The global market for 3D Semiconductor Packaging is estimated at US$11.6 Billion in 2023 and is projected to reach US$33.7 Billion by 2030, growing at a CAGR of 16.5% from 2023 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions. ![Global 3D Semiconductor Packaging Market]( "Global 3D Semiconductor Packaging Market")
Key Insights:
- Market Growth: Understand the significant growth trajectory of the Through Silicon via (TSV) Packaging segment, which is expected to reach US$18.4 Billion by 2030 with a CAGR of a 19.3%. The Package-on-Package segment is also set to grow at 15.5% CAGR over the analysis period.
- Regional Analysis: Gain insights into the U.S. market, estimated at $1.4 Billion in 2023, and China, forecasted to grow at an impressive 20.3% CAGR to reach $9.7 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.
Why You Should Buy This Report:
- Detailed Market Analysis: Access a thorough analysis of the Global 3D Semiconductor Packaging Market, covering all major geographic regions and market segments.
- Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
- Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global 3D Semiconductor Packaging Market.
- Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.
Key Questions Answered:
- How is the Global 3D Semiconductor Packaging Market expected to evolve by 2030?
- What are the main drivers and restraints affecting the market?
- Which market segments will grow the most over the forecast period?
- How will market shares for different regions and segments change by 2030?
- Who are the leading players in the market, and what are their prospects?
Report Features:
- Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2023 to 2030.
- In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
- Company Profiles: Coverage of major players such as IBM Corporation, 3M Company, Intel Corporation, and more.
- Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.
Select Competitors (Total 36 Featured):
- IBM Corporation
- 3M Company
- Intel Corporation
- Advanced Micro Devices, Inc.
- Applied Materials, Inc.
- Amkor Technology, Inc.
- Cadence Design Systems, Inc.
- Globalfoundries, Inc.
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- ASE Technology Holding Co., Ltd.
- AT & S Austria Technologie & Systemtechnik AG
- 3D PLUS SA
- LPKF Laser & Electronics AG
- China Wafer Level CSP Co., Ltd.
- EV Group Europe & Asia/Pacific GmbH
Table of Contents
I. METHODOLOGYII. EXECUTIVE SUMMARY2. FOCUS ON SELECT PLAYERSIII. MARKET ANALYSISREST OF WORLDIV. COMPETITION
1. MARKET OVERVIEW
- 3D Semiconductor Packaging - Global Key Competitors Percentage Market Share in 2024 (E)
- 3D Semiconductor Packaging Competitor Market Share Scenario Worldwide (in %): 2020E
- Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
- Semiconductor Advanced Packaging: A Prelude
- An Introduction to 3D Semiconductor Packaging
- Global Market Prospects & Outlook
- Primary Growth Drivers
- 3D Packaging Reinventing Integration Architectures
- Analysis by Segment
- Regional Analysis
- Competitive Scenario
- Recent Market Activity
3. MARKET TRENDS & DRIVERS
- 3D IC Packaging Market to Experience Robust Growth
- Demand for 3D Packaging to Boost Advanced Semiconductor Packaging Market
- Digital Transformation Drive Energizes the Growth in Advanced Packaging Market
- Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
- IoT Ecosystem Accelerates Opportunities for Semiconductor Advanced Packaging
- Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
- Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
- IC Makers Continue to Move towards Advanced Semiconductor Packaging
- Transition towards Advanced Packaging
- Increasing Functionality & Application Scope of Semiconductor/IC Packages
- New Packaging Technologies Crucial to Semiconductor Innovation
- Demand for Compact, High Functionality Electronic Devices to Impel 3D TSV Packages Market
- 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
- 3D InCites - Advanced Packaging for 5G
- Advanced Packaging Influences Design Chain
- Interposers for Semiconductor Packaging Applications
- Innovative Advanced Packaging Techniques to Flood the Market
- Reducing the Cost of Advanced Packaging
- Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
- Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
- Smartphones
- Tablet PCs
- Automobile Electronification Trends Widen the Addressable Market
- Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
- Sustained High Growth in ICT Sector Augurs Well
4. GLOBAL MARKET PERSPECTIVE
- TABLE 1: World Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 2: World Historic Review for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 3: World 15-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2024 & 2030
- TABLE 4: World Recent Past, Current & Future Analysis for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 5: World Historic Review for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 6: World 15-Year Perspective for Through Silicon via (TSV) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 7: World Recent Past, Current & Future Analysis for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 8: World Historic Review for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 9: World 15-Year Perspective for Package-on-Package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 10: World Recent Past, Current & Future Analysis for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 11: World Historic Review for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 12: World 15-Year Perspective for Through Glass Via (tgv) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 13: World Recent Past, Current & Future Analysis for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 14: World Historic Review for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 15: World 15-Year Perspective for Other Packaging Methods by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 17: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 18: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 19: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 20: World Historic Review for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 21: World 15-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 22: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 23: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 24: World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 25: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 26: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 27: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 28: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 29: World Historic Review for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 30: World 15-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 31: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 32: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 33: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
- TABLE 34: World 3D Semiconductor Packaging Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
UNITED STATES
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
- TABLE 35: USA Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 36: USA Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 37: USA 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 38: USA Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 39: USA Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 40: USA 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
CANADA
- TABLE 41: Canada Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 42: Canada Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 43: Canada 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 44: Canada Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 45: Canada Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 46: Canada 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
JAPAN
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
- TABLE 47: Japan Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 48: Japan Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 49: Japan 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 50: Japan Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 51: Japan Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 52: Japan 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
CHINA
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
- TABLE 53: China Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 54: China Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 55: China 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 56: China Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 57: China Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 58: China 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
EUROPE
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
- TABLE 59: Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
- TABLE 60: Europe Historic Review for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 61: Europe 15-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2024 & 2030
- TABLE 62: Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 63: Europe Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 64: Europe 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 65: Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 66: Europe Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 67: Europe 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
FRANCE
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
- TABLE 68: France Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 69: France Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 70: France 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 71: France Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 72: France Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 73: France 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
GERMANY
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
- TABLE 74: Germany Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 75: Germany Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 76: Germany 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 77: Germany Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 78: Germany Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 79: Germany 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
ITALY
- TABLE 80: Italy Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 81: Italy Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 82: Italy 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 83: Italy Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 84: Italy Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 85: Italy 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
UNITED KINGDOM
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
- TABLE 86: UK Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 87: UK Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 88: UK 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 89: UK Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 90: UK Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 91: UK 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
REST OF EUROPE
- TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 93: Rest of Europe Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 94: Rest of Europe 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 96: Rest of Europe Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 97: Rest of Europe 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
ASIA-PACIFIC
- 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
- TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 99: Asia-Pacific Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 100: Asia-Pacific 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2024 & 2030
- TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
- TABLE 102: Asia-Pacific Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
- TABLE 103: Asia-Pacific 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2024 & 2030
Companies Mentioned
- IBM Corporation
- 3M Company
- Intel Corporation
- Advanced Micro Devices, Inc.
- Applied Materials, Inc.
- Amkor Technology, Inc.
- Cadence Design Systems, Inc.
- Globalfoundries, Inc.
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- ASE Technology Holding Co., Ltd.
- AT & S Austria Technologie & Systemtechnik AG
- 3D PLUS SA
- LPKF Laser & Electronics AG
- China Wafer Level CSP Co., Ltd.
- EV Group Europe & Asia/Pacific GmbH
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 293 |
| Published | December 2024 |
| Forecast Period | 2023 - 2030 |
| Estimated Market Value ( USD | $ 11.6 Billion |
| Forecasted Market Value ( USD | $ 33.7 Billion |
| Compound Annual Growth Rate | 16.5% |
| Regions Covered | Global |
| No. of Companies Mentioned | 15 |
