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Results for tag: "Power Semiconductor Device"

United States Automotive Semiconductor Market: Prospects, Trends Analysis, Market Size and Forecasts up to 2032 - Product Thumbnail Image

United States Automotive Semiconductor Market: Prospects, Trends Analysis, Market Size and Forecasts up to 2032

  • Report
  • April 2024
  • 80 Pages
  • United States
From
Africa Automotive Semiconductor Market: Prospects, Trends Analysis, Market Size and Forecasts up to 2031 - Product Thumbnail Image

Africa Automotive Semiconductor Market: Prospects, Trends Analysis, Market Size and Forecasts up to 2031

  • Report
  • April 2024
  • 100 Pages
  • Africa
From
Automotive IGBT Industry Report, 2020 - Product Thumbnail Image

Automotive IGBT Industry Report, 2020

  • Report
  • July 2020
  • 240 Pages
  • China, Global
From
Global and China Automotive IGBT and SiC Research Report, 2022 - Product Thumbnail Image

Global and China Automotive IGBT and SiC Research Report, 2022

  • Report
  • August 2022
  • 270 Pages
  • China, Global
From
Global and China IGBT Industry Report, 2019-2025 - Product Thumbnail Image

Global and China IGBT Industry Report, 2019-2025

  • Report
  • May 2019
  • 105 Pages
  • China, Global
From
Progress and Impact of Mass Production of 8-inch SiC Wafers - Product Thumbnail Image

Progress and Impact of Mass Production of 8-inch SiC Wafers

  • Report
  • March 2023
  • 10 Pages
  • Global
From
Power GaN Patent Landscape - Product Thumbnail Image

Power GaN Patent Landscape

  • Report
  • November 2019
  • 270 Pages
  • Global
From
Automotive Semiconductor Market by Component (Processor, Analog IC, Discrete power device, Sensor), Vehicle Type (Passenger Car, LCV, HCV), Fuel Type (Gasoline, Diesel, EV/HEV), Application (Powertrain, Safety, Chassis) - Forecast to 2027 - Product Thumbnail Image

Automotive Semiconductor Market by Component (Processor, Analog IC, Discrete power device, Sensor), Vehicle Type (Passenger Car, LCV, HCV), Fuel Type (Gasoline, Diesel, EV/HEV), Application (Powertrain, Safety, Chassis) - Forecast to 2027

  • Report
  • December 2022
  • 258 Pages
  • Global
From
Power Semiconductor Market: Analysis By Type (Power IC, MOSFET, IGBT, Diode, Thyristor, and BJT), By Application (Automotive, Consumer Electronics, Industrial, Telecommunication, and Other), By Region Size and Trends with Impact of COVID-19 and Forecast up to 2028 - Product Thumbnail Image

Power Semiconductor Market: Analysis By Type (Power IC, MOSFET, IGBT, Diode, Thyristor, and BJT), By Application (Automotive, Consumer Electronics, Industrial, Telecommunication, and Other), By Region Size and Trends with Impact of COVID-19 and Forecast up to 2028

  • Report
  • March 2023
  • 150 Pages
  • Global
From
SiC-On-Insulator and Other Substrates Market by Substrate Type (Semi-insulating SiC Substrates, Conductive SiC Substrates), Wafer Size (100mm, 150mm and 200mm), Application (Power Devices, RF Devices) and Region - Forecast to 2029 - Product Thumbnail Image

SiC-On-Insulator and Other Substrates Market by Substrate Type (Semi-insulating SiC Substrates, Conductive SiC Substrates), Wafer Size (100mm, 150mm and 200mm), Application (Power Devices, RF Devices) and Region - Forecast to 2029

  • Report
  • January 2024
  • 135 Pages
  • Global
From
SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), Application, Process, & Region (North America, Europe, APAC, South America, MEA) - Forecast 2028 - Product Thumbnail Image

SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), Application, Process, & Region (North America, Europe, APAC, South America, MEA) - Forecast 2028

  • Report
  • August 2023
  • 169 Pages
  • Global
From
Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), Application (RF Devices, MEMS & Sensors, LED, 3D NAND, CMOS Image Sensors), Process Type, Technology, and Region - Forecast to 2026 - Product Thumbnail Image

Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), Application (RF Devices, MEMS & Sensors, LED, 3D NAND, CMOS Image Sensors), Process Type, Technology, and Region - Forecast to 2026

  • Report
  • September 2021
  • 201 Pages
  • Global
From
Spin on Carbon Market by Type (Hot-Temperature Spin on Carbon, Normal-Temperature Spin on Carbon), Application (Logic Devices, Memory Devices, Power Devices, Photonics, Advanced Packaging), End User and Region - Global Forecast to 2028 - Product Thumbnail Image

Spin on Carbon Market by Type (Hot-Temperature Spin on Carbon, Normal-Temperature Spin on Carbon), Application (Logic Devices, Memory Devices, Power Devices, Photonics, Advanced Packaging), End User and Region - Global Forecast to 2028

  • Report
  • December 2023
  • 169 Pages
  • Global
From
GaN Semiconductor Device Market by Type (Opto-semiconductor, RF Semiconductor, Power Semiconductor), Device (Discrete, Integrated, HEMT, MMIC), Application (Lighting and Lasers, Power Drives), Voltage Range, Vertical and Region - Global Forecast to 2028 - Product Thumbnail Image

GaN Semiconductor Device Market by Type (Opto-semiconductor, RF Semiconductor, Power Semiconductor), Device (Discrete, Integrated, HEMT, MMIC), Application (Lighting and Lasers, Power Drives), Voltage Range, Vertical and Region - Global Forecast to 2028

  • Report
  • September 2023
  • 246 Pages
  • Global
From
Wafer Cleaning Equipment Market by Equipment Type (Single-wafer Spray System, Batch Spray Cleaning System, and Scrubbers), Application, Technology, Operation Mode, Wafer Size (Less than Equals 150 mm, 200 mm, 300 mm) and Region - Global Forecast to 2028 - Product Thumbnail Image

Wafer Cleaning Equipment Market by Equipment Type (Single-wafer Spray System, Batch Spray Cleaning System, and Scrubbers), Application, Technology, Operation Mode, Wafer Size (Less than Equals 150 mm, 200 mm, 300 mm) and Region - Global Forecast to 2028

  • Report
  • September 2023
  • 236 Pages
  • Global
From
Power Device Analyzer Market by Type (Both AC and DC, AC and DC), Current (Below 1000A and Above 1000A), End user (Automotive, Energy, Telecommunication, Consumer Electronics and Appliances, Medical) and Region - Global Forecast to 2027 - Product Thumbnail Image

Power Device Analyzer Market by Type (Both AC and DC, AC and DC), Current (Below 1000A and Above 1000A), End user (Automotive, Energy, Telecommunication, Consumer Electronics and Appliances, Medical) and Region - Global Forecast to 2027

  • Report
  • February 2023
  • 194 Pages
  • Global
From
Compound Semiconductor Market by Type (GaN, GaAs, SiC, InP), Product (LED, Optoelectronics, RF Devices, Power Electronics), Application (Telecommunication, General Lighting, Automotive, Consumer Devices, Power Supply) & Region - Forecast to 2027 - Product Thumbnail Image

Compound Semiconductor Market by Type (GaN, GaAs, SiC, InP), Product (LED, Optoelectronics, RF Devices, Power Electronics), Application (Telecommunication, General Lighting, Automotive, Consumer Devices, Power Supply) & Region - Forecast to 2027

  • Report
  • November 2022
  • 234 Pages
  • Global
From
Thin Wafer Market by Wafer Size (125 mm, 200 mm, 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic), and Geography - Forecast to 2027 - Product Thumbnail Image

Thin Wafer Market by Wafer Size (125 mm, 200 mm, 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic), and Geography - Forecast to 2027

  • Report
  • September 2022
  • 193 Pages
  • Global
From
ALD Equipment Market by Deposition Method (Plasma Enhanced ALD, Thermal ALD, Spatial ALD), Film Type (Oxide Films, Fluoride Films), Semiconductor Application (More than Moore, More Moore), Non-semiconductor Application and Region - Forecast to 2028 - Product Thumbnail Image

ALD Equipment Market by Deposition Method (Plasma Enhanced ALD, Thermal ALD, Spatial ALD), Film Type (Oxide Films, Fluoride Films), Semiconductor Application (More than Moore, More Moore), Non-semiconductor Application and Region - Forecast to 2028

  • Report
  • August 2022
  • 186 Pages
  • Global
From
Intelligent Power Module Market by Voltage Rating (Up to 600 V, 601-1,200 V, Above 1,200 V), Current Rating, Circuit Configuration (6-Pack, 7-Pack), Power Devices (IGBT, MOSFET), Vertical, and Region (North America, Europe, APAC, RoW) - Forecast to 2027 - Product Thumbnail Image

Intelligent Power Module Market by Voltage Rating (Up to 600 V, 601-1,200 V, Above 1,200 V), Current Rating, Circuit Configuration (6-Pack, 7-Pack), Power Devices (IGBT, MOSFET), Vertical, and Region (North America, Europe, APAC, RoW) - Forecast to 2027

  • Report
  • June 2022
  • 200 Pages
  • Global
From
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The Power Semiconductor Device market is a subset of the larger Semiconductor industry. It is composed of devices that are used to control and convert electrical power. These devices are used in a variety of applications, such as motor control, power conversion, and power management. They are also used in the automotive, industrial, and consumer electronics industries. Power Semiconductor Devices are typically made from silicon, gallium arsenide, and other materials. They are designed to handle high voltages and currents, and to operate at high temperatures. They are also designed to be efficient and reliable. The Power Semiconductor Device market is highly competitive, with many companies offering a wide range of products. Some of the major players in the market include Infineon Technologies, STMicroelectronics, Texas Instruments, ON Semiconductor, Renesas Electronics, and NXP Semiconductors. Show Less Read more