The global market for chiplets was valued at $5.3 billion in 2023 and is expected to reach $42.8 billion by the end of 2029, at a compound annual growth rate (CAGR) 41.9% from 2024 through 2029.
The global market for thin and ultrathin films is expected to grow from $20.6 billion in 2023 to $38.8 billion by the end of 2028, at a compound annual growth (CAGR) of 13.5% from 2023 to 2028. The global market for Internet of Things (IoT) chips was valued at $186.1 billion in 2022 and is expected to reach $375.5 billion by the end of 2028, at a compound annual growth (CAGR) of 14.3% from 2023 to 2028.
Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation.
Research Reviews provide market professionals with concise market coverage within a specific research category. This 2024 Semiconductor Manufacturing Research Review provides a sampling of the type of quantitative market information, analysis, and guidance that the research firm has been developing since its inception in 1971 to help its customers make informed business decisions.
The global market for thin and ultrathin films is expected to grow from $20.6 billion in 2023 to $38.8 billion by the end of 2028, at a compound annual growth (CAGR) of 13.5% from 2023 to 2028. The global market for Internet of Things (IoT) chips was valued at $186.1 billion in 2022 and is expected to reach $375.5 billion by the end of 2028, at a compound annual growth (CAGR) of 14.3% from 2023 to 2028.
Research Review Scope
This review report comprehensively analyzes key market trends, technological advancements, and emerging opportunities across various semiconductor segments. It covers the role of chiplets, high-speed data converters, Internet of Things (IoT) chips, printed circuit boards (PCBs), and thin/ultrathin films in next-generation electronics, emphasizing their impact on artificial intelligence (AI), high-performance computing (HPC), 5G technology, automotive applications including electric vehicles (EVs) and autonomous vehicles (AVs), and industrial automation.Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation.
Research Reviews provide market professionals with concise market coverage within a specific research category. This 2024 Semiconductor Manufacturing Research Review provides a sampling of the type of quantitative market information, analysis, and guidance that the research firm has been developing since its inception in 1971 to help its customers make informed business decisions.
Table of Contents
Chapter 1 Foreword
Chapter 2 Global Chiplets Market (SMC137A)
Chapter 3 Global Markets, Technologies and Materials for Thin and Ultrathin Films (SMC057D)
Chapter 4 Global IoT Chips Market (SMC135A)
Chapter 5 High-speed Data Converters: Global Markets and Growth Forecast (SMC136A)
Chapter 6 Printed Circuit Boards: Technologies and Global Markets (SMC103D)
Chapter 7 Appendix
List of Tables
List of Figures
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