This Semiconductor Capital Equipment market report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
The semiconductor capital equipment market size has grown strongly in recent years. It will grow from $76.39 billion in 2023 to $82.86 billion in 2024 at a compound annual growth rate (CAGR) of 8.5%. The growth during the historic period can be attributed to several factors, including technological advancements in semiconductor devices, increasing demand for consumer electronics, the expansion of data centers and cloud infrastructure, a rise in automotive electronics, advancements in AI and ML technologies, economic cycles affecting demand, innovations in memory and storage, and a focus on sustainable manufacturing practices.
The semiconductor capital equipment market size is expected to see strong growth in the next few years. It will grow to $115.27 billion in 2028 at a compound annual growth rate (CAGR) of 8.6%. The growth anticipated during the forecast period can be attributed to the adoption of 5G technology, the expansion of IoT devices, a shift toward advanced packaging, increasing complexity in semiconductor designs, demand for high-performance computing, efforts to enhance supply chain resilience and security, and investments in green technology. Major trends include the integration of AI in manufacturing, the development of new semiconductor materials, a focus on wafer-level packaging, advancements in metrology and inspection techniques, the adoption of Industry 4 in fabrication facilities, and the growth of equipment leasing models.
The rapid deployment of 5G technology is anticipated to drive growth in the semiconductor capital equipment market. As the fifth generation of mobile network technology, 5G offers significantly faster data speeds, lower latency, and enhanced connectivity compared to previous generations. The increasing demand for 5G is driven by its capability to support high-speed data processing and low latency, which are critical for emerging applications such as autonomous vehicles, smart cities, and augmented reality. Semiconductor capital equipment plays a vital role in the deployment of 5G technology, as it facilitates the production of advanced chips and components necessary for high-speed data processing and communication infrastructure. For example, in March 2024, 5G Americas reported that global 5G connections reached 1.76 billion by the end of 2023, reflecting a 66% year-over-year increase with an additional 700 million connections. The growth is expected to continue at an accelerated pace, with forecasts predicting 7.9 billion 5G connections by 2028. This rapid expansion in 5G technology is driving the semiconductor capital equipment market.
Leading companies in the semiconductor capital equipment sector are focusing on heterogeneous chip integration and system-level packaging, such as hybrid bonding, to improve performance, functionality, and meet the demand for advanced semiconductor solutions. Hybrid bonding involves creating a direct bond between chip surfaces, typically using a combination of metallic and insulating layers. For instance, in July 2023, Applied Materials, a US-based semiconductor equipment provider, introduced new materials, technologies, and systems designed to assist chipmakers in integrating chiplets into advanced 2.5D and 3D packages through hybrid bonding and through-silicon vias (TSVs). These innovations expand Applied's technology portfolio for heterogeneous integration (HI), which allows the combination of chiplets with different functions, technology nodes, and sizes into a single package. This approach addresses challenges in high-performance computing and artificial intelligence, offering a strategic solution as traditional 2D transistor scaling becomes increasingly costly and less effective. HI enhances chip performance, power efficiency, area cost, and time to market (PPACt).
In October 2021, Yield Engineering Systems, Inc., a US-based provider of process engineering equipment, acquired the semiconductor capital equipment business of Kanthal AB for an undisclosed amount. This acquisition aims to enhance YES’s capabilities in semiconductor thermal processing by incorporating Kanthal's high-temperature furnace technology and LPCVD processes into its product portfolio. Kanthal AB, based in Sweden, is a provider of heating technology specializing in semiconductor capital equipment for industrial applications.
Major companies operating in the semiconductor capital equipment market are Applied Materials Inc., ASML Holding N.V., Lam Research Corporation, Tokyo Electron Limited, KLA Corporation, United Microelectronics Corporation, Microchip Technology Inc., Semiconductor Manufacturing International Corporation (SMIC, Nikon Corporation, Hitachi High-Technologies Corporation, Advantest Corporation, MKS Instruments Inc., Teradyne Inc., Screen Holdings Co. Ltd., Bruker Corporation, ASM International N.V., DISCO Corporation, Kulicke & Soffa Industries Inc., Edwards Vacuum, Cohu Inc., Veeco Instruments Inc., Rudolph Technologies Inc., Mattson Technology Inc., BE Semiconductor Industries N.V. (BESI), Aixtron SE.
North America was the largest region in the semiconductor capital equipment market in 2023. The regions covered in the semiconductor capital equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the semiconductor capital equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Semiconductor capital equipment refers to the specialized machinery and tools used in the manufacturing of semiconductor devices and integrated circuits. This equipment is crucial for various stages of semiconductor production, including wafer fabrication, assembly, and testing.
The main types of semiconductor capital equipment are wafer manufacturing equipment, assembly and packaging equipment, test equipment, and others. Wafer manufacturing equipment is used to produce the foundational silicon wafers for microchips, involving processes such as crystal growth, slicing, and polishing. Applications include wafer processing, surface conditioning, chemical mechanical planarization, chemical vapor deposition, as well as assembly and packaging. These technologies serve industries such as consumer electronics, healthcare, automotive, information technology (IT), and telecommunications.
The semiconductor capital equipment market research report is one of a series of new reports that provides semiconductor capital equipment market statistics, including semiconductor capital equipment industry global market size, regional shares, competitors with an semiconductor capital equipment market share, detailed semiconductor capital equipment market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor capital equipment industry. This semiconductor capital equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The semiconductor capital equipment market consists of sales of inspection and metrology equipment, chemical mechanical planarization (CMP) equipment, and deposition equipment. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
The semiconductor capital equipment market size has grown strongly in recent years. It will grow from $76.39 billion in 2023 to $82.86 billion in 2024 at a compound annual growth rate (CAGR) of 8.5%. The growth during the historic period can be attributed to several factors, including technological advancements in semiconductor devices, increasing demand for consumer electronics, the expansion of data centers and cloud infrastructure, a rise in automotive electronics, advancements in AI and ML technologies, economic cycles affecting demand, innovations in memory and storage, and a focus on sustainable manufacturing practices.
The semiconductor capital equipment market size is expected to see strong growth in the next few years. It will grow to $115.27 billion in 2028 at a compound annual growth rate (CAGR) of 8.6%. The growth anticipated during the forecast period can be attributed to the adoption of 5G technology, the expansion of IoT devices, a shift toward advanced packaging, increasing complexity in semiconductor designs, demand for high-performance computing, efforts to enhance supply chain resilience and security, and investments in green technology. Major trends include the integration of AI in manufacturing, the development of new semiconductor materials, a focus on wafer-level packaging, advancements in metrology and inspection techniques, the adoption of Industry 4 in fabrication facilities, and the growth of equipment leasing models.
The rapid deployment of 5G technology is anticipated to drive growth in the semiconductor capital equipment market. As the fifth generation of mobile network technology, 5G offers significantly faster data speeds, lower latency, and enhanced connectivity compared to previous generations. The increasing demand for 5G is driven by its capability to support high-speed data processing and low latency, which are critical for emerging applications such as autonomous vehicles, smart cities, and augmented reality. Semiconductor capital equipment plays a vital role in the deployment of 5G technology, as it facilitates the production of advanced chips and components necessary for high-speed data processing and communication infrastructure. For example, in March 2024, 5G Americas reported that global 5G connections reached 1.76 billion by the end of 2023, reflecting a 66% year-over-year increase with an additional 700 million connections. The growth is expected to continue at an accelerated pace, with forecasts predicting 7.9 billion 5G connections by 2028. This rapid expansion in 5G technology is driving the semiconductor capital equipment market.
Leading companies in the semiconductor capital equipment sector are focusing on heterogeneous chip integration and system-level packaging, such as hybrid bonding, to improve performance, functionality, and meet the demand for advanced semiconductor solutions. Hybrid bonding involves creating a direct bond between chip surfaces, typically using a combination of metallic and insulating layers. For instance, in July 2023, Applied Materials, a US-based semiconductor equipment provider, introduced new materials, technologies, and systems designed to assist chipmakers in integrating chiplets into advanced 2.5D and 3D packages through hybrid bonding and through-silicon vias (TSVs). These innovations expand Applied's technology portfolio for heterogeneous integration (HI), which allows the combination of chiplets with different functions, technology nodes, and sizes into a single package. This approach addresses challenges in high-performance computing and artificial intelligence, offering a strategic solution as traditional 2D transistor scaling becomes increasingly costly and less effective. HI enhances chip performance, power efficiency, area cost, and time to market (PPACt).
In October 2021, Yield Engineering Systems, Inc., a US-based provider of process engineering equipment, acquired the semiconductor capital equipment business of Kanthal AB for an undisclosed amount. This acquisition aims to enhance YES’s capabilities in semiconductor thermal processing by incorporating Kanthal's high-temperature furnace technology and LPCVD processes into its product portfolio. Kanthal AB, based in Sweden, is a provider of heating technology specializing in semiconductor capital equipment for industrial applications.
Major companies operating in the semiconductor capital equipment market are Applied Materials Inc., ASML Holding N.V., Lam Research Corporation, Tokyo Electron Limited, KLA Corporation, United Microelectronics Corporation, Microchip Technology Inc., Semiconductor Manufacturing International Corporation (SMIC, Nikon Corporation, Hitachi High-Technologies Corporation, Advantest Corporation, MKS Instruments Inc., Teradyne Inc., Screen Holdings Co. Ltd., Bruker Corporation, ASM International N.V., DISCO Corporation, Kulicke & Soffa Industries Inc., Edwards Vacuum, Cohu Inc., Veeco Instruments Inc., Rudolph Technologies Inc., Mattson Technology Inc., BE Semiconductor Industries N.V. (BESI), Aixtron SE.
North America was the largest region in the semiconductor capital equipment market in 2023. The regions covered in the semiconductor capital equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the semiconductor capital equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Semiconductor capital equipment refers to the specialized machinery and tools used in the manufacturing of semiconductor devices and integrated circuits. This equipment is crucial for various stages of semiconductor production, including wafer fabrication, assembly, and testing.
The main types of semiconductor capital equipment are wafer manufacturing equipment, assembly and packaging equipment, test equipment, and others. Wafer manufacturing equipment is used to produce the foundational silicon wafers for microchips, involving processes such as crystal growth, slicing, and polishing. Applications include wafer processing, surface conditioning, chemical mechanical planarization, chemical vapor deposition, as well as assembly and packaging. These technologies serve industries such as consumer electronics, healthcare, automotive, information technology (IT), and telecommunications.
The semiconductor capital equipment market research report is one of a series of new reports that provides semiconductor capital equipment market statistics, including semiconductor capital equipment industry global market size, regional shares, competitors with an semiconductor capital equipment market share, detailed semiconductor capital equipment market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor capital equipment industry. This semiconductor capital equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The semiconductor capital equipment market consists of sales of inspection and metrology equipment, chemical mechanical planarization (CMP) equipment, and deposition equipment. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
Table of Contents
1. Executive Summary2. Semiconductor Capital Equipment Market Characteristics3. Semiconductor Capital Equipment Market Trends and Strategies32. Global Semiconductor Capital Equipment Market Competitive Benchmarking33. Global Semiconductor Capital Equipment Market Competitive Dashboard34. Key Mergers and Acquisitions in the Semiconductor Capital Equipment Market
4. Semiconductor Capital Equipment Market - Macro Economic Scenario
5. Global Semiconductor Capital Equipment Market Size and Growth
6. Semiconductor Capital Equipment Market Segmentation
7. Semiconductor Capital Equipment Market Regional and Country Analysis
8. Asia-Pacific Semiconductor Capital Equipment Market
9. China Semiconductor Capital Equipment Market
10. India Semiconductor Capital Equipment Market
11. Japan Semiconductor Capital Equipment Market
12. Australia Semiconductor Capital Equipment Market
13. Indonesia Semiconductor Capital Equipment Market
14. South Korea Semiconductor Capital Equipment Market
15. Western Europe Semiconductor Capital Equipment Market
16. UK Semiconductor Capital Equipment Market
17. Germany Semiconductor Capital Equipment Market
18. France Semiconductor Capital Equipment Market
19. Italy Semiconductor Capital Equipment Market
20. Spain Semiconductor Capital Equipment Market
21. Eastern Europe Semiconductor Capital Equipment Market
22. Russia Semiconductor Capital Equipment Market
23. North America Semiconductor Capital Equipment Market
24. USA Semiconductor Capital Equipment Market
25. Canada Semiconductor Capital Equipment Market
26. South America Semiconductor Capital Equipment Market
27. Brazil Semiconductor Capital Equipment Market
28. Middle East Semiconductor Capital Equipment Market
29. Africa Semiconductor Capital Equipment Market
30. Semiconductor Capital Equipment Market Competitive Landscape and Company Profiles
31. Semiconductor Capital Equipment Market Other Major and Innovative Companies
35. Semiconductor Capital Equipment Market Future Outlook and Potential Analysis
36. Appendix
Executive Summary
Semiconductor Capital Equipment Global Market Report 2024 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on semiconductor capital equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for semiconductor capital equipment? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The semiconductor capital equipment market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include:
- The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.
- The impact of higher inflation in many countries and the resulting spike in interest rates.
- The continued but declining impact of COVID-19 on supply chains and consumption patterns.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Scope
Markets Covered:
1) By Type: Wafer Manufacturing Equipment; Assembly And Packaging Equipment; Test Equipment; Other Types2) By Application: Wafer Processing; Surface Conditioning; Chemical Mechanical Planarization; Chemical Vapor Deposition; Assembly And Packaging
3) By Industry: Consumer Electronics; Healthcare; Automotive; Information Technology (IT) And Telecommunication; Other Industries
Key Companies Mentioned: Applied Materials Inc.; ASML Holding N.V.; Lam Research Corporation; Tokyo Electron Limited; KLA Corporation
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: PDF, Word and Excel Data Dashboard.
Companies Mentioned
Some of the major companies profiled in this Semiconductor Capital Equipment market report include:- Applied Materials Inc.
- ASML Holding N.V.
- Lam Research Corporation
- Tokyo Electron Limited
- KLA Corporation
- United Microelectronics Corporation
- Microchip Technology Inc.
- Semiconductor Manufacturing International Corporation (SMIC
- Nikon Corporation
- Hitachi High-Technologies Corporation
- Advantest Corporation
- MKS Instruments Inc.
- Teradyne Inc.
- Screen Holdings Co. Ltd.
- Bruker Corporation
- ASM International N.V.
- DISCO Corporation
- Kulicke & Soffa Industries Inc.
- Edwards Vacuum
- Cohu Inc.
- Veeco Instruments Inc.
- Rudolph Technologies Inc.
- Mattson Technology Inc.
- BE Semiconductor Industries N.V. (BESI)
- Aixtron SE
Methodology
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Table Information
Report Attribute | Details |
---|---|
No. of Pages | 175 |
Published | November 2024 |
Forecast Period | 2024 - 2028 |
Estimated Market Value ( USD | $ 82.86 Billion |
Forecasted Market Value ( USD | $ 115.27 Billion |
Compound Annual Growth Rate | 8.6% |
Regions Covered | Global |
No. of Companies Mentioned | 26 |