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Results for tag: "IC Packaging"

Organic Substrate Packaging Material Market Report 2025 - Product Thumbnail Image

Organic Substrate Packaging Material Market Report 2025

  • Report
  • February 2025
  • 200 Pages
  • Global
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3D Semiconductor Packaging Market Report 2025 - Product Thumbnail Image

3D Semiconductor Packaging Market Report 2025

  • Report
  • February 2025
  • 200 Pages
  • Global
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3D IC and 2.5D IC Packaging Market Report 2025 - Product Thumbnail Image

3D IC and 2.5D IC Packaging Market Report 2025

  • Report
  • February 2025
  • 200 Pages
  • Global
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From
Flip Chip Market Overview, 2024-29 - Product Thumbnail Image

Flip Chip Market Overview, 2024-29

  • Report
  • September 2024
  • 95 Pages
  • Global
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Flip Chip Market Outlook, 2029 - Product Thumbnail Image

Flip Chip Market Outlook, 2029

  • Report
  • September 2024
  • 182 Pages
  • Global
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From
Middle East & Africa Flip Chip Market Outlook, 2029 - Product Thumbnail Image

Middle East & Africa Flip Chip Market Outlook, 2029

  • Report
  • September 2024
  • 76 Pages
  • Africa, Middle East
From
Asia-Pacific Flip Chip Market Outlook, 2029 - Product Thumbnail Image

Asia-Pacific Flip Chip Market Outlook, 2029

  • Report
  • September 2024
  • 93 Pages
  • Asia Pacific
From
Europe Flip Chip Market Outlook, 2029 - Product Thumbnail Image

Europe Flip Chip Market Outlook, 2029

  • Report
  • September 2024
  • 97 Pages
  • Europe
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North America Flip Chip Market Outlook, 2029 - Product Thumbnail Image

North America Flip Chip Market Outlook, 2029

  • Report
  • September 2024
  • 86 Pages
  • North America
From
From
From
Global and China Semiconductor Equipment Industry Report, 2019-2025 - Product Thumbnail Image

Global and China Semiconductor Equipment Industry Report, 2019-2025

  • Report
  • June 2019
  • 111 Pages
  • China, Global
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The IC Packaging market is a segment of the semiconductor industry that involves the design, manufacture, and sale of integrated circuit (IC) packages. IC packages are used to protect and connect ICs to other components in a system. They are also used to provide electrical and thermal performance, as well as to reduce the size of the system. The IC Packaging market is driven by the increasing demand for miniaturization and higher performance of electronic devices. The market is also driven by the increasing demand for consumer electronics, such as smartphones, tablets, and laptops. The IC Packaging market is highly competitive, with a number of companies offering a wide range of products. Some of the major players in the market include Amkor Technology, ASE Technology, STATS ChipPAC, and Jiangsu Changjiang Electronics Technology. Other prominent players include Advanced Semiconductor Engineering, Kinsus Interconnect Technology, and Siliconware Precision Industries. Show Less Read more