The semiconductor capital equipment market size is expected to see strong growth in the next few years. It will grow to $130.84 billion in 2030 at a compound annual growth rate (CAGR) of 8.1%. The growth in the forecast period can be attributed to growth of AI and high performance computing, expansion of electric vehicle semiconductor demand, increasing adoption of advanced packaging technologies, rising investments in domestic semiconductor manufacturing, continued miniaturization of semiconductor nodes. Major trends in the forecast period include increasing adoption of advanced wafer fabrication equipment, rising demand for high precision lithography and etching tools, growing investment in automated assembly and packaging systems, expansion of advanced process control and metrology solutions, increasing focus on yield optimization and defect reduction.
The rapid deployment of 5G technology is anticipated to support the expansion of the semiconductor capital equipment market in the coming years. 5G technology represents the fifth generation of mobile network technology, delivering significantly faster data speeds, reduced latency, and improved connectivity compared to previous generations. Demand for 5G is rising due to its ability to support applications such as autonomous vehicles, smart cities, and augmented reality, all of which require high-speed data processing and low-latency communication. Semiconductor capital equipment plays a vital role in enabling 5G deployment by supporting the production of advanced chips and components essential for high-speed communication infrastructure. For example, in March 2024, 5G Americas, a US-based industry trade association, reported that global 5G connections reached 1.76 billion by the end of 2023, reflecting a 66% year-over-year increase with 700 million new connections added. Forecasts indicate this number will rise to 7.9 billion by 2028. Therefore, the rapid rollout of 5G technology is fueling growth in the semiconductor capital equipment market.
Major companies in the semiconductor capital equipment market are increasingly adopting heterogeneous chip integration and system-level packaging approaches, such as hybrid bonding, to boost performance, expand functionality, and meet rising demand for advanced, energy-efficient semiconductor solutions. Hybrid bonding links semiconductor chips by creating a direct bond between their surfaces, typically involving metallic and insulating layers. For example, in July 2023, Applied Materials, a US-based semiconductor equipment provider, introduced new materials, technologies, and systems that support chipmakers in integrating chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). These developments strengthen the company’s portfolio for heterogeneous integration (HI). HI enables semiconductor manufacturers to combine chiplets with different functions, technology nodes, and sizes into a unified, high-performing package. This method helps address industry challenges posed by the growing need for transistors in high-performance computing and artificial intelligence. As traditional 2D transistor scaling becomes more costly and less effective, HI presents a strategic path to improving chip performance, power efficiency, area cost, and time-to-market (PPACt).
In November 2025, Ardian Semiconductor, a Germany-based private equity investor specializing in semiconductor companies, acquired Centrotherm International AG for an undisclosed amount. This acquisition aims to broaden Ardian Semiconductor’s equipment portfolio and strengthen its role in the European power-semiconductor value chain through improved innovation capabilities and operational scaling. Centrotherm International AG is a Germany-based manufacturer focused on the design and production of power semiconductor manufacturing equipment.
Major companies operating in the semiconductor capital equipment market are Applied Materials, Inc., ASML Holding N.V., Lam Research Corporation, Tokyo Electron Limited, KLA Corporation, Nikon Corporation, Hitachi High-Technologies Corporation, Advantest Corporation, MKS Instruments, Inc., Teradyne, Inc., SCREEN Holdings Co., Ltd., Bruker Corporation, ASM International N.V., DISCO Corporation, Kulicke and Soffa Industries, Inc., Edwards Vacuum LLC, Cohu, Inc., Veeco Instruments, Inc., Rudolph Technologies, Inc., Mattson Technology, Inc., BE Semiconductor Industries N.V., AIXTRON SE.
North America was the largest region in the semiconductor capital equipment market in 2025. The regions covered in the semiconductor capital equipment market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the semiconductor capital equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The semiconductor capital equipment market consists of sales of inspection and metrology equipment, chemical mechanical planarization (CMP) equipment, and deposition equipment. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Semiconductor Capital Equipment Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses semiconductor capital equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for semiconductor capital equipment? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The semiconductor capital equipment market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Report Scope
Markets Covered:
1) By Type: Wafer Manufacturing Equipment; Assembly and Packaging Equipment; Test Equipment; Other Types2) By Application: Wafer Processing; Surface Conditioning; Assembly and Packaging
3) By Industry: Consumer Electronics; Healthcare; Automotive; Information Technology (IT) and Telecommunication; Other Industries
Subsegments:
1) By Wafer Manufacturing Equipment: Photolithography Equipment; Etching Equipment; Deposition Equipment; Ion Implantation Equipment; Chemical Mechanical Planarization (CMP) Equipment; Cleaning Equipment2) By Assembly and Packaging Equipment: Die Bonders; Wire Bonders; Pick and Place Equipment; Packaging Materials and Tools; Testing and Inspection Equipment
3) By Test Equipment: Wafer Test Equipment; Final Test Equipment; Automated Test Equipment (ATE); Test Handlers
4) By Other Types: Mask or Etch Lithography Equipment; Thin Film Deposition Equipment; Sputtering Equipment; Process Control and Metrology Equipment
Companies Mentioned: Applied Materials, Inc.; ASML Holding N.V.; Lam Research Corporation; Tokyo Electron Limited; KLA Corporation; Nikon Corporation; Hitachi High-Technologies Corporation; Advantest Corporation; MKS Instruments, Inc.; Teradyne, Inc.; SCREEN Holdings Co., Ltd.; Bruker Corporation; ASM International N.V.; DISCO Corporation; Kulicke and Soffa Industries, Inc.; Edwards Vacuum LLC; Cohu, Inc.; Veeco Instruments, Inc.; Rudolph Technologies, Inc.; Mattson Technology, Inc.; BE Semiconductor Industries N.V.; AIXTRON SE
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Semiconductor Capital Equipment market report include:- Applied Materials, Inc.
- ASML Holding N.V.
- Lam Research Corporation
- Tokyo Electron Limited
- KLA Corporation
- Nikon Corporation
- Hitachi High-Technologies Corporation
- Advantest Corporation
- MKS Instruments, Inc.
- Teradyne, Inc.
- SCREEN Holdings Co., Ltd.
- Bruker Corporation
- ASM International N.V.
- DISCO Corporation
- Kulicke and Soffa Industries, Inc.
- Edwards Vacuum LLC
- Cohu, Inc.
- Veeco Instruments, Inc.
- Rudolph Technologies, Inc.
- Mattson Technology, Inc.
- BE Semiconductor Industries N.V.
- AIXTRON SE
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 95.84 Billion |
| Forecasted Market Value ( USD | $ 130.84 Billion |
| Compound Annual Growth Rate | 8.1% |
| Regions Covered | Global |
| No. of Companies Mentioned | 23 |
