The Latin America, Middle East and Africa Semiconductor Bonding Market should witness market growth of 5.5% CAGR during the forecast period (2023-2030).
Some major factors influencing the market’s growth include the rising demand for high-energy and power-efficient electronics, the prevalence of wireless and portable products, and the growing adoption of these products in the automotive industry due to the electrification pattern.
Semiconductor bonding market growth will be accelerated by rising demand for micro-electromechanical systems and an increasing preference for electric vehicles. The demand for semiconductor bonding will grow as stacked die systems are more widely adopted in connected Things. The introduction of the 5G network and increased research towards creating the 6G network will aid in the rapid expansion of the market.
The electronics industry has experienced enormous growth over the past few decades, which may be attributed to the falling cost of semiconductors. This has increased the demand for semiconductors in the electronics industry, paving the way for the semiconductor bonding market's profitable expansion.
The UAE launched its 5G network as the first nation in the Arab world and the fourth globally. The largest telecom companies in the country, Du and Etisalat, introduced limited 5G networks in 2019 and made the 5G-capable ZTE Axon 10 Pro smartphone available to both post-paid and pre-paid customers. A 16 million 5G smartphone will reportedly be functional in the region by the end of 2023. Semiconductors that can handle higher frequencies and data rates are required to deploy 5G technology. This has increased the need for bonding techniques that guarantee low signal loss, high reliability, and efficient thermal management. As a result of the rising 5G network in the LAMEA region, the semiconductor bonding market is expected to grow.
The Brazil market dominated the LAMEA Semiconductor Bonding Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $18.4 million by 2030. The Argentina market is anticipated to grow at a CAGR of 6.1% during (2023-2030). Additionally, The UAE market would exhibit a CAGR of 5.2% during (2023-2030).
Based on Application, the market is segmented into LED, Mems & Sensors, RF Devices, CMOS Image Sensors, and 3D NAND. Based on Type, the market is segmented into Wafer Bonder, Die Bonder, and Flip Chip Bonder. Based on Bonding Technology, the market is segmented into Die Bonding Technology, and Wafer Bonding Technology (Direct & Anodic Wafer Bonding, and Indirect Wafer Bonding). Based on Process Type, the market is segmented into Die To Die Bonding, Wafer To Wafer Bonding, and Die To Wafer Bonding. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Mycronic AB, TDK Corporation, EV Group, Panasonic Holdings Corporation, Tokyo Electron Ltd., Mitsubishi Electric Corporation, Intel Corporation, SÜSS MicroTec SE, Fuji Corporation (Fasford Technology Co., Ltd.), Shibuara Mechatronics Corporation
Some major factors influencing the market’s growth include the rising demand for high-energy and power-efficient electronics, the prevalence of wireless and portable products, and the growing adoption of these products in the automotive industry due to the electrification pattern.
Semiconductor bonding market growth will be accelerated by rising demand for micro-electromechanical systems and an increasing preference for electric vehicles. The demand for semiconductor bonding will grow as stacked die systems are more widely adopted in connected Things. The introduction of the 5G network and increased research towards creating the 6G network will aid in the rapid expansion of the market.
The electronics industry has experienced enormous growth over the past few decades, which may be attributed to the falling cost of semiconductors. This has increased the demand for semiconductors in the electronics industry, paving the way for the semiconductor bonding market's profitable expansion.
The UAE launched its 5G network as the first nation in the Arab world and the fourth globally. The largest telecom companies in the country, Du and Etisalat, introduced limited 5G networks in 2019 and made the 5G-capable ZTE Axon 10 Pro smartphone available to both post-paid and pre-paid customers. A 16 million 5G smartphone will reportedly be functional in the region by the end of 2023. Semiconductors that can handle higher frequencies and data rates are required to deploy 5G technology. This has increased the need for bonding techniques that guarantee low signal loss, high reliability, and efficient thermal management. As a result of the rising 5G network in the LAMEA region, the semiconductor bonding market is expected to grow.
The Brazil market dominated the LAMEA Semiconductor Bonding Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $18.4 million by 2030. The Argentina market is anticipated to grow at a CAGR of 6.1% during (2023-2030). Additionally, The UAE market would exhibit a CAGR of 5.2% during (2023-2030).
Based on Application, the market is segmented into LED, Mems & Sensors, RF Devices, CMOS Image Sensors, and 3D NAND. Based on Type, the market is segmented into Wafer Bonder, Die Bonder, and Flip Chip Bonder. Based on Bonding Technology, the market is segmented into Die Bonding Technology, and Wafer Bonding Technology (Direct & Anodic Wafer Bonding, and Indirect Wafer Bonding). Based on Process Type, the market is segmented into Die To Die Bonding, Wafer To Wafer Bonding, and Die To Wafer Bonding. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Mycronic AB, TDK Corporation, EV Group, Panasonic Holdings Corporation, Tokyo Electron Ltd., Mitsubishi Electric Corporation, Intel Corporation, SÜSS MicroTec SE, Fuji Corporation (Fasford Technology Co., Ltd.), Shibuara Mechatronics Corporation
Scope of the Study
By Application
- LED
- Mems & Sensors
- RF Devices
- CMOS Image Sensors
- 3D NAND
By Type
- Wafer Bonder
- Die Bonder
- Flip Chip Bonder
By Bonding Technology
- Die Bonding Technology
- Wafer Bonding Technology
- Direct & Anodic Wafer Bonding
- Indirect Wafer Bonding
By Process Type
- Die To Die Bonding
- Wafer To Wafer Bonding
- Die To Wafer Bonding
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Mycronic AB
- TDK Corporation
- EV Group
- Panasonic Holdings Corporation
- Tokyo Electron Ltd.
- Mitsubishi Electric Corporation
- Intel Corporation
- SÜSS MicroTec SE
- Fuji Corporation (Fasford Technology Co., Ltd.)
- Shibuara Mechatronics Corporation
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 5. LAMEA Semiconductor Bonding Market by Application
Chapter 6. LAMEA Semiconductor Bonding Market by Type
Chapter 7. LAMEA Semiconductor Bonding Market by Bonding Technology
Chapter 8. LAMEA Semiconductor Bonding Market by Process Type
Chapter 9. LAMEA Semiconductor Bonding Market by Country
Chapter 10. Company Profiles
Companies Mentioned
- Mycronic AB
- TDK Corporation
- EV Group
- Panasonic Holdings Corporation
- Tokyo Electron Ltd.
- Mitsubishi Electric Corporation
- Intel Corporation
- SÜSS MicroTec SE
- Fuji Corporation (Fasford Technology Co., Ltd.)
- Shibuara Mechatronics Corporation
Methodology
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