Semiconductor Lead Frame Market Report 2024

This Semiconductor Lead Frame market report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

The semiconductor lead frame market size has grown strongly in recent years. It will grow from $3.32 billion in 2023 to $3.59 billion in 2024 at a compound annual growth rate (CAGR) of 8%. The growth during the historic period can be attributed to the rising demand for semiconductor devices, the increasing need for smaller and thinner electronic devices, growth in consumer electronics, the adoption of renewable energy technologies, and the expansion of electronics manufacturing.

The semiconductor lead frame market size is expected to see strong growth in the next few years. It will grow to $4.9 billion in 2028 at a compound annual growth rate (CAGR) of 8.1%. The growth in the forecast period can be attributed to the expansion of 5G networks, increased production of IoT devices, a rise in electric vehicle production, continued growth in medical electronics, and the development of smart city infrastructure. Major trends during this period include the development of new materials, the adoption of automation and smart manufacturing technologies, a growing emphasis on eco-friendly materials, the integration of AI and machine learning, and the emergence of advanced packaging technologies.

The increasing popularity of electric vehicles (EVs) is expected to drive the growth of the semiconductor lead frame market. Electric vehicles are cars powered predominantly or entirely by electric motors and batteries, as opposed to internal combustion engines that use fossil fuels. The rise in electric vehicles is driven by growing environmental concerns, advancements in battery technology, and supportive government policies aimed at promoting cleaner transportation. Semiconductor lead frames are essential for EVs as they provide crucial electrical connections, mechanical support, and thermal management for the semiconductor components used in EV power electronics and control systems. For example, a report from the US Department of Energy in March 2022 highlighted that electric vehicle sales surged by 85% in 2021. Sales of new light-duty plug-in electric vehicles, including both EVs and plug-in hybrid electric vehicles (PHEVs), nearly doubled from 308,000 in 2020 to 608,000 in 2021, with EVs representing 73% of all plug-in electric vehicle sales that year. Thus, the growing popularity of EVs is fueling the expansion of the semiconductor lead frame market.

Leading companies in the semiconductor lead frame market are advancing their solutions with new technologies, such as the reliable semiconductor package QFN (Quad Flat No-Lead), to offer enhanced features. The QFN package is known for its compact size, excellent thermal and electrical performance, and strong mechanical stability, making it suitable for high-frequency and high-power applications. For instance, in October 2021, Dai Nippon Printing Co. Ltd., a Japan-based printing company, introduced a new manufacturing technology. This technology features a high-definition silver-plated area for lead frames, which securely holds semiconductor chips and ensures reliable external connections. It also improves adhesiveness with advanced surface roughening technology, setting a high industry standard by sealing the copper surface to the mold compound. This innovation is designed to increase the use of the reliable Quad Flat No-Lead (QFN) package in vehicles.

In December 2023, Concentric, a US-based provider of industrial power solutions, acquired Jantech for an undisclosed amount. This acquisition enhances Concentric’s ability to serve mission-critical sectors, including data centers, hospitals, financial institutions, and other essential facilities. Jantech is a US-based manufacturer of semiconductor lead frames.

Major companies operating in the semiconductor lead frame market are Samsung Electronics Co., Texas Instruments Incorporated, STMicroelectronics, Infineon Technologies AG, LG Innotek, Toppan Inc., Dai Nippon Printing Co. Ltd., Amkor Technology, POSSEHL, ASM Pacific Technology, Mitsui High-tec Inc., Shinko Electric Industries Co. Ltd., Fusheng Co. Ltd., Haesung DS Co. Ltd., Chang Wah Technology Co. Ltd., Ningbo Kangqiang Electronics Co. LTD., Enomoto Co. Ltd., Jih Lin Technology Co. Ltd., SDI Group Inc., Jentech, Yonghong Technology Co. Ltd., Precision Micro Ltd., Ningbo Hualong Electronics Co. Ltd., Dynacraft Industries Sdn Bhd, Advanced Assembly Materials International Ltd., Wuxi.

North America was the largest region in the Semiconductor Lead Frame market in 2023. Asia Pacific is expected to be the highest-growing region in the forecast period. The regions covered in the semiconductor lead frame market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the semiconductor lead frame market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

A semiconductor lead frame is a vital component in the packaging of semiconductor devices, such as integrated circuits (ICs). It acts as both a physical and electrical interface between the semiconductor chip and external circuitry, such as a printed circuit board (PCB). Lead frames are essential for the reliable and efficient operation of semiconductor devices by providing electrical connectivity, mechanical support, thermal management, and package formation.

The main types of semiconductor lead frames include stamping process lead frames, etching process lead frames, copper lead frames, copper alloy lead frames, iron-nickel lead frames, and others. A stamping process lead frame is produced by stamping metal sheets into complex shapes. It is available in various packaging types, including dual inline pin packages (DIP), small outline packages (SOP), small outline transistors (SOT), quad flat packs (QFP), dual flat no-leads (DFN), quad flat no-leads (QFN), flip-chips (FCF), and others. These lead frames are used in integrated circuits (ICs), discrete devices, and more, serving various end users such as consumer electronics, industrial and commercial electronics, telecommunications, and automotive sectors.

The semiconductor lead frames market research report is one of a series of new reports that provides semiconductor lead frames market statistics, including semiconductor lead frames industry global market size, regional shares, competitors with a semiconductor lead frames market share, detailed semiconductor lead frames market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor lead frames industry. This semiconductor lead frames market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The semiconductor lead frame market consists of sales of ceramic lead frames, leadless chip carrier (LCC) lead frames, thin quad flat package (TQFP) lead frames and related products. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.


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