The report finds that the shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$5.4 billion in the second quarter of 2021 and registered over 9.4% sequential and 23.2% year-on-year growth. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019, mainly attributed to the orderly transfer of IDMs (Integrated Device Manufacturers) amid lockdowns worldwide. The overloaded capacity and the continued high demand for packaging and testing services are expected to lead to price rises. This is to contribute to the growth of the industry in the second half of 2021. The shipment value of the industry is anticipated to witness 10.5% sequential and 30.2% year-on-year growth in the third quarter of 2021 and throughout 2021.
List of Topics
- This research report presents shipment value forecast of the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry until the fourth quarter of 2021 and recent quarter review from 1Q 2019 to 4Q 2021, and includes shipment value breakdown by customer origin from 1Q 2019 to 4Q 2021
- Companies surveyed in this research are major OSAT companies in Taiwan, including ASE, PTI, KYEC, Siguard, and Ardentec.
- The content of this report is primary data collected by the researcher and secondary data from publicly available information.
Table of Contents
- Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2019 - 4Q 2021
- Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2019 - 4Q 2021
- Taiwanese IC Packaging Industry Shipment Value, 1Q 2019 - 4Q 2021
- Taiwanese IC Testing Industry Shipment Value, 1Q 2019 - 4Q 2021
- Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2019 - 2Q 2021
- Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 1Q 2019 - 2Q 2021
- Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2019 - 2Q 2021
- Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2019 - 2Q 2021
- Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 1Q 2019 - 2Q 2021
- Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 1Q 2019 - 2Q 2021
- Taiwanese IC Testing Industry Shipment Value by Customer Origin, 1Q 2019 - 2Q 2021
- Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 1Q 2019 - 2Q 2021
- Exchange Rate, 1Q 2019 - 2Q 2021
- Research Scope & Definitions
Samples
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Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Ardentec
- ASE
- Chipbond
- ChipMOS
- FATC
- KYEC
- OSE
- PTI
- Sigurd
- Walto
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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