This report examines the development of the smart sensor industry from multiple angles, including global applications, leading brands, and product trends, while also exploring market opportunities within the smart sensor sector.
Table of Contents
1. Definition of Smart Sensors2. Development of the Smart Sensor Market
3. Development of Smart Sensor Applications
3.1 Automotive Electronics
3.2 Industrial Automation
3.3 Consumer Electronics
4. Strategies of Major Brands and Product Trends
4.1 Development of Major Brands
4.1.1 Automotive Sensor Suppliers: Technology Integration is the Key Battleground
4.1.2 Industrial Automation Sensors: Shifting from Hardware to Full Solutions
4.1.3 Consumer Electronics Sensors: Broadening Product Lines
4.2 Development of Key Products
4.2.1 Trend 1: Sensor Fusion - Integration of Multiple Sensors
4.2.2 Trend 2: AI Sensors
4.2.3 Trend 3: Quantum Sensors
5. The Analyst's Perspective
Appendix
List of Companies
List of Figures
Figure 1: Basic Architecture of Smart Sensors
Figure 2: Global Market Size of Smart Sensors
Figure 3: Key Applications of Sensors in Automobiles
Figure 4: Key Global Participants in the Smart Sensor Market - Classified by End-Use Application
Figure 5: Sensor Fusion as Part of a System
Figure 6: STMicroelectronics' Three Sensor Preprocessing Technologies
Figure 7: Illustration of Cerca OPM-MEG System
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ABB
- ADI
- Aeva
- Ainstein
- Amphenol
- Analog Devices
- Arbe Robotics
- ASE
- Bosch
- Cerca Magnetics
- Cognex
- Continental
- Denso
- Eaton
- Emerson
- FLIR
- Foobot
- Forvia
- GE
- Gentex
- Hokuyo Automatic
- Honeywell
- Hyundai Mobis
- Industrial Scientific
- Infineon
- Innoviz
- KYEC
- LeddarTech
- Legrand
- Leviton
- Lord MicroStrain Sensing
- Lumotive
- Luxonis
- Magna
- Microchip
- Movella
- Nidec
- NXP Semiconductors
- OmniVision
- Omron
- Onsemi
- Optonic
- Orbbec
- Osram
- Ouster
- Panasonic
- Photoneo
- PMD
- Qnami
- Quanergy
- Samsung
- Seek Thermal
- Sensata Technologies
- SICK Sensor Intelligence
- Siemens
- Sony
- ST Microelectronics
- StereoLabs
- TDK
- TE Connectivity
- Texas Instruments
- TI
- Toposens
- TSMC
- UMC
- Vayyar
- Velodyne Lidar
- VIS
- VisEra Technologies
- Vishay
- Vishay Precision
- Yost Labs
- Zivid
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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