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Europe Multilayer Printed Circuit Board Market Size, Share & Trends Analysis Report By Layer (Layer 4 to 6, and Layer 6 & Above), By Substrate (Rigid, Flexible, and Rigid-Flex), By End Use Industry, By Country and Growth Forecast, 2024 - 2031

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    Report

  • 119 Pages
  • January 2025
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6053227
The Europe Multilayer Printed Circuit Board Market is expected to witness market growth of 4.8% CAGR during the forecast period (2024-2031).

The Germany market dominated the Europe Multilayer Printed Circuit Board Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $5.78 billion by 2031. The UK market is exhibiting a CAGR of 3.9% during 2024-2031. Additionally, the France market is expected to experience a CAGR of 5.7% during 2024-2031.



The advent of 5G networks has significantly boosted the demand for high-performance multilayer PCBs in the telecommunications sector. These networks require advanced equipment capable of handling high-frequency signals and massive data transmission, tasks that are well-supported by the intricate designs of multilayer PCBs. Base stations, routers, and network servers depend on these PCBs for their ability to provide seamless connectivity and support the massive data processing requirements of next-generation networks. The rollout of 5G and the increasing reliance on high-speed internet connectivity have positioned multilayer PCBs as critical components of telecommunications infrastructure.

Multilayer PCBs are essential in aerospace, defense, and healthcare industries due to their durability and reliability in harsh environments. In aerospace, these PCBs are used in systems like navigation, avionics, and satellites, where they endure extreme temperature fluctuations and vibrations. For instance, SpaceX and Boeing incorporate high-temperature-resistant multilayer PCBs into their spacecraft and aircraft to ensure consistent performance in challenging conditions. Similarly, the defense sector relies on rugged multilayer PCBs for applications such as radar systems, communication devices, and drones, where they withstand intense vibrations, shock, and electromagnetic interference. Equipment like military drones, designed for prolonged missions, depends on these advanced PCBs to maintain stability and functionality.

Italy’s increasing adoption of industrial automation and its focus on sustainable technologies drive demand for multilayer PCBs. Government programs under the National Recovery and Resilience Plan (NRRP) allocate substantial funding for digitization and green energy projects, creating opportunities for PCB applications in renewable energy systems and smart factories. The country’s strong manufacturing base, combined with its efforts to modernize infrastructure and integrate digital technologies, ensures steady growth in PCB demand across various industrial applications. These trends, combined with strategic initiatives like the European Chips Act, position Europe as a growing force in the market, aligning with the region’s broader goals of technological leadership and sustainability.

List of Key Companies Profiled

  • TTM Technologies, Inc.
  • Fujikura Ltd.
  • Flex Ltd.
  • Jabil, Inc.
  • Plexus Corporation
  • Benchmark Electronics, Inc.
  • Creation Technologies LP
  • Sierra Circuits, Inc. 
  • Epec LLC
  • Molex, LLC (Koch Industries, Inc.)

Market Report Segmentation

By Layer

  • Layer 4 to 6
  • Layer 6 & Above

By Substrate

  • Rigid
  • Flexible
  • Rigid-Flex

By End Use Industry

  • Consumer Electronics
  • Industrial Electronics
  • IT & Telecom
  • Automotive
  • Healthcare
  • Aerospace & Defense
  • Other End Use Industry

By Country

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Multilayer Printed Circuit Board Market, by Layer
1.4.2 Europe Multilayer Printed Circuit Board Market, by Substrate
1.4.3 Europe Multilayer Printed Circuit Board Market, by End Use Industry
1.4.4 Europe Multilayer Printed Circuit Board Market, by Country
1.5 Methodology for the Research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2023
4.2 Porter Five Forces Analysis
Chapter 5. Europe Multilayer Printed Circuit Board Market by Layer
5.1 Europe Layer 4 to 6 Market by Country
5.2 Europe Layer 6 & Above Market by Country
Chapter 6. Europe Multilayer Printed Circuit Board Market by Substrate
6.1 Europe Rigid Market by Country
6.2 Europe Flexible Market by Country
6.3 Europe Rigid-Flex Market by Country
Chapter 7. Europe Multilayer Printed Circuit Board Market by End Use Industry
7.1 Europe Consumer Electronics Market by Country
7.2 Europe Industrial Electronics Market by Country
7.3 Europe IT & Telecom Market by Country
7.4 Europe Automotive Market by Country
7.5 Europe Healthcare Market by Country
7.6 Europe Aerospace & Defense Market by Country
7.7 Europe Other End Use Industry Market by Country
Chapter 8. Europe Multilayer Printed Circuit Board Market by Country
8.1 Germany Multilayer Printed Circuit Board Market
8.1.1 Germany Multilayer Printed Circuit Board Market by Layer
8.1.2 Germany Multilayer Printed Circuit Board Market by Substrate
8.1.3 Germany Multilayer Printed Circuit Board Market by End Use Industry
8.2 UK Multilayer Printed Circuit Board Market
8.2.1 UK Multilayer Printed Circuit Board Market by Layer
8.2.2 UK Multilayer Printed Circuit Board Market by Substrate
8.2.3 UK Multilayer Printed Circuit Board Market by End Use Industry
8.3 France Multilayer Printed Circuit Board Market
8.3.1 France Multilayer Printed Circuit Board Market by Layer
8.3.2 France Multilayer Printed Circuit Board Market by Substrate
8.3.3 France Multilayer Printed Circuit Board Market by End Use Industry
8.4 Russia Multilayer Printed Circuit Board Market
8.4.1 Russia Multilayer Printed Circuit Board Market by Layer
8.4.2 Russia Multilayer Printed Circuit Board Market by Substrate
8.4.3 Russia Multilayer Printed Circuit Board Market by End Use Industry
8.5 Spain Multilayer Printed Circuit Board Market
8.5.1 Spain Multilayer Printed Circuit Board Market by Layer
8.5.2 Spain Multilayer Printed Circuit Board Market by Substrate
8.5.3 Spain Multilayer Printed Circuit Board Market by End Use Industry
8.6 Italy Multilayer Printed Circuit Board Market
8.6.1 Italy Multilayer Printed Circuit Board Market by Layer
8.6.2 Italy Multilayer Printed Circuit Board Market by Substrate
8.6.3 Italy Multilayer Printed Circuit Board Market by End Use Industry
8.7 Rest of Europe Multilayer Printed Circuit Board Market
8.7.1 Rest of Europe Multilayer Printed Circuit Board Market by Layer
8.7.2 Rest of Europe Multilayer Printed Circuit Board Market by Substrate
8.7.3 Rest of Europe Multilayer Printed Circuit Board Market by End Use Industry
Chapter 9. Company Profiles
9.1 TTM Technologies, Inc.
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 SWOT Analysis
9.2 Fujikura Ltd.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 SWOT Analysis
9.3 Flex Ltd.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 SWOT Analysis
9.4 Jabil, Inc.
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 SWOT Analysis
9.5 Plexus Corporation
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 SWOT Analysis
9.6 Benchmark Electronics, Inc.
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.7 Creation Technologies LP
9.7.1 Company Overview
9.8 Sierra Circuits, Inc.
9.8.1 Company Overview
9.8.2 SWOT Analysis
9.9 Epec, LLC
9.9.1 Company Overview
9.10. Molex, LLC (Koch Industries, Inc.)
9.10.1 Company Overview
9.10.2 SWOT Analysis

Companies Mentioned

  • TTM Technologies, Inc.
  • Fujikura Ltd.
  • Flex Ltd.
  • Jabil, Inc.
  • Plexus Corporation
  • Benchmark Electronics, Inc.
  • Creation Technologies LP
  • Sierra Circuits, Inc.
  • Epec LLC
  • Molex, LLC (Koch Industries, Inc.)

Methodology

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