The Asia Pacific Wafer Backgrinding Tape Market is expected to witness market growth of 3.9% CAGR during the forecast period (2021-2027).
The principal protection of the wafer against mechanical grinding pressures is Wafer BG tape. BG tape is expected to not only cover the active circuit of the wafer, but it is expected to also assist minimise water penetration, breaking, or cushioning absorption during the grinding process, as well as maintain uniformity after the grind, as seen by total thickness variance (TTV). Wafer breakage or adhesive contamination will occur if the adhesion strength of the BG tape is not carefully assessed.
Also, BG tapes are divided into two varieties based on their adhesive material: conventional non-ultraviolet (non-UV) tape and UV curable tape. Because SOI wafers contain inherent wafer warpage, the two different varieties were tested to see if they could aid adsorb grinding stress and avoid wafer breakage during the grinding/detaping process. Both BG tapes have a tape thickness of 124-74 125m, however the adhesive substance used is different.
Because of the growing population across this region, the demand for consumer electronics is expected to also increase in this region. This is expected to rise the usage of wafer backgrinding tape in consumer electronics. Along with that, the presence of major semiconductor companies is also increasing in this region. In addition, the growing number of suppliers of the semiconductor material needed to make ICs is boosting memory IC output and hence, accelerate the demand for wafer backgrinding tap across this region.
The China market dominated the Asia Pacific Wafer Backgrinding Tape Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $42 million by 2027. The Japan market is anticipated to grow a CAGR of 3.2% during (2021 - 2027). Additionally, The India market is expected to experience a CAGR of 4.8% during (2021 - 2027).
Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.
The principal protection of the wafer against mechanical grinding pressures is Wafer BG tape. BG tape is expected to not only cover the active circuit of the wafer, but it is expected to also assist minimise water penetration, breaking, or cushioning absorption during the grinding process, as well as maintain uniformity after the grind, as seen by total thickness variance (TTV). Wafer breakage or adhesive contamination will occur if the adhesion strength of the BG tape is not carefully assessed.
Also, BG tapes are divided into two varieties based on their adhesive material: conventional non-ultraviolet (non-UV) tape and UV curable tape. Because SOI wafers contain inherent wafer warpage, the two different varieties were tested to see if they could aid adsorb grinding stress and avoid wafer breakage during the grinding/detaping process. Both BG tapes have a tape thickness of 124-74 125m, however the adhesive substance used is different.
Because of the growing population across this region, the demand for consumer electronics is expected to also increase in this region. This is expected to rise the usage of wafer backgrinding tape in consumer electronics. Along with that, the presence of major semiconductor companies is also increasing in this region. In addition, the growing number of suppliers of the semiconductor material needed to make ICs is boosting memory IC output and hence, accelerate the demand for wafer backgrinding tap across this region.
The China market dominated the Asia Pacific Wafer Backgrinding Tape Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $42 million by 2027. The Japan market is anticipated to grow a CAGR of 3.2% during (2021 - 2027). Additionally, The India market is expected to experience a CAGR of 4.8% during (2021 - 2027).
Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.
Scope of the Study
Market Segments Covered in the Report:
By Type
- Non-UV and
- UV-Curable
By Wafer Size
- 12-Inch
- 8-Inch
- 6-Inch
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Furukawa Electric Co., Ltd.
- Mitsui Chemicals, Inc.
- Lintec Corporation
- Nitto Denko Corporation
- AI Technology, Inc.
- AMC Co., Ltd.
- Force-One Applied Materials Co., Ltd.
- Denka Company Limited
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Asia Pacific Wafer Backgrinding Tape Market by Type
Chapter 4. Asia Pacific Wafer Backgrinding Tape Market by Wafer Size
Chapter 5. Asia Pacific Wafer Backgrinding Tape Market by Country
Chapter 6. Company Profiles
Companies Mentioned
- Furukawa Electric Co., Ltd.
- Mitsui Chemicals, Inc.
- Lintec Corporation
- Nitto Denko Corporation
- AI Technology, Inc.
- AMC Co., Ltd.
- Force-One Applied Materials Co., Ltd.
- Denka Company Limited
Methodology
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