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Results for tag: "3D IC"

3D Semiconductor Packaging Market - Global Forecast 2026-2032 - Product Thumbnail Image

3D Semiconductor Packaging Market - Global Forecast 2026-2032

  • Report
  • January 2026
  • 194 Pages
  • Global
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Flip Chip Market - Global Forecast 2026-2032 - Product Thumbnail Image

Flip Chip Market - Global Forecast 2026-2032

  • Report
  • January 2026
  • 193 Pages
  • Global
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Automated Wafer Bonder Market - Global Forecast 2025-2030 - Product Thumbnail Image

Automated Wafer Bonder Market - Global Forecast 2025-2030

  • Report
  • August 2025
  • 181 Pages
  • Global
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Wafer Bonder Market - Global Forecast 2025-2030

  • Report
  • August 2025
  • 199 Pages
  • Global
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CIM System for OSAT Market - Global Forecast to 2030 - Product Thumbnail Image

CIM System for OSAT Market - Global Forecast to 2030

  • Report
  • August 2025
  • 193 Pages
  • Global
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IC Packaging EDA Tools Market - Global Forecast 2025-2030 - Product Thumbnail Image

IC Packaging EDA Tools Market - Global Forecast 2025-2030

  • Report
  • August 2025
  • 185 Pages
  • Global
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The 3D IC market is a subset of the semiconductor industry that focuses on the development and production of integrated circuits (ICs) with multiple layers of active electronic components. This technology enables the integration of multiple functions onto a single chip, resulting in higher performance, lower power consumption, and smaller form factors. 3D ICs are used in a variety of applications, including consumer electronics, automotive, and industrial automation. The 3D IC market is expected to experience strong growth in the coming years, driven by the increasing demand for high-performance, low-power, and miniaturized electronic devices. The increasing adoption of 3D ICs in consumer electronics, automotive, and industrial automation applications is expected to drive the market growth. Some of the major companies in the 3D IC market include Intel Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Co., Ltd., GlobalFoundries, Inc., and United Microelectronics Corporation. Show Less Read more