The Asia Pacific Multilayer Printed Circuit Board Market is expected to witness market growth of 5.6% CAGR during the forecast period (2024-2031).
The China market dominated the Asia Pacific Multilayer Printed Circuit Board Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $11.11 billion by 2031. The Japan market is expected to witness a CAGR of 5% during 2024-2031. Additionally, the India market would register a CAGR of 6.3% during 2024-2031.
In the medical industry, the reliability of multilayer PCBs is critical for life-saving devices such as pacemakers, MRI machines, and surgical robots. Companies like Medtronic and GE Healthcare utilize biocompatible and rigorously tested PCBs to ensure safety and consistent performance in medical devices. In addition to these sectors, multilayer printed circuit boards are employed in renewable energy systems, including wind turbines and solar inverters, where they are subjected to outdoor environmental conditions characterized by temperature fluctuations and elevated humidity levels.
These PCBs are designed with robust materials, protective coatings, and thermal management systems to ensure long-term reliability in extreme environments. By meeting stringent performance standards, multilayer PCBs remain indispensable in applications where durability and flawless operation are non-negotiable.
Southeast Asia is also strengthening its PCB production capacity, particularly in back-end assembly operations, while advanced front-end fabrication remains concentrated in South Korea and Taiwan. For instance, Malaysia’s five-year plan aims to increase the semiconductor industry's contribution to 8% of GDP by promoting investments in higher-value goods and encouraging innovation in design and development. These efforts drive demand for multilayer PCBs, which are essential for ensuring the high-quality assembly of complex architectures used in smartphones and consumer appliances. As the Asia-Pacific region maintains its leadership in semiconductor and electronics manufacturing, the adoption of advanced multilayer printed circuit boards is expected to increase concurrently, thereby solidifying the region's status as a global center for technological innovation and production.
The China market dominated the Asia Pacific Multilayer Printed Circuit Board Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $11.11 billion by 2031. The Japan market is expected to witness a CAGR of 5% during 2024-2031. Additionally, the India market would register a CAGR of 6.3% during 2024-2031.
In the medical industry, the reliability of multilayer PCBs is critical for life-saving devices such as pacemakers, MRI machines, and surgical robots. Companies like Medtronic and GE Healthcare utilize biocompatible and rigorously tested PCBs to ensure safety and consistent performance in medical devices. In addition to these sectors, multilayer printed circuit boards are employed in renewable energy systems, including wind turbines and solar inverters, where they are subjected to outdoor environmental conditions characterized by temperature fluctuations and elevated humidity levels.
These PCBs are designed with robust materials, protective coatings, and thermal management systems to ensure long-term reliability in extreme environments. By meeting stringent performance standards, multilayer PCBs remain indispensable in applications where durability and flawless operation are non-negotiable.
Southeast Asia is also strengthening its PCB production capacity, particularly in back-end assembly operations, while advanced front-end fabrication remains concentrated in South Korea and Taiwan. For instance, Malaysia’s five-year plan aims to increase the semiconductor industry's contribution to 8% of GDP by promoting investments in higher-value goods and encouraging innovation in design and development. These efforts drive demand for multilayer PCBs, which are essential for ensuring the high-quality assembly of complex architectures used in smartphones and consumer appliances. As the Asia-Pacific region maintains its leadership in semiconductor and electronics manufacturing, the adoption of advanced multilayer printed circuit boards is expected to increase concurrently, thereby solidifying the region's status as a global center for technological innovation and production.
List of Key Companies Profiled
- TTM Technologies, Inc.
- Fujikura Ltd.
- Flex Ltd.
- Jabil, Inc.
- Plexus Corporation
- Benchmark Electronics, Inc.
- Creation Technologies LP
- Sierra Circuits, Inc.
- Epec LLC
- Molex, LLC (Koch Industries, Inc.)
Market Report Segmentation
By Layer
- Layer 4 to 6
- Layer 6 & Above
By Substrate
- Rigid
- Flexible
- Rigid-Flex
By End Use Industry
- Consumer Electronics
- Industrial Electronics
- IT & Telecom
- Automotive
- Healthcare
- Aerospace & Defense
- Other End Use Industry
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. Asia Pacific Multilayer Printed Circuit Board Market by Layer
Chapter 6. Asia Pacific Multilayer Printed Circuit Board Market by Substrate
Chapter 7. Asia Pacific Multilayer Printed Circuit Board Market by End Use Industry
Chapter 8. Asia Pacific Multilayer Printed Circuit Board Market by Country
Chapter 9. Company Profiles
Companies Mentioned
- TTM Technologies, Inc.
- Fujikura Ltd.
- Flex Ltd.
- Jabil, Inc.
- Plexus Corporation
- Benchmark Electronics, Inc.
- Creation Technologies LP
- Sierra Circuits, Inc.
- Epec LLC
- Molex, LLC (Koch Industries, Inc.)
Methodology
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