The Asia Pacific Sensor Fusion Market is expected to witness market growth of 17.9% CAGR during the forecast period (2021-2027).
The sensor fusion market is primarily driven by the rapidly developing consumer electronics, automotive, and healthcare industries. Electric vehicles manufacturers are using modern technology such as ADAS and other safety measures in their automobiles. Furthermore, the growing trend of miniaturization in electronics aids the growth of the sensor fusion market.
Each sensor type, or modality, has its own set of advantages and disadvantages. Radars are excellent at estimating distance and speed, especially in adverse weather, but they can't read street signs or see the colour of a stoplight. On the other hand, dirt, sun, rain, snow, or darkness can easily blind them. All of these sensor types are being integrated to form sensor fusion by applying software algorithms to create the most comprehensive and accurate environmental model possible. Through a process called internal and external sensor fusion, it may also correlate data from inside the cabin.
Furthermore, the region's significant investment in 5G, as well as its promotion of C-V2X, is broadening the breadth of automotive applications such as autonomous driving, V2X, and the MaaS market. For instance, Qualcomm is collaborating with more than 30 Chinese automakers, including joint ventures based in China, to show the economic viability of C-V2X technology for autonomous and connected vehicles.
The China market dominated the Asia Pacific Sensor Fusion Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $1,207.1 million by 2027. The Japan market is poised to grow a CAGR of 17.2% during (2021 - 2027). Additionally, The India market is expected to witness a CAGR of 18.7% during (2021 - 2027).
Based on Technology, the market is segmented into MEMS and Non-MEMS. Based on Type, the market is segmented into IMU, Radar Sensors, Image Sensors, Temperature Sensors, and Others. Based on End User, the market is segmented into Consumer Electronics, Healthcare, Military & Defense, Automotive, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Renesas Electronics Corporation, TDK Corporation (InvenSense, Inc.), STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Asahi Kasei Corporation, Robert Bosch GmbH, CEVA, Inc., and MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.).
The sensor fusion market is primarily driven by the rapidly developing consumer electronics, automotive, and healthcare industries. Electric vehicles manufacturers are using modern technology such as ADAS and other safety measures in their automobiles. Furthermore, the growing trend of miniaturization in electronics aids the growth of the sensor fusion market.
Each sensor type, or modality, has its own set of advantages and disadvantages. Radars are excellent at estimating distance and speed, especially in adverse weather, but they can't read street signs or see the colour of a stoplight. On the other hand, dirt, sun, rain, snow, or darkness can easily blind them. All of these sensor types are being integrated to form sensor fusion by applying software algorithms to create the most comprehensive and accurate environmental model possible. Through a process called internal and external sensor fusion, it may also correlate data from inside the cabin.
Furthermore, the region's significant investment in 5G, as well as its promotion of C-V2X, is broadening the breadth of automotive applications such as autonomous driving, V2X, and the MaaS market. For instance, Qualcomm is collaborating with more than 30 Chinese automakers, including joint ventures based in China, to show the economic viability of C-V2X technology for autonomous and connected vehicles.
The China market dominated the Asia Pacific Sensor Fusion Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $1,207.1 million by 2027. The Japan market is poised to grow a CAGR of 17.2% during (2021 - 2027). Additionally, The India market is expected to witness a CAGR of 18.7% during (2021 - 2027).
Based on Technology, the market is segmented into MEMS and Non-MEMS. Based on Type, the market is segmented into IMU, Radar Sensors, Image Sensors, Temperature Sensors, and Others. Based on End User, the market is segmented into Consumer Electronics, Healthcare, Military & Defense, Automotive, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Renesas Electronics Corporation, TDK Corporation (InvenSense, Inc.), STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Asahi Kasei Corporation, Robert Bosch GmbH, CEVA, Inc., and MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.).
Scope of the Study
Market Segments Covered in the Report:
By Technology
- MEMS
- Non MEMS
By Type
- IMU
- Radar Sensors
- Image Sensors
- Temperature Sensors
- Others
By End User
- Consumer Electronics
- Healthcare
- Military & Defense
- Automotive
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Analog Devices, Inc.
- Renesas Electronics Corporation
- TDK Corporation (InvenSense, Inc.)
- STMicroelectronics N.V.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Asahi Kasei Corporation
- Robert Bosch GmbH
- CEVA, Inc.
- MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Competition Analysis - Global
Chapter 4. Asia Pacific Sensor Fusion Market by Technology
Chapter 5. Asia Pacific Sensor Fusion Market by Type
Chapter 6. Asia Pacific Sensor Fusion Market by End User
Chapter 7. Asia Pacific Sensor Fusion Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Analog Devices, Inc.
- Renesas Electronics Corporation
- TDK Corporation (InvenSense, Inc.)
- STMicroelectronics N.V.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Asahi Kasei Corporation
- Robert Bosch GmbH
- CEVA, Inc.
- MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
Methodology
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