The Global Market for Sustainable Electronics and Semiconductor Manufacturing 2025-2035

1.1 Sustainable electronics & semiconductor manufacturing
1.2 Drivers for sustainable electronics
1.3 Environmental Impacts of Electronics Manufacturing
1.3.1 E-Waste Generation
1.3.2 Carbon Emissions
1.3.3 Resource Utilization
1.3.4 Waste Minimization
1.3.5 Supply Chain Impacts
1.4 New opportunities from sustainable electronics
1.5 Regulations
1.5.1 Certifications
1.6 Powering sustainable electronics (Bio-based batteries)
1.7 Bioplastics in injection moulded electronics parts

2.1 Conventional electronics manufacturing
2.2 Benefits of Sustainable Electronics manufacturing
2.3 Challenges in adopting Sustainable Electronics manufacturing
2.4 Approaches
2.4.1 Closed-Loop Manufacturing
2.4.2 Digital Manufacturing
2.4.2.1 Advanced robotics & automation
2.4.2.2 AI & machine learning analytics
2.4.2.3 Internet of Things (IoT)
2.4.2.4 Additive manufacturing
2.4.2.5 Virtual prototyping
2.4.2.6 Blockchain-enabled supply chain traceability
2.4.3 Renewable Energy Usage
2.4.4 Energy Efficiency
2.4.5 Materials Efficiency
2.4.6 Sustainable Chemistry
2.4.7 Recycled Materials
2.4.7.1 Advanced chemical recycling
2.4.8 Bio-Based Materials
2.5 Greening the Supply Chain
2.5.1 Key focus areas
2.5.2 Sustainability activities from major electronics brands
2.5.3 Key challenges
2.5.4 Use of digital technologies

3.1 Conventional PCB manufacturing
3.2 Trends in PCBs
3.2.1 High-Speed PCBs
3.2.2 Flexible PCBs
3.2.3 3D Printed PCBs
3.2.4 Sustainable PCBs
3.3 Reconciling sustainability with performance
3.4 Sustainable supply chains
3.5 Sustainability in PCB manufacturing
3.5.1 Sustainable cleaning of PCBs
3.6 Design of PCBs for sustainability
3.6.1 Rigid
3.6.2 Flexible
3.6.3 Additive manufacturing
3.6.4 In-mold elctronics (IME)
3.7 Materials
3.7.1 Low-energy epoxy resins
3.7.2 Metal cores
3.7.3 Recycled laminates
3.7.4 Conductive inks
3.7.5 Green and lead-free solder
3.7.6 Biodegradable substrates
3.7.6.1 Bacterial Cellulose
3.7.6.2 Mycelium
3.7.6.3 Lignin
3.7.6.4 Cellulose Nanofibers
3.7.6.5 Soy Protein
3.7.6.6 Algae
3.7.6.7 PHAs
3.7.7 Biobased inks
3.8 Substrates
3.8.1 Halogen-free FR4
3.8.1.1 FR4 limitations
3.8.1.2 FR4 alternatives
3.8.1.3 Bio-Polyimide
3.8.2 Glass substrates
3.8.3 Ceramic substrates
3.8.4 Metal-core PCBs
3.8.5 Biobased PCBs
3.8.5.1 Polylactic acid
3.8.5.2 Lignin-based Polymers
3.8.5.3 Cellulose Composites
3.8.5.4 Polyhydroxyalkanoates (PHA)
3.8.5.5 Starch Blends
3.8.5.6 Challenges
3.8.5.7 Flexible (bio) polyimide PCBs
3.8.5.8 Recent commercial activity
3.8.6 Paper-based PCBs
3.8.7 PCBs without solder mask
3.8.8 Thinner dielectrics
3.8.9 Recycled plastic substrates
3.8.10 Flexible substrates
3.8.11 Polyimide alternatives
3.9 Sustainable patterning and metallization in electronics manufacturing
3.9.1 Introduction
3.9.2 Issues with sustainability
3.9.3 Regeneration and reuse of etching chemicals
3.9.4 Transition from Wet to Dry phase patterning
3.9.5 Print-and-plate
3.9.6 Approaches
3.9.6.1 Direct Printed Electronics
3.9.6.2 Photonic Sintering
3.9.6.3 Biometallization
3.9.6.4 Plating Resist Alternatives
3.9.6.5 Laser-Induced Forward Transfer
3.9.6.6 Electrohydrodynamic Printing
3.9.6.7 Electrically conductive adhesives (ECAs
3.9.6.8 Green electroless plating
3.9.6.9 Smart Masking
3.9.6.10 Component Integration
3.9.6.11 Bio-inspired material deposition
3.9.6.12 Multi-material jetting
3.9.6.13 Vacuumless deposition
3.9.6.14 Upcycling waste streams
3.10 Sustainable attachment and integration of components
3.10.1 Conventional component attachment materials
3.10.2 Materials
3.10.2.1 Conductive adhesives
3.10.2.2 Biodegradable adhesives
3.10.2.3 Magnets
3.10.2.4 Bio-based solders
3.10.2.5 Bio-derived solders
3.10.2.6 Recycled plastics
3.10.2.7 Nano adhesives
3.10.2.8 Shape memory polymers
3.10.2.9 Photo-reversible polymers
3.10.2.10 Conductive biopolymers
3.10.3 Processes
3.10.3.1 Traditional thermal processing methods
3.10.3.2 Low temperature solder
3.10.3.3 Reflow soldering
3.10.3.4 Induction soldering
3.10.3.5 UV curing
3.10.3.6 Near-infrared (NIR) radiation curing
3.10.3.7 Photonic sintering/curing
3.10.3.8 Hybrid integration

4.1 IC manufacturing
4.2 Sustainable IC manufacturing
4.3 Wafer production
4.3.1 Silicon
4.3.2 Gallium nitride ICs
4.3.3 Flexible ICs
4.3.4 Fully printed organic ICs
4.4 Oxidation methods
4.4.1 Sustainable oxidation
4.4.2 Metal oxides
4.4.3 Recycling
4.4.4 Thin gate oxide layers
4.4.5 Substrate Oxidation
4.4.6 Solution-Based Manufacturing
4.4.7 MOSFET Transistors
4.4.8 Silicon on Insulator (SOI) and Manufacturing
4.5 Patterning and doping
4.5.1 Processes
4.5.1.1 Wet etching
4.5.1.2 Dry plasma etching
4.5.1.3 Lift-off patterning
4.5.1.4 Surface doping
4.5.2 Photolithography
4.5.3 Green solvents and chemicals
4.6 Metallization
4.6.1 Evaporation
4.6.2 Plating
4.6.3 Printing
4.6.3.1 Printed metal gates for organic thin film transistors
4.6.4 Physical vapour deposition (PVD)
4.7 Packaging
4.7.1 Sustainable Semiconductor Packaging Technologies
4.7.2 Glass interposer technology
4.8 Water management
4.8.1 Overview
4.8.2 Ultra pure water (UPW)
4.8.3 Semiconductor manufacturing water consumption
4.8.4 Water Reuse

5.1 Legislation
5.2 Hazardous waste
5.3 Emissions
5.4 Water Usage

6.1 Mechanical recycling
6.2 Electro-Mechanical Separation
6.3 Chemical Recycling
6.4 Electrochemical Processes
6.5 Thermal Recycling
6.6 Green Certification
6.7 PCB recycling
6.7.1 Overview
6.7.2 Metal recovery from PCB manufacturing
6.7.3 Recyclable PCBs
6.7.4 Excess electronic component inventory management
6.7.5 Electronic waste management and reuse

7.1 Overview
7.1.1 Data center sustainability
7.1.2 Carbon reductions
7.1.3 Data center decarbonization
7.1.4 Data center company sustainability activities
7.2 Green Energy
7.2.1 Data centers power consumption
7.2.2 Microgrids
7.2.3 Energy storage systems
7.2.4 Solar
7.2.5 Wind power
7.2.6 Geothermal
7.2.7 Nuclear
7.2.7.1 Large-scale nuclear reactors
7.2.7.2 Small modular reactors (SMRs)
7.2.7.3 Nuclear fusion
7.2.8 Fuel cells
7.2.8.1 PEMFCs and SOFCs
7.2.9 Batteries
7.2.9.1 UPS battery technologies
7.2.9.2 BESS (Battery Energy Storage Systems)
7.3 Improved Energy Efficiency
7.3.1 Thermal efficiency
7.3.2 IT efficiency
7.3.3 Electrical efficiency
7.4 Carbon credits and CO2 offsetting
7.4.1 CO2 emissions of data centers
7.4.2 Carbon dioxide removal technology
7.4.3 Low-carbon construction
7.4.3.1 Green concrete
7.4.3.2 Green Steel
7.5 Companies

8.1 Global PCB manufacturing industry
8.1.1 PCB revenues
8.2 Sustainable PCBs
8.3 Sustainable ICs

10.1 Objectives of This Report

Table 1. Sustainability Index Benchmarking
Table 2. Key factors driving adoption of green electronics
Table 3. Key circular economy strategies for electronics
Table 4. Regulations pertaining to sustainable electronics
Table 5. Companies developing bio-based batteries for application in sustainable electronics
Table 6. Benefits of Green Electronics Manufacturing
Table 7. Challenges in adopting Sustainable Electronics manufacturing
Table 8. Major chipmakers' renewable energy road maps
Table 9. Energy efficiency in sustainable electronics manufacturing
Table 10. Recycling and Reuse Initiatives in Sustainable Electronics
Table 11. Composition of plastic waste streams
Table 12. Comparison of mechanical and advanced chemical recycling
Table 13. Example chemically recycled plastic products
Table 14. Bio-based and non-toxic materials in sustainable electronics
Table 15. Key focus areas for enabling greener and ethically responsible electronics supply chains
Table 16. Sustainability programs and disclosure from major electronics brands
Table 17. PCB manufacturing process
Table 18. Challenges in PCB manufacturing
Table 19. 3D PCB manufacturing
Table 20. Comparison of some sustainable PCB alternatives against conventional options in terms of key performance factors
Table 21. Sustainable PCB supply chain
Table 22. Key areas where the PCB industry can improve sustainability
Table 23. PCB Design Options and Sustainability
Table 24. Improving sustainability of PCB design
Table 25. PCB design options for sustainability
Table 26. Sustainability benefits and challenges associated with 3D printing
Table 27. Conductive ink producers
Table 28. Green and lead-free solder companies
Table 29. Biodegradable substrates for PCBs
Table 30. Overview of mycelium fibers-description, properties, drawbacks and applications
Table 31. Application of lignin in composites
Table 32. Properties of lignins and their applications
Table 33. Properties of flexible electronics-cellulose nanofiber film (nanopaper)
Table 34. Companies developing cellulose nanofibers for electronics
Table 35. Commercially available PHAs
Table 36. Main limitations of the FR4 material system used for manufacturing printed circuit boards (PCBs)
Table 37. Halogen-free FR4 companies
Table 38. Bioplastics for PCBs
Table 39. Properties of biobased PCBs
Table 40. Applications of flexible (bio) polyimide PCBs
Table 41. Sustainability in Patterning and Metallization Processes
Table 42. Main patterning and metallization steps in PCB fabrication and sustainable options
Table 43. Sustainability issues with conventional metallization processes
Table 44. Benefits of print-and-plate
Table 45. Sustainable alternative options to standard plating resists used in printed circuit board (PCB) fabrication
Table 46. Applications for laser induced forward transfer
Table 47. Copper versus silver inks in laser-induced forward transfer (LIFT) for electronics fabrication
Table 48. Approaches for in-situ oxidation prevention
Table 49. Market readiness and maturity of different lead-free solders and electrically conductive adhesives (ECAs) for electronics manufacturing
Table 50. Advantages of green electroless plating
Table 51. Sustainability for Patterning and Metallization Materials
Table 52. Comparison of component attachment materials
Table 53. Comparison between sustainable and conventional component attachment materials for printed circuit boards
Table 54. Comparison between the SMAs and SMPs
Table 55. Comparison of conductive biopolymers versus conventional materials for printed circuit board fabrication
Table 56. Comparison of curing and reflow processes used for attaching components in electronics assembly
Table 57. Low temperature solder alloys
Table 58. Thermally sensitive substrate materials
Table 59. Limitations of existing IC production
Table 60. Strategies for improving sustainability in integrated circuit (IC) manufacturing
Table 61. Comparison of oxidation methods and level of sustainability
Table 62. Sustainability Index for the Oxidation Processes
Table 63. Stage of commercialization for oxides
Table 64. Sustainable Oxidation Process Comparison
Table 65. Wet and Dry Thermal Oxidation Comparison
Table 66. Alternative doping techniques
Table 67. Sustainability Index for Patterning
Table 68. Sustainability Index for Metallization
Table 69. Sustainability Index for Interconnection Techniques
Table 70. Organic Substrates
Table 71. UPW Specifications and Monitoring Methods
Table 72. Water Management Techniques
Table 73. UPW Upgrades and Reuse
Table 74. Water Management Companies
Table 75. Metal content mg / Kg in Printed Circuit Boards (PCBs) from waste desktop computers
Table 76. Chemical recycling methods for handling electronic waste
Table 77. Electrochemical processes for recycling metals from electronic waste
Table 78. Thermal recycling processes for electronic waste
Table 79. Critical Semiconductor Materials and Recycling
Table 80. Waste Reduction Techniques
Table 81. Data Center Sustainability Metrics
Table 82. Data Center CO2 Emissions
Table 83. Total Carbon Emissions Breakdown
Table 84. Global Data Center Hyperscalers
Table 85. PUE and CUE metrics
Table 86. Data Center Equipment Sustainability
Table 87. Data center companies sustainability activity
Table 88. Power sources for data centers
Table 89. Benchmarking electricity sources
Table 90. Decarbonization of Power
Table 91 Renewable Energy Activities of Hyperscalers
Table 92. Cost Comparison of Renewable Sources
Table 93. Solar energy in data centers
Table 94. Approaches to Wind-Powered Data Centers
Table 95. Power Efficiency and Wind Turbine Models
Table 96. Enhanced Geothermal Systems
Table 97. Geothermal Power for Data Centers
Table 98. SMR Projects
Table 99. Fuel Cells for Data Centers
Table 100. Battery Applications in Data Centers
Table 101. Companies in Grid-scale Li-ion BESS
Table 102. System Power Consumption and Metrics
Table 103. Cooling Methods Overview
Table 104. Power Demand
Table 105. Power Forecast 2013-2035
Table 106. Carbon Emissions by Type
Table 107. GHG Emissions - Storage
Table 108. CDR Credit Prices
Table 109. Carbon credits Price range
Table 110. Cement Decarbonization Technologies
Table 111. Decarbonization Technologies for Steel
Table 112. Global Data Center Lifecycle CO2e Forecast
Table 113. Carbon-Free Energy Savings Forecast for Data Centers
Table 114. Carbon Credits Forecast to 2035
Table 115. Companies in sustainability for data centers
Table 116. Global PCB revenues 2018-2035 (billions USD), by substrate types
Table 117. Global sustainable PCB revenues 2018-2035, by type (millions USD)
Table 118. Global sustainable ICs revenues 2018-2035, by type (millions USD)
Table 119. Oji Holdings CNF products

Figure 1. Closed-loop manufacturing
Figure 2. Sustainable supply chain for electronics
Figure 3. Flexible PCB
Figure 4. Vapor degreasing
Figure 5. Multi-layered PCB
Figure 6. 3D printed PCB
Figure 7. In-mold electronics prototype devices and products
Figure 8. Silver nanocomposite ink after sintering and resin bonding of discrete electronic components
Figure 9. Typical structure of mycelium-based foam
Figure 10. Flexible electronic substrate made from CNF
Figure 11. CNF composite
Figure 12. Oji CNF transparent sheets
Figure 13. Electronic components using cellulose nanofibers as insulating materials
Figure 14. BLOOM masterbatch from Algix
Figure 15. Dell's Concept Luna laptop
Figure 16. Direct-write, precision dispensing, and 3D printing platform for 3D printed electronics
Figure 17. 3D printed circuit boards from Nano Dimension
Figure 18. Photonic sintering
Figure 19. Laser-induced forward transfer (LIFT)
Figure 20. Material jetting 3d printing
Figure 21. Material jetting 3d printing product
Figure 22. The molecular mechanism of the shape memory effect under different stimuli
Figure 23. Supercooled Soldering™ Technology
Figure 24. Reflow soldering schematic
Figure 25. Schematic diagram of induction heating reflow
Figure 26. Fully-printed organic thin-film transistors and circuitry on one-micron-thick polymer films
Figure 27. Types of PCBs after dismantling waste computers and monitors
Figure 28. Global PCB revenues 2018-2035 (billions USD), by substrate types
Figure 29. Global sustainable PCB revenues 2018-2035, by type (millions USD)
Figure 30. Global sustainable ICs revenues 2018-2035, by type (millions USD)
Figure 31. Piezotech® FC
Figure 32. PowerCoat® paper
Figure 33. BeFC® biofuel cell and digital platform
Figure 34. DPP-360 machine
Figure 35. P-Flex® Flexible Circuit
Figure 36. Fairphone 4
Figure 37. In2tec’s fully recyclable flexible circuit board assembly
Figure 38. C.L.A.D. system
Figure 39. Soluboard immersed in water
Figure 40. Infineon PCB before and after immersion
Figure 41. Nano OPS Nanoscale wafer printing system
Figure 42. PulpaTronics' paper RFID tag
Figure 43. Stora Enso lignin battery materials
Figure 44. 3D printed electronics
Figure 45. Tactotek IME device
Figure 46. TactoTek® IMSE® SiP - System In Package
Figure 47. Eco-friendly NFC tag label (left) and paper-based antenna substrate (right)
Figure 48. Illustration of the layer structures of an NFC tag label using PET film as the antenna substrate (left) and Toppan’s new eco-friendly NFC tag label using a paper-based substrate (right)
Figure 49. Verde Bio-based resins