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3D Semiconductor Packaging - Global Strategic Business Report

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    Report

  • 293 Pages
  • February 2025
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 4804541
The global market for 3D Semiconductor Packaging was valued at US$13.4 Billion in 2024 and is projected to reach US$33.7 Billion by 2030, growing at a CAGR of 16.6% from 2024 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions.

Global 3D Semiconductor Packaging Market - Key Trends & Drivers Summarized

What Is 3D Semiconductor Packaging?

3D semiconductor packaging is a cutting-edge technology that involves stacking silicon wafers or die and interconnecting them vertically to form a single package. This method contrasts with traditional flat, 2D layouts, providing numerous advantages, including reduced space consumption, enhanced performance, and lower power usage. The innovation lies in its ability to integrate more components into a compact space, thereby significantly improving the functionality and efficiency of electronic devices. As consumer electronics continue to evolve towards sleeker, more powerful, yet more energy-efficient models, 3D packaging becomes critically important. This technology is pivotal in industries such as smartphones, computers, servers, and in the automotive sector, where manufacturers demand high-performance components that occupy minimal space.

How Does Technology Advance Drive Changes?

The relentless push for smaller, faster, and more efficient electronic devices has significantly driven advancements in 3D semiconductor packaging technology. As the limitations of traditional 2D packaging become more apparent - especially in terms of power efficiency and speed - 3D packaging has emerged as a vital solution. This technology utilizes innovative methods such as through-silicon vias (TSVs), which are vertical electrical connections passing completely through silicon wafers or dies to stack them densely. These advancements not only help in achieving higher bandwidth and better electrical performance but also in reducing latency and power consumption. Moreover, the integration of heterogeneous components, which can be made of different technologies and functionalities, into a single package is facilitating new design architectures in electronics, particularly for applications requiring high computational power, such as artificial intelligence and big data analytics.

What Role Do Market Demands Play?

Market demands across various sectors significantly shape the development and adoption of 3D semiconductor packaging. In the consumer electronics market, there is a constant demand for devices that offer more power in a smaller package, driving the need for sophisticated packaging solutions like 3D semiconductor packaging. Similarly, the automotive industry, with its increasing focus on electric and autonomous vehicles, requires high-performance computing capabilities that can only be achieved with advanced semiconductor packaging. The healthcare sector, too, utilizes this technology in medical devices that demand reliability, longevity, and miniaturization. As these sectors continue to grow, they collectively push the envelope on the capabilities of semiconductor packaging technologies, making 3D solutions not just preferable but necessary.

What Drives the Market for 3D Semiconductor Packaging?

The growth in the 3D semiconductor packaging market is driven by several factors, starting with the rapid advancement of technology in sectors such as telecommunications, automotive, and consumer electronics, where there is a continuous demand for miniaturization and enhanced performance. Additionally, the integration of IoT devices into everyday life and the increasing reliance on cloud computing and data centers fuel the need for powerful yet compact semiconductor solutions. Economic factors also play a crucial role; as the cost of 3D semiconductor manufacturing technologies decreases, it becomes more accessible to a broader range of manufacturers, further boosting market growth. The push for more environmentally friendly electronic solutions also drives advances in 3D semiconductor packaging, as it offers significant energy efficiency benefits.

Scope of the Study

The report analyzes the 3D Semiconductor Packaging market, presented in terms of market value (US$ Thousand). The analysis covers the key segments and geographic regions outlined below.

Segments:

Packaging Method (Through Silicon via (TSV), Package-on-Package, Through Glass via (TGV), Other Packaging Methods); End-Use (Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace, Other End-Uses).

Geographic Regions/Countries:

World; USA; Canada; Japan; China; Europe; France; Germany; Italy; UK; Rest of Europe; Asia-Pacific; Rest of World.

Key Insights:

  • Market Growth: Understand the significant growth trajectory of the Through Silicon via (TSV) Packaging segment, which is expected to reach US$18.4 Billion by 2030 with a CAGR of a 19.3%. The Package-on-Package segment is also set to grow at 15.6% CAGR over the analysis period.
  • Regional Analysis: Gain insights into the U.S. market, valued at $1.6 Billion in 2024, and China, forecasted to grow at an impressive 20.5% CAGR to reach $9.7 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.

Report Features:

  • Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2024 to 2030.
  • In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
  • Company Profiles: Coverage of major players such as IBM Corporation, 3M Company, Intel Corporation, Advanced Micro Devices, Inc., Applied Materials, Inc. and more.
  • Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.

Why You Should Buy This Report:

  • Detailed Market Analysis: Access a thorough analysis of the Global 3D Semiconductor Packaging Market, covering all major geographic regions and market segments.
  • Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
  • Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global 3D Semiconductor Packaging Market.
  • Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.

Key Questions Answered:

  • How is the Global 3D Semiconductor Packaging Market expected to evolve by 2030?
  • What are the main drivers and restraints affecting the market?
  • Which market segments will grow the most over the forecast period?
  • How will market shares for different regions and segments change by 2030?
  • Who are the leading players in the market, and what are their prospects?

Some of the 36 major companies featured in this 3D Semiconductor Packaging market report include:

  • IBM Corporation
  • 3M Company
  • Intel Corporation
  • Advanced Micro Devices, Inc.
  • Applied Materials, Inc.
  • Amkor Technology, Inc.
  • Cadence Design Systems, Inc.
  • Globalfoundries, Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • ASE Technology Holding Co., Ltd.
  • AT & S Austria Technologie & Systemtechnik AG
  • 3D PLUS SA
  • LPKF Laser & Electronics AG
  • China Wafer Level CSP Co., Ltd.
  • EV Group Europe & Asia/Pacific GmbH

Table of Contents

I. METHODOLOGYMII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • 3D Semiconductor Packaging - Global Key Competitors Percentage Market Share in 2024 (E)
  • 3D Semiconductor Packaging Competitor Market Share Scenario Worldwide (in %): 2020E
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • Semiconductor Advanced Packaging: A Prelude
  • An Introduction to 3D Semiconductor Packaging
  • Global Market Prospects & Outlook
  • Primary Growth Drivers
  • 3D Packaging Reinventing Integration Architectures
  • Analysis by Segment
  • Regional Analysis
  • Competitive Scenario
  • Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
  • 3D IC Packaging Market to Experience Robust Growth
  • Demand for 3D Packaging to Boost Advanced Semiconductor Packaging Market
  • Digital Transformation Drive Energizes the Growth in Advanced Packaging Market
  • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
  • IoT Ecosystem Accelerates Opportunities for Semiconductor Advanced Packaging
  • Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
  • Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
  • IC Makers Continue to Move towards Advanced Semiconductor Packaging
  • Transition towards Advanced Packaging
  • Increasing Functionality & Application Scope of Semiconductor/IC Packages
  • New Packaging Technologies Crucial to Semiconductor Innovation
  • Demand for Compact, High Functionality Electronic Devices to Impel 3D TSV Packages Market
  • 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
  • 3D InCites - Advanced Packaging for 5G
  • Advanced Packaging Influences Design Chain
  • Interposers for Semiconductor Packaging Applications
  • Innovative Advanced Packaging Techniques to Flood the Market
  • Reducing the Cost of Advanced Packaging
  • Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
  • Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
  • Smartphones
  • Tablet PCs
  • Automobile Electronification Trends Widen the Addressable Market
  • Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
  • Sustained High Growth in ICT Sector Augurs Well
4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 2: World Historic Review for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 3: World 15-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
  • TABLE 4: World Recent Past, Current & Future Analysis for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 5: World Historic Review for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 6: World 15-Year Perspective for Through Silicon via (TSV) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 7: World Recent Past, Current & Future Analysis for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 8: World Historic Review for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 9: World 15-Year Perspective for Package-on-Package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 10: World Recent Past, Current & Future Analysis for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 11: World Historic Review for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 12: World 15-Year Perspective for Through Glass Via (tgv) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 13: World Recent Past, Current & Future Analysis for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 14: World Historic Review for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 15: World 15-Year Perspective for Other Packaging Methods by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 17: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 18: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 19: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 20: World Historic Review for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 21: World 15-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 22: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 23: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 24: World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 25: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 26: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 27: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 28: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 29: World Historic Review for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 30: World 15-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 31: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 32: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 33: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 34: World 3D Semiconductor Packaging Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
III. MARKET ANALYSIS
UNITED STATES
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
  • TABLE 35: USA Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 36: USA Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 37: USA 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 38: USA Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 39: USA Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 40: USA 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
CANADA
  • TABLE 41: Canada Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 42: Canada Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 43: Canada 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 44: Canada Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 45: Canada Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 46: Canada 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
JAPAN
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
  • TABLE 47: Japan Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 48: Japan Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 49: Japan 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 50: Japan Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 51: Japan Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 52: Japan 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
CHINA
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
  • TABLE 53: China Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 54: China Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 55: China 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 56: China Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 57: China Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 58: China 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
EUROPE
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
  • TABLE 59: Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 60: Europe Historic Review for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 61: Europe 15-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
  • TABLE 62: Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 63: Europe Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 64: Europe 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 65: Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 66: Europe Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 67: Europe 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
FRANCE
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
  • TABLE 68: France Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 69: France Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 70: France 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 71: France Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 72: France Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 73: France 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
GERMANY
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
  • TABLE 74: Germany Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 75: Germany Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 76: Germany 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 77: Germany Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 78: Germany Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 79: Germany 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
ITALY
  • TABLE 80: Italy Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 81: Italy Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 82: Italy 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 83: Italy Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 84: Italy Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 85: Italy 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
UNITED KINGDOM
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
  • TABLE 86: UK Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 87: UK Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 88: UK 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 89: UK Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 90: UK Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 91: UK 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
REST OF EUROPE
  • TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 93: Rest of Europe Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 94: Rest of Europe 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 96: Rest of Europe Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 97: Rest of Europe 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
ASIA-PACIFIC
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
  • TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 99: Asia-Pacific Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 100: Asia-Pacific 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030
  • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 102: Asia-Pacific Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 103: Asia-Pacific 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030
REST OF WORLDIV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • IBM Corporation
  • 3M Company
  • Intel Corporation
  • Advanced Micro Devices, Inc.
  • Applied Materials, Inc.
  • Amkor Technology, Inc.
  • Cadence Design Systems, Inc.
  • Globalfoundries, Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • ASE Technology Holding Co., Ltd.
  • AT & S Austria Technologie & Systemtechnik AG
  • 3D PLUS SA
  • LPKF Laser & Electronics AG
  • China Wafer Level CSP Co., Ltd.
  • EV Group Europe & Asia/Pacific GmbH

Table Information