The North America Wafer Backgrinding Tape Market is expected to witness market growth of 3.6% CAGR during the forecast period (2021-2027).
Wafer backgrinding is the initial stage of semiconductor packing, which is the process of protecting one or more discrete semiconductor devices or integrated circuits (ICs). Backgrinding, also known as wafer thinning or wafer lapping, decreases the thickness of wafers to allow stacking and high-density IC packaging. Package height is also determined by wafer thickness, which is essential to make smartphones, laptops, and other electronic devices slimmer.
Wafer strength must be optimised for both fabrication and packaging to provide reliability. Grinding, on the other hand, leaves defects on the surface of the wafer, which can damage both the wafer and the individual dice cut from it. These faults may subsequently grow into active regions and break the die if subjected to heat or mechanical stress.
The growth of the U.S. wafer backgrinding tape market is fuelled by the semiconductor industry's expansion, as well as rising trends in data processing and power transfer. Because the United States is the fastest adopter of wafer backgrinding technology, consumer electronics devices, impending transportation technology such as electric and hybrid vehicles, healthcare monitoring systems, and other products are growing rapidly across this region.
The US market dominated the North America Wafer Backgrinding Tape Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $58.8 million by 2027. The Canada market is poised to grow a CAGR of 6.7% during (2021 - 2027). Additionally, The Mexico market is expected to witness a CAGR of 6.1% during (2021 - 2027).
Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.
Wafer backgrinding is the initial stage of semiconductor packing, which is the process of protecting one or more discrete semiconductor devices or integrated circuits (ICs). Backgrinding, also known as wafer thinning or wafer lapping, decreases the thickness of wafers to allow stacking and high-density IC packaging. Package height is also determined by wafer thickness, which is essential to make smartphones, laptops, and other electronic devices slimmer.
Wafer strength must be optimised for both fabrication and packaging to provide reliability. Grinding, on the other hand, leaves defects on the surface of the wafer, which can damage both the wafer and the individual dice cut from it. These faults may subsequently grow into active regions and break the die if subjected to heat or mechanical stress.
The growth of the U.S. wafer backgrinding tape market is fuelled by the semiconductor industry's expansion, as well as rising trends in data processing and power transfer. Because the United States is the fastest adopter of wafer backgrinding technology, consumer electronics devices, impending transportation technology such as electric and hybrid vehicles, healthcare monitoring systems, and other products are growing rapidly across this region.
The US market dominated the North America Wafer Backgrinding Tape Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $58.8 million by 2027. The Canada market is poised to grow a CAGR of 6.7% during (2021 - 2027). Additionally, The Mexico market is expected to witness a CAGR of 6.1% during (2021 - 2027).
Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.
Scope of the Study
Market Segments Covered in the Report:
By Type
- Non-UV and
- UV-Curable
By Wafer Size
- 12-Inch
- 8-Inch
- 6-Inch
- Others
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Furukawa Electric Co., Ltd.
- Mitsui Chemicals, Inc.
- Lintec Corporation
- Nitto Denko Corporation
- AI Technology, Inc.
- AMC Co., Ltd.
- Force-One Applied Materials Co., Ltd.
- Denka Company Limited
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. North America Wafer Backgrinding Tape Market by Type
Chapter 4. North America Wafer Backgrinding Tape Market by Wafer Size
Chapter 5. North America Wafer Backgrinding Tape Market by Country
Chapter 6. Company Profiles
Companies Mentioned
- Furukawa Electric Co., Ltd.
- Mitsui Chemicals, Inc.
- Lintec Corporation
- Nitto Denko Corporation
- AI Technology, Inc.
- AMC Co., Ltd.
- Force-One Applied Materials Co., Ltd.
- Denka Company Limited
Methodology
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