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LAMEA Sensor Fusion Market By Technology, By Type, By End User, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

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    Report

  • 111 Pages
  • January 2022
  • Region: Africa, Middle East
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5553076
The Latin America, Middle East and Africa Sensor Fusion Market is expected to witness market growth of 20.1% CAGR during the forecast period (2021-2027).

Sensor fusion is the technique used to reduce the level of uncertainty in a navigation motion of a robot or task completion. Cameras, radar, LiDAR, Time-of-Flight (ToF), microphones, and inertial measurement units (IMU) are examples of sensors. Complementary sensors, redundant sensors, and coordinated sensors are the three basic methods for combining sensor data.

Errors are reduced when multiple types of sensors are combined in this way. Advanced sensor fusion algorithms are used in sensor fusion devices. These algorithms are designed to bring real-time data and measurement outputs together into a single interpretation. Multiple sensor fusion arrays with various types of sensors with various chemical and biological coatings are used. Consumer electronics and automotive applications are two of the most common uses of sensor fusion.

In addition, the stringent government regulations for the manufacturing of automobiles is expected to encourage manufacturers to use sensor fusion to guide drivers for better safety and security. To handle safety-critical circumstances, the automated vehicle design must be robust. Also, the high investment by the government on various military devices, vehicles, and equipment is expected to fuel the demand for sensor fusion and hence, augment the growth of the regional market over the forecast period.

The Brazil market dominated the LAMEA Sensor Fusion Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $163.8 million by 2027. The Argentina market is expected to experience a CAGR of 20.7% during (2021 - 2027). Additionally, The UAE market is anticipated to grow a CAGR of 19.7% during (2021 - 2027).

Based on Technology, the market is segmented into MEMS and Non-MEMS. Based on Type, the market is segmented into IMU, Radar Sensors, Image Sensors, Temperature Sensors, and Others. Based on End User, the market is segmented into Consumer Electronics, Healthcare, Military & Defense, Automotive, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Renesas Electronics Corporation, TDK Corporation (InvenSense, Inc.), STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Asahi Kasei Corporation, Robert Bosch GmbH, CEVA, Inc., and MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.).

Scope of the Study


Market Segments Covered in the Report:


By Technology

  • MEMS
  • Non MEMS

By Type

  • IMU
  • Radar Sensors
  • Image Sensors
  • Temperature Sensors
  • Others

By End User

  • Consumer Electronics
  • Healthcare
  • Military & Defense
  • Automotive
  • Others

By Country

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players


List of Companies Profiled in the Report:

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Sensor Fusion Market, by Technology
1.4.2 LAMEA Sensor Fusion Market, by Type
1.4.3 LAMEA Sensor Fusion Market, by End User
1.4.4 LAMEA Sensor Fusion Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements 2017, Dec - 2021, Dec) Leading Players
Chapter 4. LAMEA Sensor Fusion Market by Technology
4.1 LAMEA Sensor Fusion MEMS Market by Country
4.2 LAMEA Sensor Fusion Non MEMS Market by Country
Chapter 5. LAMEA Sensor Fusion Market by Type
5.1 LAMEA IMU Sensor Fusion Market by Country
5.2 LAMEA Radar Sensors Sensor Fusion Market by Country
5.3 LAMEA Image Sensors Sensor Fusion Market by Country
5.4 LAMEA Temperature Sensors Sensor Fusion Market by Country
5.5 LAMEA Other Type Sensor Fusion Market by Country
Chapter 6. LAMEA Sensor Fusion Market by End User
6.1 LAMEA Sensor Fusion Consumer Electronics Market by Country
6.2 LAMEA Sensor Fusion Healthcare Market by Country
6.3 LAMEA Sensor Fusion Military & Defense Market by Country
6.4 LAMEA Sensor Fusion Automotive Market by Country
6.5 LAMEA Sensor Fusion Others Market by Country
Chapter 7. LAMEA Sensor Fusion Market by Country
7.1 Brazil Sensor Fusion Market
7.1.1 Brazil Sensor Fusion Market by Technology
7.1.2 Brazil Sensor Fusion Market by Type
7.1.3 Brazil Sensor Fusion Market by End User
7.2 Argentina Sensor Fusion Market
7.2.1 Argentina Sensor Fusion Market by Technology
7.2.2 Argentina Sensor Fusion Market by Type
7.2.3 Argentina Sensor Fusion Market by End User
7.3 UAE Sensor Fusion Market
7.3.1 UAE Sensor Fusion Market by Technology
7.3.2 UAE Sensor Fusion Market by Type
7.3.3 UAE Sensor Fusion Market by End User
7.4 Saudi Arabia Sensor Fusion Market
7.4.1 Saudi Arabia Sensor Fusion Market by Technology
7.4.2 Saudi Arabia Sensor Fusion Market by Type
7.4.3 Saudi Arabia Sensor Fusion Market by End User
7.5 South Africa Sensor Fusion Market
7.5.1 South Africa Sensor Fusion Market by Technology
7.5.2 South Africa Sensor Fusion Market by Type
7.5.3 South Africa Sensor Fusion Market by End User
7.6 Nigeria Sensor Fusion Market
7.6.1 Nigeria Sensor Fusion Market by Technology
7.6.2 Nigeria Sensor Fusion Market by Type
7.6.3 Nigeria Sensor Fusion Market by End User
7.7 Rest of LAMEA Sensor Fusion Market
7.7.1 Rest of LAMEA Sensor Fusion Market by Technology
7.7.2 Rest of LAMEA Sensor Fusion Market by Type
7.7.3 Rest of LAMEA Sensor Fusion Market by End User
Chapter 8. Company Profiles
8.1 Analog Devices, Inc.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Regional Analysis
8.1.4 Research & Development Expenses
8.1.5 Recent strategies and developments
8.1.5.1 Partnerships, Collaborations, and Agreements
8.1.6 SWOT Analysis
8.2 Renesas Electronics Corporation
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments
8.2.5.1 Partnerships, Collaborations, and Agreements
8.2.5.2 Acquisition and Mergers:
8.3 TDK Corporation (InvenSense, Inc.)
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional & Segmental Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent strategies and developments
8.3.5.1 Partnerships, Collaborations, and Agreements
8.3.5.2 Product Launches and Product Expansions
8.4 STMicroelectronics N.V.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Infineon Technologies AG
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments
8.5.5.1 Product Launches and Product Expansions
8.5.6 SWOT Analysis
8.6 NXP Semiconductors N.V.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments
8.6.5.1 Product Launches and Product Expansions
8.6.6 SWOT Analysis
8.7 Asahi Kasei Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 Robert Bosch GmbH
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 Recent strategies and developments
8.8.5.1 Partnerships, Collaborations, and Agreements
8.8.6 SWOT Analysis
8.9 CEVA, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expense
8.9.5 Recent strategies and developments
8.9.5.1 Partnerships, Collaborations, and Agreements
8.9.5.2 Acquisition and Mergers:
8.10. MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
8.10.1 Company Overview

Companies Mentioned

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

Methodology

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