ADAS/AD Chip Industry Research Report, 2022

1.1 Introduction of ADAS/AD SoC Chip
1.1.1 Overall Architecture of Intelligent Vehicle Automotive Computing Platform
1.1.2 Evolution of Automotive EE Architecture Promotes Autonomous Driving Computing Platform Development
1.1.3 Composition of Automotive SoC Computing Chip
1.1.4 Automotive SoC Computing Chip: AI Acceleration Chip
1.1.5 Heterogeneous Design of SoC Chip Vendors (1)
1.1.6 Heterogeneous Design of SoC Chip Vendors (2)
1.1.7 Heterogeneous Design of SoC Chip Vendors (3)
1.1.8 Heterogeneous Design of SoC Chip Vendors (4)
1.1.9 Continuous Increase of SoC Master Chip Computing Power Demand
1.1.10 High Performance SoC Master Chip BOM Cost Breakdown: e.g. XXX Master Chip
1.1.11 Overall Cost of Tesla HW3.0 Controller Drops 20%
1.1.12 Cost Estimation of High Performance SoC Master Chip
1.2 ADAS/AD SoC Chip Vendors and Products Comparison
1.2.1 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (1)
1.2.2 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (2)
1.2.3 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (3)
1.2.4 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (4)
1.2.5 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (5)
1.2.6 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (6)
1.2.7 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (7)
1.2.8 Comparison of Global ADAS/AD SoC Chip Vendors and Product Performance Parameters (8)
1.3 Requirements on Auto-grade ADAS/AD SoC Chip
1.3.1 Basic Requirements for Auto-grade Chip
1.3.2 Threshold for Access to Auto-grade Chip and Industry Barriers
1.3.3 Elements for Auto-grade Chip Appraisal: Performance, Price and Power Consumption
1.3.4 Automobile Supply Chain Standard System Criteria Which Auto-grade Chips Have to Meet (1)
1.3.5 Automobile Supply Chain Standard System Criteria Which Auto-grade Chips Have to Meet (2)

2.1 Trend 1: SoC Chips Compete for ISP
2.1.1 Value and Significance of ISP Image Processor
2.1.2 Automotive ISP Image Processor Layout of ARM
2.1.3 Qualcomm Snapdragon Ride Platform
2.1.4 ISP and CNN Merged into a Unified NNA
2.1.5 Tesla without ISP: Achieve AD Overall Architecture with Pure Vision Technology
2.1.6 Layout of AD SoC Vendors: Typical Solutions for Integrated ISPs (1)
2.1.7 Layout of AD SoC Vendors: Typical Solutions for Integrated ISPs (2)
2.1.8 Layout of AD SoC Vendors: Typical Solutions for Integrated ISPs (3)
2.1.9 Layout of AD SoC Vendors: Typical Solutions for Integrated ISPs (4)
2.1.10 Layout of Software Vendors: Introducing Computer Imaging Technology into Automotive ISPs
2.1.11 Layout of CMOS Vendors: ISP 2-in-1 Auto-grade CMOS Image Sensor
2.2 Trend 2: SoC Cross-domain Fusion Computing
2.2.1 AD SoC Vendors: Layout of Cross-domain Fusion Computing (1)
2.2.2 AD SoC Vendors: Layout of Cross-domain Fusion Computing (2)
2.2.3 Cross-domain Fusion High-performance Computing Software Platform of Enjoy Move
2.3 Trend 3: SoC Vendors Accelerated Layout Autonomous Driving AI Data Training
2.3.1 Autonomous Driving SoC Vendors: Layout of Data Closed-loop Training Platform (1)
2.3.2 Autonomous Driving SoC Vendors: Layout of Data Closed-loop Training Platform (2)
2.3.3 Comparison of Autonomous Driving AI Training Chips
2.4 Trend 4: SoC Vendors Accelerated Transformation to Tier 0.5
2.4.1 Former Tier 2 Automotive Chip Vendors Became Core Suppliers
2.4.2 SoC Vendors Further Transformed to Tier 0.5
2.4.3 Self-developed 4D Imaging Radar System of Mobileye
2.4.4 Mobileye Provided AD Kit Including Chip/Vision/Radar
2.4.5 Qualcomm Acquired Veoneer

3.1 NVIDIA
3.1.1 Overview of NVIDIA Products
3.1.1.1 NVIDIA's Operations by Business in 2021 (1)
3.1.1.2 NVIDIA's Operations by Business in 2021 (2)
3.1.1.3 NVIDIA's Strategic Architecture: GPU+CPU+DPU
3.1.1.4 NVIDIA GPU Architecture: Ampere
3.1.1.5 NVIDIA GPU Architecture: Technology Evolution
3.1.1.6 NVIDIA DPU Architecture: Technology Evolution of Bluefield
3.1.1.7 NVIDIA AD Chip Strategic Direction
3.1.1.8 NVIDIA AD SoC Products Lines
3.1.1.9 NVIDIA AD Computing Platform Products Lines (1)
3.1.1.10 NVIDIA AD Computing Platform Products Lines (2)
3.1.1.11 Performance Parameters Comparison of NVIDIA Autonomous Driving Chips in Previous Generations
3.1.2 NVIDIA Atlan SoC Chips
3.1.2.1 NVIDIA Atlan SoC
3.1.2.2 NVIDIA Atlan SoC CPU
3.1.2.3 NVIDIA Atlan SoC DPU
3.1.2.4 Functional Safety Islands of NVIDIA Atlan SoC
3.1.3 NVIDIA ORIN SoC Chip
3.1.3.1 NVIDIA ORIN SoC
3.1.3.2 NVIDIA ORIN SoC: System Framework Diagram
3.1.3.3 NVIDIA ORIN SoC: Adopts Scalable and Compatible Architecture
3.1.3.4 NVIDIA ORIN SoC: 3 Typical Products
3.1.4 NVIDIA Xavier SoC Chips
3.1.4.1 NVIDIA Xavier SoC: Performance Parameters
3.1.4.2 NVIDIA Xavier SoC: System Framework Diagram
3.1.5 NVIDIA Autonomous Driving Computing Platforms
3.1.5.1 NVIDIA New Generation Autonomous Vehicle Platform: Drive Hyperion 8
3.1.5.2 NVIDIA Drive Hyperion 8.1: Development Platform Architecture for L2+ (1)
3.1.5.3 NVIDIA Drive Hyperion 8.1: Development Platform Architecture for L2+ (2)
3.1.5.4 NVIDIA Drive Hyperion 8.1: Development Platform Architecture for L2+ (3)
3.1.5.5 NVIDIA Drive Hyperion 8.1: Development Platform Architecture for L2+ (4)
3.1.5.6 NVIDIA AD Computing Platform: DRIVE AutoPilot (for L2+)
3.1.6 NVIDIA AD Supporting Software
3.1.6.1 NVIDIA AD Full Stack Tool Chain
3.1.6.2 NVIDIA AD Software Stack (1)
3.1.6.3 NVIDIA AD Software Stack (2)
3.1.6.4 NVIDIA AD Software Stack: Functions (1)
3.1.6.5 NVIDIA AD Software Stack: Functions (2)
3.1.6.6 NVIDIA AD Software Stack: Functions (3)
3.1.6.7 NVIDIA DRIVE AP2X Software Solutions
3.1.6.8 NVIDIA Autonomous Driving Simulation Platform
3.1.6.9 NVIDIA AI-Assisted Driving Platform
3.1.6.10 NVIDIA In-vehicle AI Assistant
3.1.7 NVIDIA AD Chip Consumers
3.1.7.1 NVIDIA Core Customer Group
3.1.7.2 NVIDIA AD Chip Ecology
3.2 Intel/Mobileye
3.2.1 Autonomous Driving Division of Intel
3.2.2 Intel became the World's First Full-chain Chip Vendor for OEMs
3.2.3 Intel Transformed to IDM2.0 Mode
3.2.4 Intel Planned to Start Foundry Automotive Chips in 2022
3.2.5 Mobileye Solutions
3.2.6 Mobileye Chip Shipments
3.2.7 Intel/Mobileye ADAS/AD Chip Products Portfolio (1)
3.2.8 Intel/Mobileye ADAS/AD Chip Products Portfolio (2)
3.2.9 Intel/Mobileye ADAS/AD Chip Products Portfolio (3)
3.2.10 Mobileye’s Autonomous Driving Strategy
3.2.11 Mobileye EyeQ Product Line: Typical Technical Parameters
3.2.12 Mobileye Launched the 7th-Gen Products
3.2.13 EyeQ? Ultra? System Architecture
3.2.14 Mobileye Launched EyeQ? 6L/6H SoC
3.2.15 EyeQ6H Chip Architecture
3.2.16 EyeQ6L Chip Architecture
3.2.17 Mobileye EyeQ5 Chip: System Framework
3.2.18 Mobileye EyeQ5 Chip: Function Modules
3.2.19 Mobileye EyeQ5 Chip: Open Platform
3.2.20 Mobileye EyeQ4 Chip
3.2.21 Mobileye EyeQ4 Chip Functions and Parameters
3.2.22 Mobileye L2+ SuperVision System Solution
3.2.23 Mobileye L2+ SuperVision Computing Platform Architecture Solution
3.2.24 Mobileye L2+ SuperVision System Framework
3.2.25 Mobileye L4 Mobileye Drive
3.2.26 Mobileye L4 Mobileye Drive System Design Architecture
3.2.27 Mobileye Road Experience Management (REM)
3.2.28 Mobileye Map Data Collection Solution
3.2.29 Mobileye Achieved deep Collaboration with Major Customers such as ZEEKR, Ford and Volkswagen
3.2.30 Mobileye EyeQ Product Line and Its Integration with INTEL System
3.2.31 Mobileye Eye6 Adopted Intel Atom
3.2.32 Mobileye Self-developed 4D Imaging Radar
3.2.33 Mobileye 4D Imaging Radar System Design and Performance Index
3.2.34 Mobileye Software Defined Imaging Radar Point Cloud
3.2.35 Mobileye Core Customers for AD Solutions
3.2.36 Layout of Mobileye L4 Mobility
3.3 TI
3.3.1 Profile
3.3.2 TI Spend $30 billion on Four New Semiconductor Factories
3.3.3 TI’s Launch of ADAS-related Products
3.3.4 TI ADAS/AD Chip Products Portfolio (1)
3.3.5 TI ADAS/AD Chip Products Portfolio (2)
3.3.6 TI’s Launch of Next-generation Automotive Processor Platform
3.3.7 TI Jacinto 7 System Architecture
3.3.8 TI’s ADAS Chip - TDAx
3.3.9 IT TDA4VM SoC: Technical Features (1)
3.3.10 IT TDA4VM SoC: Technical Features (2)
3.3.11 IT TDA4VM SoC: Technical Architecture
3.3.12 IT TDA4VM SoC: Application Field
3.3.13 IT TDA4VM SoC Applications (1)
3.3.14 IT TDA4VM SoC Applications (2)
3.3.15 IT TDA4VM SoC Applications (3)
3.3.16 IT TDA4VM SoC Applications (4)
3.3.17 IT TDA4VM SoC Applications (5)
3.3.18 TI Automotive Radar Chip
3.3.19 TI the 2nd-Gen Radar Single Chip
3.3.20 TI 4D Imaging Radar Chip
3.4 NXP
3.4.1 Operation of NXP in 2021
3.4.2 NXP ADAS/AD Chip Products Portfolio (1)
3.4.3 NXP ADAS/AD Chip Products Portfolio (2)
3.4.4 NXP S32x Series Chip Product Line
3.4.5 NXP S32 ADAS Chip
3.4.6 NXP S32 ADAS Chip Technology Roadmap
3.4.7 Features of NXP S32V2/ S32V3 ADAS Chip Architecture
3.4.8 Block Diagram of ADAS System Based on S32 V234
3.4.9 NXP S32V3 Binocular Vision Chip
3.4.10 NXP AD Auto-grade AI Tools Software Development Kit
3.4.11 NXP AD Computing Platform Bluebox (1)
3.4.12 NXP AD Computing Platform Bluebox (2)
3.4.13 NXP AD Computing Platform Bluebox (3)
3.4.14 NXP 4D Imaging Radar Chipset S32R45
3.4.15 NXP 4D Imaging Radar Chipset S32R41
3.4.16 NXP ADAS/AD Chip Partners and Use Cases
3.5 Renesas
3.5.1 Operation of Renesas
3.5.2 Renesas Automotive Chip Business
3.5.3 Renesas Expanded Automotive Product Line with Acquisition of Dialog
3.5.4 Renesas Will Help Build Integrated Platform of the Automakers/Tier1s on Future EE architecture
3.5.5 Renesas Automotive Chip: Capacity Expansion Plan
3.5.6 Renesas Automotive Chip: R-Car Series
3.5.7 Renesas ADAS/AD Chip Products Portfolio (1)
3.5.8 Renesas ADAS/AD Chip Products Portfolio (2)
3.5.9 Renesas R-Car V3U SoC
3.5.10 Renesas R-Car V3U SoC Internal Framework (1)
3.5.11 Renesas R-Car V3U SoC Internal Framework (2)
3.5.12 Renesas R-Car V3U SoC (1)
3.5.13 Renesas R-Car V3U SoC (2)
3.5.14 Renesas R-Car V3U SoC (3)
3.5.15 Renesas R-Car V3U SoC (4)
3.5.16 Renesas R-Car V3U SoC (5)
3.5.17 Renesas R-Car V3H SoC (6)
3.5.18 Renesas R-Car V3M SoC(13)
3.5.19 Renesas Open Turnkey Solution
3.5.20 Renesas Software Platform: R-Car Software Development Kit
3.5.21 Renesas Software Platform: Cross-platform, Scalable and Reusable
3.6 Qualcomm
3.6.1 Operation of Qualcomm in 2021
3.6.2 Qualcomm Acquired Veoneer for $4.5 billion
3.6.3 Qualcomm and Veoneer's Partnership Began in 2021
3.6.4 Large Consumers of Veoneer
3.6.5 Veoneer Active Safety Platform Architecture
3.6.6 Veoneer L2+ Hands-off System
3.6.7 Veoneer ADAS SW Software Stack Roadmap
3.6.8 Qualcomm ADAS/AD Chip Products Portfolio
3.6.9 Qualcomm Snapdragon Ride SoC Chip
3.6.10 Qualcomm Snapdragon Ride SoC Chip: Topological Architecture
3.6.11 Qualcomm Snapdragon Ride SoC and the 4th-Gen Snapdragon Cockpit Chip
3.6.12 Qualcomm Snapdragon Ride? Vision System: Technical Features
3.6.13 Qualcomm Snapdragon Ride? Vision System: Mass Production in 2024
3.6.14 Qualcomm Autonomous Driving Solution: Snapdragon Ride Platform and Arriver Software Stack
3.6.15 Qualcomm Snapdragon Ride Autonomous Driving Platform
3.6.16 Qualcomm Snapdragon Ride Software Platform
3.6.17 Three Configuration Versions of Qualcomm Snapdragon Ride
3.6.18 Applications (1)
3.6.19 Applications (2)
3.6.20 Applications (3)
3.6.21 Applications (4)
3.7 Ambarella
3.7.1 Profile
3.7.2 Ambarella Acquired Oculii
3.7.3 Ambarella Autonomous Driving Chip Product Line and Development Strategy
3.7.4 Ambarella Computer Vision Chip Architecture: CVflow
3.7.5 Ambarella ADAS/AD Chip Products Portfolio
3.7.6 Ambarella Launched Latest AI Domain Controller Chip
3.7.7 CV3 Automotive SoC Architecture
3.7.8 CV3 Neural Network Processing Unit
3.7.9 Ambarella Will Launch Several CV3 Series Chips with Different Positioning
3.7.10 Autonomous Driving System Based on CV3 Single Chip
3.7.11 Ambarella CVflow? CV5 Series
3.7.12 Ambarella Vision Chip CV1 Series
3.7.13 Ambarella Vision Chip CV2 Series: Framework Design
3.7.14 Ambarella Vision Chip CV2 Series: CV22AQ
3.7.15 Ambarella Vision Chip CV2 Series: CV22FS and CV2FS
3.7.16 Many Automakers Build AD Systems Based on Ambarella CV2 SoC
3.7.17 Applied Scenarios of Ambarella Vision Chips and Its Partners
3.8 Infineon
3.8.1 Operation in 2021
3.8.2 Infineon becomes World's Largest Automotive Semiconductor Supplier with Cypress Acquisition
3.8.3 “New Infineon” Products Portfolio
3.8.4 Infineon Chip Products Portfolio
3.8.5 Infineon Autonomous Driving Chip Layout
3.8.6 Infineon Radar and LiDAR Products
3.8.7 Infineon Autonomous Driving Layout in Future
3.8.8 Infineon ADAS/AD Chip Products Portfolio
3.8.9 Infineon RXS8160PL Solution
3.8.10 Infineon 77GHz Radar Chip
3.9 Xilinx
3.9.1 Xilinx Automotive Business
3.9.2 AMD Acquired Xilinx
3.9.3 Xilinx ADAS/AD Product Service Field
3.9.4 Xilinx FPGA Products Meet ADAS Sensor Trends
3.9.5 Roadmap and Layout of Xilinx FPGA Products
3.9.6 Xilinx ADAS/AD Chip Products Portfolio (1)
3.9.7 Xilinx ADAS/AD Chip Products Portfolio (2)
3.9.8 Xilinx Versal AE Edge Series for Next Generation Automotive Products
3.9.9 Xilinx Soc+FPGA Series
3.9.10 Xilinx Scalable Product Series
3.9.11 Xilinx Versal ACAP Series (1)
3.9.12 Xilinx Versal ACAP Series (2)
3.9.13 Xilinx Zynq UltraScale+ MPSoC Product Features (1)
3.9.14 Xilinx Zynq UltraScale+ MPSoC Product Features (2)
3.9.15 Autonomous Driving System Based on FPGA+CPU
3.9.16 Xilinx’s Launch of Unified Software Development Platform for AI and ML Inference
3.9.17 Xilinx Unified Software Development Platform (1)
3.9.18 Xilinx Unified Software Development Platform (2)
3.9.19 Xilinx’s Launch of Autonomous Driving System Architecture Solution
3.9.20 Xilinx FPGA Enabled Binocular Vision and 4D Radar
3.9.21 Xilinx FPGA Enabled LiDAR
3.9.22 Xilinx FPGA Enabled Intelligent Cockpit DMS/ICMS
3.9.23 Xilinx FPGA Enabled Autonomous Driving Sensor Fusion
3.9.24 Xilinx FPGA Enabled New Energy Vehicle
3.9.25 Xilinx FPGA Enabled Safe Gateway
3.10 Tesla
3.10.1 Tesla Autopilot System and Processor Evolution
3.10.2 Tesla ADASA/AD Computing Platform Products Portfolio
3.10.3 Tesla Planned to Outsource Production of HW 4.0 Autonomous Driving Chips to Samsung
3.10.4 Comparison of Technical Parameters of Tesla HW1.0-HW3.0
3.10.5 Tesla Self-developed HW3.0 FSD Chip
3.10.6 Tesla HW3.0: Chip Architecture Diagram
3.10.7 Tesla HW3.0 Chip: FSD Dual-redundancy Chip Design
3.10.8 Tesla HW3.0 Chip: CPU Processor
3.10.9 Tesla HW3.0 Chip: NNA Processor
3.10.10 Tesla HW3.0 Chip: ISP Processor
3.10.11 Tesla HW4.0 Chip May Cancel ISP Processor
3.10.12 Tesla Dojo Supercomputing Training Platform: Self-developed 7nm AI Training Chip D1
3.10.13 Tesla AI Supercomputer “ExaPOD”

4.1 Horizon Robotics
4.1.1 Business Model Positioned as Tier2 (1)
4.1.2 Business Model Positioned as Tier2 (2)
4.1.3 ADAS/AD Chip Architecture Roadmap
4.1.4 Product Series: Chip, Tool Chain and Operating System
4.1.5 ADAS/AD Chip Products Portfolio (1)
4.1.6 ADAS/AD Chip Products Portfolio (2)
4.1.7 Journey 2/3/5 Series Products Technical Specifications Comparison
4.1.8 Journey 5 Central Computing Chip: Core Performance Parameters
4.1.9 Journey 5 Achieved ISO 26262 ASIL-B Functional Safety Product Certification
4.1.10 Journey 3 Chip: Mainly for L2+ Assisted Driving
4.1.11 Journey 2 Chip (1)
4.1.12 Journey 2 Chip (2)
4.1.13 AD Computing Platform: Matrix
4.1.14 Reference Design Computing Platforms of Journey 5 and Matrix 5
4.1.15 Full-scenario Intelligent Driving Solutions Computing Platform: Matrix 5
4.1.16 Horizon Matrix? FSD Solution
4.1.17 Horizon Halo? Automotive Intelligent Interaction Solution
4.1.18 Horizon Matrix? Mono and Horizon Matrix? Pilot
4.1.19 Horizon Matrix Mono 2.0
4.1.20 Microkernel Architecture Real-time Automotive Operating System: Together OS (1)
4.1.21 Microkernel Architecture Real-time Automotive Operating System: Together OS (2)
4.1.22 Complete Development Tool Chain
4.1.23 “Horizon OpenExplorer Platform” AI Development Platform
4.1.24 Data Closed-loop Development Platform
4.1.25 Consumers System
4.2 Huawei
4.2.1 Huawei CC Architecture
4.2.2 Huawei ADAS/AD Chip Products Portfolio
4.2.3 Huawei ADAS/AD Computing Platform Products Portfolio
4.2.4 Huawei ADAS/AD Chip: Ascend 910/310 Master Chip
4.2.5 Huawei ADAS/AD Chip: Ascend 310/910 Using Huawei Self-developed Da Vinci Architecture
4.2.6 Huawei ADAS/AD Chip: Performance Parameters of Ascend 310
4.2.7 Huawei ADAS/AD Chip: Performance Parameters of Ascend 910
4.2.8 Huawei ADAS/AD Chip: Technical Planning Roadmap of Ascend Chip
4.2.9 Huawei CPU Chip: Kunpeng 916/920
4.2.10 Huawei MDC AD Computing Platform: Product Line
4.2.11 Huawei MDC AD Computing Platform: MDC810
4.2.12 Huawei MDC AD Computing Platform: MDC 210 and MDC 610
4.2.13 Huawei MDC AD Computing Platform: Framework (1)
4.2.14 Huawei MDC AD Computing Platform: Framework (2)
4.2.15 Huawei MDC AD Computing Platform: Hardware Platform
4.2.16 Huawei MDC AD Computing Platform: Software & Tool Chain (1)
4.2.17 Huawei MDC AD Computing Platform: Software & Tool Chain (2)
4.2.18 Huawei MDC AD Computing Platform: Software & Tool Chain (3)
4.2.19 Huawei MDC AD Computing Platform: Software & Tool Chain (4)
4.2.20 Huawei MDC AD Computing Platform: Auto-grade Safety Platform
4.2.21 Huawei MDC AD Computing Platform: ISO26262 & ASPICE Certification
4.2.22 “HUAWEI Octopus” Open AD Platform Architecture (1)
4.2.23 “HUAWEI Octopus” Open AD Platform Architecture (2)
4.2.24 Huawei AI Computing Framework: MindSpore
4.3 Black Sesame Technologies
4.3.1 Profile
4.3.2 Black Sesame Chip Product Features and Positioning
4.3.3 Black Sesame Intelligent Perception SoC Architecture
4.3.4 Black Sesame Perception Platform Solutions
4.3.5 Two Core Competitive Advantages of Black Sesame
4.3.6 High-Computing Automotive Chip Product Technology Roadmap of Black Sesame
4.3.7 Black Sesame ADAS/AD Chip Products Portfolio (1)
4.3.8 Black Sesame ADAS/AD Chip Products Portfolio (2)
4.3.9 Black Sesame A1000L/ A1000/ A1000 Pro Chips Specification Parameters
4.3.10 Black Sesame Huashan 2 A1000 Pro Chip
4.3.11 Black Sesame Huashan 2 A1000/A1000L Chip (1)
4.3.12 Black Sesame Huashan 2 A1000/A1000L Chip (2)
4.3.13 Black Sesame FAD AD Computing Platform
4.3.14 Black Sesame Chip Intelligent Development Tools
4.3.15 Black Sesame Roadside Perception Computing Platform for Vehicle Infrastructure Cooperation
4.3.16 Black Sesame Provided Intelligent Driving Brain for FAW Hongqi
4.4 SemiDrive
4.4.1 Profile
4.4.2 SemiDrive New Processor Product Line
4.4.3 SemiDrive AD Chip Roadmap
4.4.4 SemiDrive ADAS/AD Chip Products Portfolio (1)
4.4.5 SemiDrive ADAS/AD Chip Products Portfolio (2)
4.4.6 Comparison of SemiDrive V9L/V9F/V9T Chips Specification Parameters
4.4.7 SemiDrive AD Chip: Product Features of V9
4.4.8 SemiDrive AD Chip: Architecture of V9T SoC System
4.4.9 SemiDrive AD Platform: UniDrive
4.4.10 Ecological Partners of SemiDrive
4.5 Dahua Leap Motor
4.5.1 Leap Motor 01 AD Chip: Technical Architecture and Features
4.5.2 Leap Motor 01 AD Chip: Technical Parameters