The Europe Multilayer Printed Circuit Board Market is expected to witness market growth of 4.8% CAGR during the forecast period (2024-2031).
The Germany market dominated the Europe Multilayer Printed Circuit Board Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $5.78 billion by 2031. The UK market is exhibiting a CAGR of 3.9% during 2024-2031. Additionally, the France market is expected to experience a CAGR of 5.7% during 2024-2031.
The advent of 5G networks has significantly boosted the demand for high-performance multilayer PCBs in the telecommunications sector. These networks require advanced equipment capable of handling high-frequency signals and massive data transmission, tasks that are well-supported by the intricate designs of multilayer PCBs. Base stations, routers, and network servers depend on these PCBs for their ability to provide seamless connectivity and support the massive data processing requirements of next-generation networks. The rollout of 5G and the increasing reliance on high-speed internet connectivity have positioned multilayer PCBs as critical components of telecommunications infrastructure.
Multilayer PCBs are essential in aerospace, defense, and healthcare industries due to their durability and reliability in harsh environments. In aerospace, these PCBs are used in systems like navigation, avionics, and satellites, where they endure extreme temperature fluctuations and vibrations. For instance, SpaceX and Boeing incorporate high-temperature-resistant multilayer PCBs into their spacecraft and aircraft to ensure consistent performance in challenging conditions. Similarly, the defense sector relies on rugged multilayer PCBs for applications such as radar systems, communication devices, and drones, where they withstand intense vibrations, shock, and electromagnetic interference. Equipment like military drones, designed for prolonged missions, depends on these advanced PCBs to maintain stability and functionality.
Italy’s increasing adoption of industrial automation and its focus on sustainable technologies drive demand for multilayer PCBs. Government programs under the National Recovery and Resilience Plan (NRRP) allocate substantial funding for digitization and green energy projects, creating opportunities for PCB applications in renewable energy systems and smart factories. The country’s strong manufacturing base, combined with its efforts to modernize infrastructure and integrate digital technologies, ensures steady growth in PCB demand across various industrial applications. These trends, combined with strategic initiatives like the European Chips Act, position Europe as a growing force in the market, aligning with the region’s broader goals of technological leadership and sustainability.
The Germany market dominated the Europe Multilayer Printed Circuit Board Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $5.78 billion by 2031. The UK market is exhibiting a CAGR of 3.9% during 2024-2031. Additionally, the France market is expected to experience a CAGR of 5.7% during 2024-2031.
The advent of 5G networks has significantly boosted the demand for high-performance multilayer PCBs in the telecommunications sector. These networks require advanced equipment capable of handling high-frequency signals and massive data transmission, tasks that are well-supported by the intricate designs of multilayer PCBs. Base stations, routers, and network servers depend on these PCBs for their ability to provide seamless connectivity and support the massive data processing requirements of next-generation networks. The rollout of 5G and the increasing reliance on high-speed internet connectivity have positioned multilayer PCBs as critical components of telecommunications infrastructure.
Multilayer PCBs are essential in aerospace, defense, and healthcare industries due to their durability and reliability in harsh environments. In aerospace, these PCBs are used in systems like navigation, avionics, and satellites, where they endure extreme temperature fluctuations and vibrations. For instance, SpaceX and Boeing incorporate high-temperature-resistant multilayer PCBs into their spacecraft and aircraft to ensure consistent performance in challenging conditions. Similarly, the defense sector relies on rugged multilayer PCBs for applications such as radar systems, communication devices, and drones, where they withstand intense vibrations, shock, and electromagnetic interference. Equipment like military drones, designed for prolonged missions, depends on these advanced PCBs to maintain stability and functionality.
Italy’s increasing adoption of industrial automation and its focus on sustainable technologies drive demand for multilayer PCBs. Government programs under the National Recovery and Resilience Plan (NRRP) allocate substantial funding for digitization and green energy projects, creating opportunities for PCB applications in renewable energy systems and smart factories. The country’s strong manufacturing base, combined with its efforts to modernize infrastructure and integrate digital technologies, ensures steady growth in PCB demand across various industrial applications. These trends, combined with strategic initiatives like the European Chips Act, position Europe as a growing force in the market, aligning with the region’s broader goals of technological leadership and sustainability.
List of Key Companies Profiled
- TTM Technologies, Inc.
- Fujikura Ltd.
- Flex Ltd.
- Jabil, Inc.
- Plexus Corporation
- Benchmark Electronics, Inc.
- Creation Technologies LP
- Sierra Circuits, Inc.
- Epec LLC
- Molex, LLC (Koch Industries, Inc.)
Market Report Segmentation
By Layer
- Layer 4 to 6
- Layer 6 & Above
By Substrate
- Rigid
- Flexible
- Rigid-Flex
By End Use Industry
- Consumer Electronics
- Industrial Electronics
- IT & Telecom
- Automotive
- Healthcare
- Aerospace & Defense
- Other End Use Industry
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. Europe Multilayer Printed Circuit Board Market by Layer
Chapter 6. Europe Multilayer Printed Circuit Board Market by Substrate
Chapter 7. Europe Multilayer Printed Circuit Board Market by End Use Industry
Chapter 8. Europe Multilayer Printed Circuit Board Market by Country
Chapter 9. Company Profiles
Companies Mentioned
- TTM Technologies, Inc.
- Fujikura Ltd.
- Flex Ltd.
- Jabil, Inc.
- Plexus Corporation
- Benchmark Electronics, Inc.
- Creation Technologies LP
- Sierra Circuits, Inc.
- Epec LLC
- Molex, LLC (Koch Industries, Inc.)
Methodology
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