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The publisher has been monitoring the sensor fusion market and it is poised to grow by $ 5.79 bn during 2022-2026, accelerating at a CAGR of 19.14% during the forecast period. The report on the sensor fusion market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by decline in sensor prices, increasing adoption of ADAS systems, and the rising adoption of 5G technology.
The sensor fusion market analysis includes the technology segment and geographic landscape.
The analyst's sensor fusion market is segmented as below:
By Technology
- MEMS
- Non-MEMS
By Geographical Landscape:
- APAC
- North America
- Europe
- South America
- Middle East and Africa
This study identifies the increasing design complexity as one of the prime reasons driving the sensor fusion market growth during the next few years. Also, collaboration between automotive and software companies and increasing miniaturization in electronic will lead to sizable demand in the market.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. The report on sensor fusion market covers the following areas:
- Sensor fusion market sizing
- Sensor fusion market forecast
- Sensor fusion market industry analysis
The analyst's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading sensor fusion market vendors that include Analog Devices Inc., Applied Materials Inc., Asahi Kasei Corp., ASM International, BASELABS GmbH, CEVA Inc., Continental AG, Hitachi Ltd., Infineon Technologies AG, Lam Research Corp., LeddarTech Inc., MEMSIC (Tianjin) Co. Ltd., Nikon Corp., NXP Semiconductors NV, Robert Bosch GmbH, ROHM Co. Ltd., Senion AB, STMicroelectronics International NV, TDK Corp., and Tokyo Electron Ltd. Also, the sensor fusion market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary.
The analyst's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Five Forces Analysis
5 Market Segmentation by Technology
6 Customer Landscape
7 Geographic Landscape
8 Drivers, Challenges, and Trends
9 Vendor Landscape
10 Vendor Analysis
11 Appendix
List of Exhibits
Executive Summary
The publisher recognizes the following companies as the key players in the global sensor fusion market: Analog Devices Inc., Applied Materials Inc., Asahi Kasei Corp., ASM International, BASELABS GmbH, CEVA Inc., Continental AG, Hitachi Ltd., Infineon Technologies AG, Lam Research Corp., LeddarTech Inc., MEMSIC (Tianjin) Co. Ltd., Nikon Corp., NXP Semiconductors NV, Robert Bosch GmbH, ROHM Co. Ltd., Senion AB, STMicroelectronics International NV, TDK Corp., and Tokyo Electron Ltd.Commenting on the report, an analyst said: "The latest trend gaining momentum in the market is increasing design complexity."
According to the report, one of the major drivers for this market is the decline in sensor prices.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Analog Devices Inc.
- Applied Materials Inc.
- Asahi Kasei Corp.
- ASM International
- BASELABS GmbH
- CEVA Inc.
- Continental AG
- Hitachi Ltd.
- Infineon Technologies AG
- Lam Research Corp.
- LeddarTech Inc.
- MEMSIC (Tianjin) Co. Ltd.
- Nikon Corp.
- NXP Semiconductors NV
- Robert Bosch GmbH
- ROHM Co. Ltd.
- Senion AB
- STMicroelectronics International NV
- TDK Corp.
- Tokyo Electron Ltd.
