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The Global Chiplets Market

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    Report

  • 84 Pages
  • December 2024
  • Region: Global
  • BCC Research
  • ID: 6035991
Description Jump to:
The Global Chiplets Market was valued at USD 5.3 Billion in 2024, and is expected to reach USD 42.8 Billion by 2029, rising at a CAGR of 41.90%.

This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.

The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024-2029.

Report Includes

  • In-depth assessment of the global market for semiconductor chiplets
  • Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
  • Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
  • Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
  • Analysis of the industry structure, including companies’ market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
  • Company profiles

Table of Contents

Chapter 1 Executive Summary
  • Market Outlook
  • Scope of the Report
  • Market Summary
Chapter 2 Market Overview
  • Overview
  • Macroeconomic Factors
  • Advanced Packaging Technologies
  • Geopolitical Tensions
  • Outlook
Chapter 3 Market Dynamics
  • Overview
  • Market Drivers
  • High-Performance Computing
  • 5G's Growing Need for Chiplets
  • Market Restraints/Challenges
  • Shortage of Skilled Labor
  • Global Political and Financial Crises
  • Market Opportunities
  • Continuing Investment in the Semiconductor Industry
  • Use in Advanced Driver-Assistance Systems (ADAS)
Chapter 4 Regulatory Landscape
  • Overview
  • North America
  • Asia-Pacific
  • Europe
  • RoW
Chapter 5 Emerging Technologies
  • Emerging Technologies
  • Heterogeneous Integration
  • 3D Integration
  • Advanced Packaging
  • Co-Packaged Optics
  • Chiplet-Based Systems-on-Chip
Chapter 6 Market Segmentation Analysis
  • Segmentation Breakdown
  • Market Breakdown by Processor
  • CPUs
  • Graphics Processing Units
  • Field-Programmable Gate Arrays
  • AI-ASIC Coprocessors
  • Application Processing Units
  • Market Breakdown by Packaging Technology
  • 2.5D/3D
  • System-in-Package
  • Wafer-Level Chip-Scale Packaging
  • Flip Chip Chip-Scale Package
  • Flip Chip Ball Grid Array
  • Fan-Out
  • Market Breakdown by End-User Industry
  • Enterprise Electronics
  • Consumer Electronics
  • Industrial Automation
  • Automotive
  • Healthcare
  • Military and Aerospace
  • Other End-User Industries
  • Geographical Breakdown
  • Market Breakdown by Region
  • North America
  • Europe
  • Asia-Pacific
  • Rest of the World
Chapter 7 Competitive Landscape
  • Market Ecosystem Analysis
  • Analysis of Leading Companies
  • Strategic Analysis
  • Recent Developments
Chapter 8 AppendixResearch MethodologyReferencesAbbreviations
Company Profiles
  • ACHRONIX SEMICONDUCTOR CORP.
  • ADVANCED MICRO DEVICES INC.
  • BROADCOM
  • GLOBALFOUNDRIES INC.
  • IBM CORP.
  • INTEL CORP.
  • NVIDIA CORP.
  • RANOVUS
  • SAMSUNG
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
List of Tables
Summary Table: Global Market for Chiplets, by Region, Through 2029
Table 1: Global Market for Chiplets, by Processor, Through 2029
Table 2: Global Market for Chiplets, by Packaging Technology, Through 2029
Table 3: Global Market for Chiplets, by End-User Industry, Through 2029
Table 4: Global Market for Chiplets, by Region, Through 2029
Table 5: North American Market for Chiplets, by Country, Through 2029
Table 6: North American Market for Chiplets, by Processor, Through 2029
Table 7: North American Market for Chiplets, by Packaging Technology, Through 2029
Table 8: North American Market for Chiplets, by End-User Industry, Through 2029
Table 9: European Market for Chiplets, by Country, Through 2029
Table 10: European Market for Chiplets, by Processor, Through 2029
Table 11: European Market for Chiplets, by Packaging Technology, Through 2029
Table 12: European Market for Chiplets, by End-User Industry, Through 2029
Table 13: Asia-Pacific Market for Chiplets, by Country, Through 2029
Table 14: Asia-Pacific Market for Chiplets, by Processor, Through 2029
Table 15: Asia-Pacific Market for Chiplets, by Packaging Technology, Through 2029
Table 16: Asia-Pacific Market for Chiplets, by End-User Industry, Through 2029
Table 17: RoW Market for Chiplets, by Country, Through 2029
Table 18: RoW Market for Chiplets, by Processor, Through 2029
Table 19: RoW Market for Chiplets, by Packaging Technology, Through 2029
Table 20: RoW Market for Chiplets, by End-User Industry, Through 2029
Table 21: Recent Developments Related to Chiplets, 2022-2024
Table 22: Report Information Sources
Table 23: Abbreviations Used in the Report
Table 24: Achronix Semiconductor Corp.: Company Snapshot
Table 25: Achronix Semiconductor Corp.: Product Portfolio
Table 26: Achronix Semiconductor Corp.: News/Key Developments, 2023 and 2024
Table 27: Advanced Micro Devices Inc.: Company Snapshot
Table 28: Advanced Micro Devices Inc.: Financial Performance, FY 2022 and 2023
Table 29: Advanced Micro Devices Inc.: Product Portfolio
Table 30: Advanced Micro Devices Inc.: News/Key Developments, 2022 and 2023
Table 31: Broadcom: Company Snapshot
Table 32: Broadcom: Financial Performance, FY 2022 and 2023
Table 33: Broadcom: Product Portfolio
Table 34: Broadcom: News/Key Developments, 2022 and 2023
Table 35: GlobalFoundries Inc.: Company Snapshot
Table 36: GlobalFoundries Inc.: Financial Performance, FY 2022 and 2023
Table 37: GlobalFoundries Inc.: Product Portfolio
Table 38: GlobalFoundries Inc.: News/Key Developments, 2022-2024
Table 39: IBM Corp.: Company Snapshot
Table 40: IBM Corp.: Financial Performance, FY 2022 and 2023
Table 41: IBM Corp.: Product Portfolio
Table 42: IBM Corp.: News/Key Developments, 2024
Table 43: Intel Corp.: Company Snapshot
Table 44: Intel Corp.: Financial Performance, FY 2022 and 2023
Table 45: Intel Corp.: Product Portfolio
Table 46: Intel Corp.: News/Key Developments, 2022
Table 47: NVIDIA Corp.: Company Snapshot
Table 48: NVIDIA Corp.: Financial Performance, FY 2022 and 2023
Table 49: NVIDIA Corp.: Product Portfolio
Table 50: NVIDIA Corp.: News/Key Developments, 2022-2024
Table 51: RANOVUS: Company Snapshot
Table 52: RANOVUS: Product Portfolio
Table 53: Samsung: Company Snapshot
Table 54: Samsung: Financial Performance, FY 2022 and 2023
Table 55: Samsung: Product Portfolio
Table 56: Samsung: News/Key Developments, 2024
Table 57: Taiwan Semiconductor Manufacturing Co. Ltd.: Company Snapshot
Table 58: Taiwan Semiconductor Manufacturing Co. Ltd.: Financial Performance, FY 2022 and 2023
Table 59: Taiwan Semiconductor Manufacturing Co. Ltd.: Product Portfolio
Table 60: Taiwan Semiconductor Manufacturing Co. Ltd.: News/Key Developments, 2022
List of Figures
Summary Figure: Global Market Shares of Chiplets, by Region, 2023
Figure 1: Market Dynamics for the Chiplet Industry
Figure 2: Emerging Chiplet Technologies
Figure 3: Global Market Shares of Chiplets, by Processor, 2023
Figure 4: Global Market Shares of Chiplets, by Packaging Technology, 2023
Figure 5: Global Market Shares of Chiplets, by End-User Industry, 2023
Figure 6: Global Market Shares of Chiplets, by Region, 2023
Figure 7: Global Chiplet Ecosystem
Figure 8: Advanced Micro Devices Inc.: Revenue Share, by Business Unit, FY 2023
Figure 9: Advanced Micro Devices Inc.: Revenue Share, by Region, FY 2023
Figure 10: Broadcom: Revenue Share, by Business Unit, FY 2023
Figure 11: Broadcom: Revenue Share, by Region, FY 2023
Figure 12: GlobalFoundries Inc.: Revenue Share, by Country/Region, FY 2023
Figure 13: IBM Corp.: Revenue Share, by Business Unit, FY 2023
Figure 14: IBM Corp.: Revenue Share, by Region, FY 2023
Figure 15: Intel Corp.: Revenue Share, by Business Unit, FY 2023
Figure 16: Intel Corp.: Revenue Share, by Region, FY 2023
Figure 17: NVIDIA Corp.: Revenue Share, by Business Unit, FY 2023
Figure 18: NVIDIA Corp.: Revenue Share, by Region, FY 2023
Figure 19: Samsung: Revenue Share, by Business Unit, FY 2023
Figure 20: Samsung: Revenue Share, by Country/Region, FY 2023
Figure 21: Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Business Unit, FY 2023
Figure 22: Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Region, FY 2023

Companies Mentioned

  • ACHRONIX SEMICONDUCTOR CORP.
  • ADVANCED MICRO DEVICES INC.
  • BROADCOM
  • GLOBALFOUNDRIES INC.
  • IBM CORP.
  • INTEL CORP.
  • NVIDIA CORP.
  • RANOVUS
  • SAMSUNG
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

Table Information

Report AttributeDetails
No. of Pages84
PublishedDecember 2024
Forecast Period2024 - 2029
Estimated Market Value ( USD ) in 2024 $ 5.3 Billion
Forecasted Market Value ( USD ) by 2029 $ 42.8 Billion
Compound Annual Growth Rate41.9%
Regions CoveredGlobal
No. of Companies Mentioned10

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