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Asia-Pacific Embedded Computing Market Size, Share & Trends Analysis Report By Component, By End User, By Country and Growth Forecast, 2024 - 2031

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    Report

  • 145 Pages
  • November 2024
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6029244
The Asia Pacific Embedded Computing Market is expected to witness market growth of 9.4% CAGR during the forecast period (2024-2031).

The China market dominated the Asia Pacific Embedded Computing Market by Country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $6.72 billion by 2031. The Japan market is registering a CAGR of 8.7% during 2024-2031. Additionally, the India market is expected to showcase a CAGR of 10.1% during 2024-2031.

The telecommunications industry is another significant adopter of these technologies. From base stations to routers, communication devices rely on embedded systems to manage network traffic, encryption, and connectivity. With the advent of 5G networks, embedded systems in telecommunications infrastructure have become even more important in supporting the demands for higher bandwidth, lower latency, and faster data transfer rates.

The adoption of this has been on the rise, driven by technological advancements, the need for smarter systems, and the continued growth of IoT. One of the key drivers of their adoption has been the continuous miniaturization of components. Modern embedded systems are smaller, more powerful, and more cost-effective than ever, making them suitable for a wider range of applications.

The telecommunications sector in China has long been a significant driver of technological innovation, but recent developments highlight the increasingly central role of emerging technologies. Sectors such as big data, cloud computing, and IoT have been the key contributors to this growth, with the sector's overall revenue from these emerging domains climbing by an impressive 19.1% in 2023.

India’s automotive industry is profoundly transforming toward smart manufacturing, electric vehicles (EVs), autonomous driving technology, and connected vehicles. As these trends gain momentum, embedded computing solutions are becoming crucial to enabling the advanced functionalities required in modern vehicles. Therefore, the rising telecommunication sector and increasing automotive industry in the region drive the market's growth.

List of Key Companies Profiled

  • Fujitsu Limited
  • Intel Corporation
  • IBM Corporation
  • HCL Technologies Ltd.
  • Microsoft Corporation
  • Qualcomm Incorporated (Qualcomm Technologies, Inc.)
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • NXP Semiconductors N.V.

Market Report Segmentation

By Component

  • Software
  • Hardware
  • Microcontroller (MCU)
  • Microprocessor (MPU)
  • Digital Signal Processor (DSP)
  • Other Hardware Type

By End User

  • Consumer Electronics
  • Communications
  • Industrial
  • Automotive
  • Healthcare
  • Energy
  • Other End User

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Embedded Computing Market, by Component
1.4.2 Asia Pacific Embedded Computing Market, by End User
1.4.3 Asia Pacific Embedded Computing Market, by Country
1.5 Methodology for the Research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 The Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2023
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2020-2024)
4.4.2 Key Strategic Move: (Partnerships, Collaborations & Agreements: 2020, May - 2024, Nov) Leading Players
4.5 Porter Five Forces Analysis
Chapter 5. Asia Pacific Embedded Computing Market by Component
5.1 Asia Pacific Software Market by Country
5.2 Asia Pacific Hardware Market by Country
5.3 Asia Pacific Embedded Computing Market by Hardware Type
5.3.1 Asia Pacific Microcontroller (MCU) Market by Country
5.3.2 Asia Pacific Microprocessor (MPU) Market by Country
5.3.3 Asia Pacific Digital Signal Processor (DSP) Market by Country
5.3.4 Asia Pacific Other Hardware Type Market by Country
Chapter 6. Asia Pacific Embedded Computing Market by End User
6.1 Asia Pacific Consumer Electronics Market by Country
6.2 Asia Pacific Communications Market by Country
6.3 Asia Pacific Industrial Market by Country
6.4 Asia Pacific Automotive Market by Country
6.5 Asia Pacific Healthcare Market by Country
6.6 Asia Pacific Energy Market by Country
6.7 Asia Pacific Other End User Market by Country
Chapter 7. Asia Pacific Embedded Computing Market by Country
7.1 China Embedded Computing Market
7.1.1 China Embedded Computing Market by Component
7.1.1.1 China Embedded Computing Market by Hardware Type
7.1.2 China Embedded Computing Market by End User
7.2 Japan Embedded Computing Market
7.2.1 Japan Embedded Computing Market by Component
7.2.1.1 Japan Embedded Computing Market by Hardware Type
7.2.2 Japan Embedded Computing Market by End User
7.3 India Embedded Computing Market
7.3.1 India Embedded Computing Market by Component
7.3.1.1 India Embedded Computing Market by Hardware Type
7.3.2 India Embedded Computing Market by End User
7.4 South Korea Embedded Computing Market
7.4.1 South Korea Embedded Computing Market by Component
7.4.1.1 South Korea Embedded Computing Market by Hardware Type
7.4.2 South Korea Embedded Computing Market by End User
7.5 Singapore Embedded Computing Market
7.5.1 Singapore Embedded Computing Market by Component
7.5.1.1 Singapore Embedded Computing Market by Hardware Type
7.5.2 Singapore Embedded Computing Market by End User
7.6 Malaysia Embedded Computing Market
7.6.1 Malaysia Embedded Computing Market by Component
7.6.1.1 Malaysia Embedded Computing Market by Hardware Type
7.6.2 Malaysia Embedded Computing Market by End User
7.7 Rest of Asia Pacific Embedded Computing Market
7.7.1 Rest of Asia Pacific Embedded Computing Market by Component
7.7.1.1 Rest of Asia Pacific Embedded Computing Market by Hardware Type
7.7.2 Rest of Asia Pacific Embedded Computing Market by End User
Chapter 8. Company Profiles
8.1 Fujitsu Limited
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expenses
8.1.5 Recent Strategies and Developments
8.1.5.1 Partnerships, Collaborations, and Agreements
8.1.6 SWOT Analysis
8.2 Intel Corporation
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expenses
8.2.5 Recent Strategies and Developments
8.2.5.1 Partnerships, Collaborations, and Agreements
8.2.5.2 Product Launches and Product Expansions
8.2.6 SWOT Analysis
8.3 IBM Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional & Segmental Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent Strategies and Developments
8.3.5.1 Partnerships, Collaborations, and Agreements
8.3.6 SWOT Analysis
8.4 HCL Technologies Ltd. (HCL Enterprises)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 SWOT Analysis
8.5 Microsoft Corporation
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 Recent Strategies and Developments
8.5.5.1 Partnerships, Collaborations, and Agreements
8.5.6 SWOT Analysis
8.6 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent Strategies and Developments
8.6.5.1 Partnerships, Collaborations, and Agreements
8.6.5.2 Product Launches and Product Expansions
8.6.5.3 Acquisition and Mergers
8.6.6 SWOT Analysis
8.7 Renesas Electronics Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 Recent Strategies and Developments
8.7.5.1 Partnerships, Collaborations, and Agreements
8.7.5.2 Product Launches and Product Expansions
8.7.6 SWOT Analysis
8.8 STMicroelectronics N.V.
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expenses
8.8.5 SWOT Analysis
8.9 Texas Instruments, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 SWOT Analysis
8.10. NXP Semiconductors N.V.
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Regional Analysis
8.10.4 Research & Development Expenses
8.10.5 SWOT Analysis

Companies Mentioned

  • Fujitsu Limited
  • Intel Corporation
  • IBM Corporation
  • HCL Technologies Ltd.
  • Microsoft Corporation
  • Qualcomm Incorporated (Qualcomm Technologies, Inc.)
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • NXP Semiconductors N.V.

Methodology

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