This Semiconductor Plating System market report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
The semiconductor plating system market size has grown strongly in recent years. It will grow from $5.21 billion in 2023 to $5.51 billion in 2024 at a compound annual growth rate (CAGR) of 5.9%. The growth during the historic period can be attributed to several factors such as the rise in electric vehicles, increased capital expenditure in the semiconductor industry, expansion of cloud computing services, growth in telecommunications infrastructure, and the rise in renewable energy.
The semiconductor plating system market size is expected to see strong growth in the next few years. It will grow to $6.99 billion in 2028 at a compound annual growth rate (CAGR) of 6.1%. The projected growth during the forecast period can be attributed to several factors such as the rising production of electric vehicles, the expanding development of data centers, growing demand for advanced semiconductor devices, increased focus on sustainable and green semiconductor manufacturing, and a higher demand for semiconductors overall. Key trends expected in the forecast period include technological advancements, the adoption of advanced packaging technologies, the proliferation of 5G-enabled devices, the growth of Internet of Things (IoT) devices, and the advancement of wearable technology.
The growing adoption of electric vehicles is expected to drive the expansion of the semiconductor plating system market. Electric vehicles are automobiles powered either fully or partially by electricity stored in rechargeable batteries, rather than by internal combustion engines. This shift is driven by increasing environmental awareness, government incentives, advancements in battery technology, and rising consumer demand for sustainable transportation solutions. Semiconductor plating systems are essential in electric vehicles for enhancing power management, battery control, and electronic systems by applying precise metal coatings to semiconductor components, which improves their conductivity, reliability, and performance. For example, in March 2023, the International Energy Agency, a France-based intergovernmental organization, reported that the electric car market saw exponential growth in 2022, with sales exceeding 10 million units and electric vehicles making up 14% of all new car sales, up from approximately 9% in 2021. This growth in electric vehicle adoption is driving the semiconductor plating system market.
Key companies in the semiconductor plating system market are focusing on developing innovative technologies, such as dripless technology, to enhance the selective plating process and make it more environmentally friendly. Dripless technology is a plating process innovation that eliminates chemical drips and reduces waste by efficiently recycling solutions throughout the system. For instance, in June 2022, SIFCO ASC., a US-based provider of contract anodizing and selective electroplating services, introduced the Advanced Solution Control System, a portable plating equipment designed to improve the selective electroplating process. This system incorporates dripless technology, which effectively maintains and recycles chemical solutions, reducing waste and exposure. The ASCS enhances automation, improving operating efficiency and safety by minimizing manual intervention and reducing the risk of chemical spills and emissions. It is available in two models, Nano and Prime, each catering to different complexity levels and plating needs, making it suitable for various industrial applications.
In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired Semsysco GmbH for an undisclosed amount. This acquisition aims to enhance Lam Research's semiconductor plating and surface processing capabilities, expand its portfolio of advanced deposition solutions, strengthen its market position, and provide more comprehensive solutions to meet the evolving needs of semiconductor manufacturers. Semsysco GmbH is an Austria-based company specializing in high-precision electroplating and electroless plating systems.
Major companies operating in the semiconductor plating system market are Applied Materials Inc., Solvay SA, Tokyo Electron Limited, Lam Research Corporation, Hitachi High-Tech Corporation, JBT Corporation, ACM Research Inc., Hitachi Kokusai Electric Inc., Atotech, JCU International Inc., Ishihara Chemical Co. Ltd., RENA Technologies GmbH, Singulus Technologies AG, Intevac Inc., Akrion Technologies Inc., Semsysco GmbH, Magneto Special Anodes GmbH, Raschig GmbH, Moses Lake Industries Inc., Yamato Denki Co. Ltd., Mitomo Semicon Engineering Co. Ltd., XiLong Scientific Co. Ltd., Meltex Inc.
Asia-Pacific was the largest region in the semiconductor plating system market in 2023. North America is expected to be the fastest-growing region in the forecast period. The regions covered in the semiconductor plating system market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the semiconductor plating system market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
A semiconductor plating system is a technology used in semiconductor manufacturing to deposit thin layers of metal or other materials onto semiconductor wafers. These systems are essential for creating electrical connections, improving the performance and reliability of semiconductor devices, and ensuring the proper functioning of integrated circuits and electronic components.
The primary types of semiconductor plating systems include fully automatic, semi-automatic, and manual. Fully automatic systems are designed for high-volume production with minimal human intervention, ensuring both efficiency and consistency. Wafer sizes are categorized into up to 100 mm, 100 mm to 200 mm, and above 200 mm. The technologies employed in these systems include electroplating and electroless plating. Applications of semiconductor plating systems include through silicon via (TSV), copper pillar, redistribution layer (RDL), under bump metallization (UBM), bumping, and others.
The semiconductor plating system market research report is one of a series of new reports that provides semiconductor plating system market statistics, including semiconductor plating system industry global market size, regional shares, competitors with a semiconductor plating system market share, detailed semiconductor plating system market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor plating system industry. This semiconductor plating system market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The semiconductor plating system market consists of metal deposition chambers, photoresist coatings, plating masks, and post-processing equipment. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
The semiconductor plating system market size has grown strongly in recent years. It will grow from $5.21 billion in 2023 to $5.51 billion in 2024 at a compound annual growth rate (CAGR) of 5.9%. The growth during the historic period can be attributed to several factors such as the rise in electric vehicles, increased capital expenditure in the semiconductor industry, expansion of cloud computing services, growth in telecommunications infrastructure, and the rise in renewable energy.
The semiconductor plating system market size is expected to see strong growth in the next few years. It will grow to $6.99 billion in 2028 at a compound annual growth rate (CAGR) of 6.1%. The projected growth during the forecast period can be attributed to several factors such as the rising production of electric vehicles, the expanding development of data centers, growing demand for advanced semiconductor devices, increased focus on sustainable and green semiconductor manufacturing, and a higher demand for semiconductors overall. Key trends expected in the forecast period include technological advancements, the adoption of advanced packaging technologies, the proliferation of 5G-enabled devices, the growth of Internet of Things (IoT) devices, and the advancement of wearable technology.
The growing adoption of electric vehicles is expected to drive the expansion of the semiconductor plating system market. Electric vehicles are automobiles powered either fully or partially by electricity stored in rechargeable batteries, rather than by internal combustion engines. This shift is driven by increasing environmental awareness, government incentives, advancements in battery technology, and rising consumer demand for sustainable transportation solutions. Semiconductor plating systems are essential in electric vehicles for enhancing power management, battery control, and electronic systems by applying precise metal coatings to semiconductor components, which improves their conductivity, reliability, and performance. For example, in March 2023, the International Energy Agency, a France-based intergovernmental organization, reported that the electric car market saw exponential growth in 2022, with sales exceeding 10 million units and electric vehicles making up 14% of all new car sales, up from approximately 9% in 2021. This growth in electric vehicle adoption is driving the semiconductor plating system market.
Key companies in the semiconductor plating system market are focusing on developing innovative technologies, such as dripless technology, to enhance the selective plating process and make it more environmentally friendly. Dripless technology is a plating process innovation that eliminates chemical drips and reduces waste by efficiently recycling solutions throughout the system. For instance, in June 2022, SIFCO ASC., a US-based provider of contract anodizing and selective electroplating services, introduced the Advanced Solution Control System, a portable plating equipment designed to improve the selective electroplating process. This system incorporates dripless technology, which effectively maintains and recycles chemical solutions, reducing waste and exposure. The ASCS enhances automation, improving operating efficiency and safety by minimizing manual intervention and reducing the risk of chemical spills and emissions. It is available in two models, Nano and Prime, each catering to different complexity levels and plating needs, making it suitable for various industrial applications.
In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired Semsysco GmbH for an undisclosed amount. This acquisition aims to enhance Lam Research's semiconductor plating and surface processing capabilities, expand its portfolio of advanced deposition solutions, strengthen its market position, and provide more comprehensive solutions to meet the evolving needs of semiconductor manufacturers. Semsysco GmbH is an Austria-based company specializing in high-precision electroplating and electroless plating systems.
Major companies operating in the semiconductor plating system market are Applied Materials Inc., Solvay SA, Tokyo Electron Limited, Lam Research Corporation, Hitachi High-Tech Corporation, JBT Corporation, ACM Research Inc., Hitachi Kokusai Electric Inc., Atotech, JCU International Inc., Ishihara Chemical Co. Ltd., RENA Technologies GmbH, Singulus Technologies AG, Intevac Inc., Akrion Technologies Inc., Semsysco GmbH, Magneto Special Anodes GmbH, Raschig GmbH, Moses Lake Industries Inc., Yamato Denki Co. Ltd., Mitomo Semicon Engineering Co. Ltd., XiLong Scientific Co. Ltd., Meltex Inc.
Asia-Pacific was the largest region in the semiconductor plating system market in 2023. North America is expected to be the fastest-growing region in the forecast period. The regions covered in the semiconductor plating system market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the semiconductor plating system market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
A semiconductor plating system is a technology used in semiconductor manufacturing to deposit thin layers of metal or other materials onto semiconductor wafers. These systems are essential for creating electrical connections, improving the performance and reliability of semiconductor devices, and ensuring the proper functioning of integrated circuits and electronic components.
The primary types of semiconductor plating systems include fully automatic, semi-automatic, and manual. Fully automatic systems are designed for high-volume production with minimal human intervention, ensuring both efficiency and consistency. Wafer sizes are categorized into up to 100 mm, 100 mm to 200 mm, and above 200 mm. The technologies employed in these systems include electroplating and electroless plating. Applications of semiconductor plating systems include through silicon via (TSV), copper pillar, redistribution layer (RDL), under bump metallization (UBM), bumping, and others.
The semiconductor plating system market research report is one of a series of new reports that provides semiconductor plating system market statistics, including semiconductor plating system industry global market size, regional shares, competitors with a semiconductor plating system market share, detailed semiconductor plating system market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor plating system industry. This semiconductor plating system market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The semiconductor plating system market consists of metal deposition chambers, photoresist coatings, plating masks, and post-processing equipment. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
Table of Contents
1. Executive Summary2. Semiconductor Plating System Market Characteristics3. Semiconductor Plating System Market Trends and Strategies32. Global Semiconductor Plating System Market Competitive Benchmarking33. Global Semiconductor Plating System Market Competitive Dashboard34. Key Mergers and Acquisitions in the Semiconductor Plating System Market
4. Semiconductor Plating System Market - Macro Economic Scenario
5. Global Semiconductor Plating System Market Size and Growth
6. Semiconductor Plating System Market Segmentation
100 Mm to 200 Mm
7. Semiconductor Plating System Market Regional and Country Analysis
8. Asia-Pacific Semiconductor Plating System Market
9. China Semiconductor Plating System Market
10. India Semiconductor Plating System Market
11. Japan Semiconductor Plating System Market
12. Australia Semiconductor Plating System Market
13. Indonesia Semiconductor Plating System Market
14. South Korea Semiconductor Plating System Market
15. Western Europe Semiconductor Plating System Market
16. UK Semiconductor Plating System Market
17. Germany Semiconductor Plating System Market
18. France Semiconductor Plating System Market
19. Italy Semiconductor Plating System Market
20. Spain Semiconductor Plating System Market
21. Eastern Europe Semiconductor Plating System Market
22. Russia Semiconductor Plating System Market
23. North America Semiconductor Plating System Market
24. USA Semiconductor Plating System Market
25. Canada Semiconductor Plating System Market
26. South America Semiconductor Plating System Market
27. Brazil Semiconductor Plating System Market
28. Middle East Semiconductor Plating System Market
29. Africa Semiconductor Plating System Market
30. Semiconductor Plating System Market Competitive Landscape and Company Profiles
31. Semiconductor Plating System Market Other Major and Innovative Companies
35. Semiconductor Plating System Market Future Outlook and Potential Analysis
36. Appendix
Executive Summary
Semiconductor Plating System Global Market Report 2024 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on semiconductor plating system market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for semiconductor plating system? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The semiconductor plating system market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include:
- The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.
- The impact of higher inflation in many countries and the resulting spike in interest rates.
- The continued but declining impact of COVID-19 on supply chains and consumption patterns.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Scope
Markets Covered:
1) By Type: Fully Automatic; Semi-Automatic; Manual2) By Wafer Size: Up To 100 mm; 100 mm To 200 mm; Above 200 mm
3) By Technology: Electroplating; Electroless
4) By Applications: Through Silicon Via (TSV); Copper Pillar; Redistribution Layer (RDL); Under Bump Metallization (UBM); Bumping; Other Applications
Key Companies Mentioned: Applied Materials Inc.; Solvay SA; Tokyo Electron Limited; Lam Research Corporation; Hitachi High-Tech Corporation
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: PDF, Word and Excel Data Dashboard.
Companies Mentioned
The major companies profiled in this Semiconductor Plating System market report include:- Applied Materials Inc.
- Solvay SA
- Tokyo Electron Limited
- Lam Research Corporation
- Hitachi High-Tech Corporation
- JBT Corporation
- ACM Research Inc.
- Hitachi Kokusai Electric Inc.
- Atotech
- JCU International Inc.
- Ishihara Chemical Co. Ltd.
- RENA Technologies GmbH
- Singulus Technologies AG
- Intevac Inc.
- Akrion Technologies Inc.
- Semsysco GmbH
- Magneto Special Anodes GmbH
- Raschig GmbH
- Moses Lake Industries Inc.
- Yamato Denki Co. Ltd.
- Mitomo Semicon Engineering Co. Ltd.
- XiLong Scientific Co. Ltd.
- Meltex Inc.
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 175 |
| Published | December 2024 |
| Forecast Period | 2024 - 2028 |
| Estimated Market Value ( USD | $ 5.51 Billion |
| Forecasted Market Value ( USD | $ 6.99 Billion |
| Compound Annual Growth Rate | 6.1% |
| Regions Covered | Global |
| No. of Companies Mentioned | 24 |
