This value pack provides an overview of global semiconductor market performance, analyzes the competitive landscape of leading DRAM suppliers - Samsung, SK Hynix, and Micron - and explores future developments in 3D NAND, major wafer foundries, and the third-generation semiconductor industry across key regions.
Table of Contents
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ABB
- AcBel Polytech
- Actron Technology
- AIDC
- Aleo
- AMD
- Amkor
- Ampt
- Analog Devices
- Ancora Semiconductors
- Anjet
- Anker
- Anokiwave
- Apple
- AWSC
- Billion Electric
- BMW
- Broadcom
- BYD
- CEA-Leti
- Champion Microelectronic
- Chengxin
- Chip-GaN Power Semiconductor
- Coherent
- Delta Electronics
- Denso
- EPC
- EpiGaN
- Episil-Precision
- Exagan
- fastSiC
- Foxconn
- Foxtron Vehicle Technologies
- Gan-Asia Semiconductor
- GE
- GlobalFoundries
- Globitech
- GTAT
- Halon Microelectronics
- Hermes
- Hermes Microvision
- Hong Young Semiconductor
- HY Electronic (Cayman)
- Hyundai
- Imec
- Infineon
- Infinity Communication
- Intel
- IQE
- Kenmec
- Kioxia
- LG
- Lite-On
- Lithium
- Luxgen
- Macom
- Macronix
- Magna
- Marvell
- Master Transportation
- Mazda
- MediaTek
- Mercedes Benz
- Microchip
- Micron
- Mitsubishi
- Mosel Vitelic
- MUFG Bank
- Nanya Technology
- Navitas
- NEC
- Nexchip Semiconductor
- Nexperia
- NextDrive
- Niko-Sem
- NIO
- Norstel AB
- NTT
- NTT-AT
- Nvidia
- NXP Semiconductors
- Ommic
- ON Semiconductor
- Panjit
- Phihong
- Phison
- Potens Semiconductor
- Power Integrations
- ProAsia Semiconductor
- PSMC
- Qorvo
- Qualcomm
- RAC Electric Vehicles Inc
- Rapidus
- Rectron
- Renesas
- Resonac
- ROHM
- Samsung
- Samsung Electronics
- Sanan Optoelectronics
- SAS
- SEDI
- Shanghai Huahong Hongli Semiconductor
- SiCEV
- SiCrytal
- Siemens
- Silfab Solar
- Siltectra
- SK Hynix
- Skytech
- SMIC
- SoftBank
- Soitec
- Sony
- SpaceX
- STMicroelectronics
- Sumitomo Group
- Taisic Materials
- Taiwan Semiconductor
- TankeBlue Semiconductor
- TASC
- Teco
- Tesla
- TI
- Toshiba
- Tower Semiconductor
- Toyota
- Transcom
- Transphorm
- Tron Future
- TSMC
- UMC
- UMS
- UnitedSiC
- UTAC
- VDD Tech
- VIS
- Vitesco
- VPEC
- VSI
- Wavetek
- Western Digital
- WIN Semiconductors
- Winbond Electronics
- Wolfspeed
- X-FAB
- YMTC
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
LOADING...