Market Performance
1.1 Global Semiconductor Market Declines in 2023
1.2 Supply Chain Recovery Likely to Drive Double-Digit Growth in the Semiconductor Market in 2024
1.3 ICs Dominating the Global Semiconductor Market with Over 80% Share
1.4 Global End-Product Shipment Growth Driving Pull-in Demand in 2024
2. Capex of Global Semiconductor Companies
2.1 High Concentration of CapEx among Global Semiconductor Firms
2.2 Semiconductor Equipment Takes the Largest Share of CapEx
3. Competitive Landscape of three DRAM suppliers
3.1 Two Korea Suppliers Dominates the DRAM Market with a 72% Share
3.2 Fierce Competition Expected as DRAM Enters the 1? Process in 2024
3.3 HPC Applications Drive HBM Development
4. 3D NAND Advances into the 200-Layer Era
4.1 Two Korean Companies Lead the NAND Flash Market with a 52% Share
4.2 The Future of 3D NAND Entering the 300-Layer Era
5. Major Wafer Foundries Have Mass-Produced 3nm Process
5.1 2022-2023: Major Foundries Kick off 3nm Process Mass Production
5.2 2024-2025: Major Foundries Compete in the 2nm Era
6. Global Semiconductor Companies' Revenue Ranking
6.1 TSMC Remains the World's Largest Semiconductor Company in 2023
6.2 Nvidia Stands Out in 2023 with Revenue Growth of 87%
7. The Analyst's PerspectiveAppendixList of CompaniesDevelopment of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies
1. Development of European and US Third-Gen Semiconductor Industry
1.1 Europe
1.1.1 Focusing on Automotive and Industrial Niches
1.1.2 Abundant Research Resources and Robust Epitaxy and Wafer Foundry Capabilities
1.2 US
1.2.1 Prioritizing Military Applications , Expanding to Civilian Uses
1.2.2 Leading SiC Substrate Market Share with Equal Focus on Communication and Power Devices
2. Product Strategies of Leading Companies in Europe and the US
2.1 STMicroelectronics
2.2 Infineon
2.3 Onsemi
2.4 Wolfspeed
2.5 Navitas
2.6 Qorvo
3. Development of Third-Gen Semiconductor Industry in East Asia
3.1 Japan
3.1.1 Equal Focus on Development of Power and Communication Devices
3.1.2 Leading in Patents, with Strengths in Epitaxy Technology
3.2 Korea
3.2.1 Government-led Development with Focus on Power Applications
3.3 China
3.3.1 Government-led Development with Rapid Expansion
3.3.2 Foreign Companies Partnering with Local Firms due to Large Domestic Market and Policy Support
4. Product Strategies of Leading Companies in East Asia
4.1 ROHM
4.2 Sumitomo Group
4.3 Mitsubishi
4.4 Innoscience
4.5 Sanan Optoelectronics
5. The Analyst's PerspectiveAppendixList of CompaniesDevelopment of Taiwan's Third-Generation Semiconductor Industry and Key Players
1. Taiwanese Third-Generation Semiconductor Industry Development
1.1 Taiwan's Late Entry into Third-Generation Semiconductors Focuses Mainly on Wafer Foundry
1.2 Positive Outlook Drives Capacity Expansion by Quasi-IDMs and Foundries
1.3 Policy Prioritizing Technological and Material Independence, But Further Applications Still Need Improvement
2. Trends and Straties of Major Taiwanese Companies
2.1 SAS
2.2 Foxconn Technology Group
2.3 Panjit
3. The Analyst's PerspectiveAppendixList of CompaniesList of Tables
Development and Strategic Position of the Global Semiconductor Industry Chain
Table 1. 2023 Global Top 25 Semiconductor Companies Revenue Rankings (Including Wafer Foundries)
Development of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies
Table 1: Development Strategies of Leading Third-Gen Semiconductor Companies in Europe and the United States
Table 2: Products of Leading Third-Gen Semiconductor Companies in Europe and the United States
Table 3: Development Strategies of Leading Third-Gen Semiconductor Companies in East Asia
Table 4: Products of Leading Third-Gen Semiconductor Companies in East Asia
Development of Taiwan's Third-Generation Semiconductor Industry and Key Players
Table 1: Capacity Expansion Timeline for Taiwanese Third-Generation Semiconductor Manufacturers
Table 2: Key Development Strategies of Taiwanese Third-Generation Semiconductor Companies
Table 3: Major Products of Taiwanese Third-Generation Semiconductor Companies
List of Figures
Development and Strategic Position of the Global Semiconductor Industry Chain
Figure 1. Worldwide Semiconductor Market Value, 2011 - 2024
Figure 2. End Product Shipment Volume and Growth Rate in 2024
Figure 3: Global Leading DRAM Manufacturers' Technology Roadmap
Figure 4. Global Major NAND Flash Manufacturers' Technology Roadmap
Figure 5. Global Major Wafer Foundries' Technology Roadmap
Development of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies
Figure 1: STMicroelectronics' Third-Gen Semiconductor Development Strategies
Figure 2: Infineon's Third-Gen Semiconductor Development Strategies
Figure 3: Onsemi's Third-Gen Semiconductor Development Strategies
Figure 4: Wolfspeed's Third-Gen Semiconductor Development Strategies
Figure 5: Navitas' Third-Gen Semiconductor Development Strategies
Figure 6: Qorvo's Third-Gen Semiconductor Development Strategies
Figure 7: ROHM's Third-Gen Semiconductor Development Strategies
Figure 8: SEDI's Vision for Information Transmission by 2030
Figure 9: Mitsubishi's Third-Gen Semiconductor Development Strategies
Figure 10: Innoscience's Third-Gen Semiconductor Development Strategies
Figure 11: Sanan Optoelectronics' Third-Gen Semiconductor Development Strategies
Development of Taiwan's Third-Generation Semiconductor Industry and Key Players
Figure 1: Taiwan's Third-Generation Semiconductor Industry Chain
Figure 2: Business Landscape of SAS Group
Figure 3: SAS Group's Third-Generation Semiconductor Development Strategy
Figure 4: Foxconn Technology Group's Vision
Figure 5: Foxconn Technology Group's Third-Generation Semiconductor Development Strategy
Figure 6: Development Timeline for Panjit's SiC Products
Figure 7: Panjit's Third-Generation Semiconductor Development Strategy

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • ABB
  • AcBel Polytech
  • Actron Technology
  • AIDC
  • Aleo
  • AMD
  • Amkor
  • Ampt
  • Analog Devices
  • Ancora Semiconductors
  • Anjet
  • Anker
  • Anokiwave
  • Apple
  • AWSC
  • Billion Electric
  • BMW
  • Broadcom
  • BYD
  • CEA-Leti
  • Champion Microelectronic
  • Chengxin
  • Chip-GaN Power Semiconductor
  • Coherent
  • Delta Electronics
  • Denso
  • EPC
  • EpiGaN
  • Episil-Precision
  • Exagan
  • fastSiC
  • Foxconn
  • Foxtron Vehicle Technologies
  • Gan-Asia Semiconductor
  • GE
  • GlobalFoundries
  • Globitech
  • GTAT
  • Halon Microelectronics
  • Hermes
  • Hermes Microvision
  • Hong Young Semiconductor
  • HY Electronic (Cayman)
  • Hyundai
  • Imec
  • Infineon
  • Infinity Communication
  • Intel
  • IQE
  • Kenmec
  • Kioxia
  • LG
  • Lite-On
  • Lithium
  • Luxgen
  • Macom
  • Macronix
  • Magna
  • Marvell
  • Master Transportation
  • Mazda
  • MediaTek
  • Mercedes Benz
  • Microchip
  • Micron
  • Mitsubishi
  • Mosel Vitelic
  • MUFG Bank
  • Nanya Technology
  • Navitas
  • NEC
  • Nexchip Semiconductor
  • Nexperia
  • NextDrive
  • Niko-Sem
  • NIO
  • Norstel AB
  • NTT
  • NTT-AT
  • Nvidia
  • NXP Semiconductors
  • Ommic
  • ON Semiconductor
  • Panjit
  • Phihong
  • Phison
  • Potens Semiconductor
  • Power Integrations
  • ProAsia Semiconductor
  • PSMC
  • Qorvo
  • Qualcomm
  • RAC Electric Vehicles Inc
  • Rapidus
  • Rectron
  • Renesas
  • Resonac
  • ROHM
  • Samsung
  • Samsung Electronics
  • Sanan Optoelectronics
  • SAS
  • SEDI
  • Shanghai Huahong Hongli Semiconductor
  • SiCEV
  • SiCrytal
  • Siemens
  • Silfab Solar
  • Siltectra
  • SK Hynix
  • Skytech
  • SMIC
  • SoftBank
  • Soitec
  • Sony
  • SpaceX
  • STMicroelectronics
  • Sumitomo Group
  • Taisic Materials
  • Taiwan Semiconductor
  • TankeBlue Semiconductor
  • TASC
  • Teco
  • Tesla
  • TI
  • Toshiba
  • Tower Semiconductor
  • Toyota
  • Transcom
  • Transphorm
  • Tron Future
  • TSMC
  • UMC
  • UMS
  • UnitedSiC
  • UTAC
  • VDD Tech
  • VIS
  • Vitesco
  • VPEC
  • VSI
  • Wavetek
  • Western Digital
  • WIN Semiconductors
  • Winbond Electronics
  • Wolfspeed
  • X-FAB
  • YMTC

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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