The North America Multilayer Printed Circuit Board Market is expected to witness market growth of 4.5% CAGR during the forecast period (2024-2031).
The US market dominated the North America Multilayer Printed Circuit Board Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $19.75 billion by 2031. The Canada market is experiencing a CAGR of 6.6% during 2024-2031. Additionally, the Mexico market is expected to exhibit a CAGR of 5.9% during 2024-2031.
A Multilayer Printed Circuit Board (PCB) is a sophisticated type of PCB that consists of multiple layers of conductive material (usually copper) separated by insulating layers (often made of materials like fiberglass or resin). These layers are stacked and laminated under high pressure and temperature to form a cohesive structure. Unlike single-layer or double-layer PCBs, multilayer PCBs are designed to handle more complex circuits, enabling the integration of multiple functionalities in a compact form.
The ever-growing demand for smaller and more efficient electronic devices is a major driving force behind adopting multilayer PCBs. Consumers increasingly prefer compact and lightweight gadgets that do not compromise on performance. This trend has prompted manufacturers to develop multilayer PCBs that house intricate, high-density circuitry within limited spaces. Smartphones, tablets, laptops, and wearable devices are prime products that rely heavily on multilayer PCBs for enhanced performance and functionality. Multilayer PCBs have revolutionized modern electronics design and manufacturing processes by facilitating the integration of multiple components in a confined area.
The U.S. government’s strong support for domestic manufacturing significantly bolsters the market. For example, the CHIPS for America Act funds the development of semiconductor and PCB fabrication facilities nationwide, fostering advanced manufacturing capabilities. The National Institute of Standards and Technology (NIST) extended its funding initiatives through June 2023, inviting proposals for manufacturing facilities with capital costs exceeding $300 million. These measures highlight the growing need for robust multilayer PCBs to optimize electronic system performance and meet escalating market demands. Consequently, North America remains a lucrative and rapidly growing region for the market throughout the forecast period.
The US market dominated the North America Multilayer Printed Circuit Board Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $19.75 billion by 2031. The Canada market is experiencing a CAGR of 6.6% during 2024-2031. Additionally, the Mexico market is expected to exhibit a CAGR of 5.9% during 2024-2031.
A Multilayer Printed Circuit Board (PCB) is a sophisticated type of PCB that consists of multiple layers of conductive material (usually copper) separated by insulating layers (often made of materials like fiberglass or resin). These layers are stacked and laminated under high pressure and temperature to form a cohesive structure. Unlike single-layer or double-layer PCBs, multilayer PCBs are designed to handle more complex circuits, enabling the integration of multiple functionalities in a compact form.
The ever-growing demand for smaller and more efficient electronic devices is a major driving force behind adopting multilayer PCBs. Consumers increasingly prefer compact and lightweight gadgets that do not compromise on performance. This trend has prompted manufacturers to develop multilayer PCBs that house intricate, high-density circuitry within limited spaces. Smartphones, tablets, laptops, and wearable devices are prime products that rely heavily on multilayer PCBs for enhanced performance and functionality. Multilayer PCBs have revolutionized modern electronics design and manufacturing processes by facilitating the integration of multiple components in a confined area.
The U.S. government’s strong support for domestic manufacturing significantly bolsters the market. For example, the CHIPS for America Act funds the development of semiconductor and PCB fabrication facilities nationwide, fostering advanced manufacturing capabilities. The National Institute of Standards and Technology (NIST) extended its funding initiatives through June 2023, inviting proposals for manufacturing facilities with capital costs exceeding $300 million. These measures highlight the growing need for robust multilayer PCBs to optimize electronic system performance and meet escalating market demands. Consequently, North America remains a lucrative and rapidly growing region for the market throughout the forecast period.
List of Key Companies Profiled
- TTM Technologies, Inc.
- Fujikura Ltd.
- Flex Ltd.
- Jabil, Inc.
- Plexus Corporation
- Benchmark Electronics, Inc.
- Creation Technologies LP
- Sierra Circuits, Inc.
- Epec LLC
- Molex, LLC (Koch Industries, Inc.)
Market Report Segmentation
By Layer
- Layer 4 to 6
- Layer 6 & Above
By Substrate
- Rigid
- Flexible
- Rigid-Flex
By End Use Industry
- Consumer Electronics
- Industrial Electronics
- IT & Telecom
- Automotive
- Healthcare
- Aerospace & Defense
- Other End Use Industry
By Country
- US
- Canada
- Mexico
- Rest of North America
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. North America Multilayer Printed Circuit Board Market by Layer
Chapter 6. North America Multilayer Printed Circuit Board Market by Substrate
Chapter 7. North America Multilayer Printed Circuit Board Market by End Use Industry
Chapter 8. North America Multilayer Printed Circuit Board Market by Country
Chapter 9. Company Profiles
Companies Mentioned
- TTM Technologies, Inc.
- Fujikura Ltd.
- Flex Ltd.
- Jabil, Inc.
- Plexus Corporation
- Benchmark Electronics, Inc.
- Creation Technologies LP
- Sierra Circuits, Inc.
- Epec LLC
- Molex, LLC (Koch Industries, Inc.)
Methodology
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