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Asia Pacific DRAM Module and Component Market Size, Share & Industry Trends Analysis Report By Type, By Memory, By Industry, By Country and Growth Forecast, 2022 - 2028

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    Report

  • 101 Pages
  • May 2022
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5615421
The Asia Pacific DRAM Module and Component Market is expected to witness market growth of 2.1% CAGR during the forecast period (2022-2028).

A computer's memory is critical to its functionality. The capacity to perform sets of instructions (programs) and store working data becomes conceivable when paired with a CPU. Random-access memory (RAM) is a well-known type of memory that gets its name from its ability to reach any position in memory with a similar delay.

DRAM (dynamic random access memory) is a type of random access memory that enables larger density at a cheaper cost. DRAM is used in laptop and desktop memory modules. DRAM differs from other types of memory in a number of ways. DRAM's basic storage cell is made up of two components: a transistor and a capacitor. The transistor is used to charge or discharge the capacitor when a bit has to be stored in memory.

Since the charge stored on each capacitor is too small to be read directly, a circuit called a sense amplifier is used to measure it. The sensing amplifier detects minute charge changes and produces the appropriate logic level. The act of reading from the bit line causes the charge in the capacitor to flow out. As a result, readings in DRAM are damaging. To get around this, the value read from the bit line is re-entered into the capacitor using a process called precharging.

The gaming PC industry (desktops and laptops) and monitor market in the Asia-Pacific area has grown significantly in the last few years. This is down to the rising disposable income of the citizens living in the region. Throughout 2020, all markets in Asia-Pacific were shut down due to the pandemic. It had aided in the creation of prospects for numerous consumer technologies, particularly gaming-related devices. The gaming PC market is rapidly expanding in the region with gaming laptops being the main contributor.

The China market dominated the Asia Pacific DRAM Module and Component Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $11,012 million by 2028. The Japan market is experiencing a CAGR of 1.5% during (2022 - 2028). Additionally, The India market is expected to exhibit a CAGR of 2.8% during (2022 - 2028).

Based on Type, the market is segmented into LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others. Based on Memory, the market is segmented into Above 8 GB, 6-8GB, 3-4GB, 2GB, and Others. Based on Industry, the market is segmented into Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., SK hynix, Inc., Super Micro Computer, Inc., Nanya Technology Corporation, Winbond Electronics Corporation, Micron Technology, Inc., Powerchip Technology Corporation, ADATA Technology Co., Ltd., Etron Technology, Inc., and Kingston Technology Company, Inc.

Scope of the Study


Market Segments Covered in the Report:


By Type

  • LPDRAM
  • DDR2
  • DDR5
  • GDDR
  • HBM
  • DDR4
  • DDR3
  • Others

By Memory

  • Above 8 GB
  • 6-8GB
  • 3-4GB
  • 2GB
  • Others

By Industry

  • Servers
  • Automobiles
  • Consumer Electronics
  • Computers
  • Mobile Devices
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players


List of Companies Profiled in the Report:

  • Samsung Electronics Co., Ltd.
  • SK hynix, Inc.
  • Super Micro Computer, Inc.
  • Nanya Technology Corporation
  • Winbond Electronics Corporation
  • Micron Technology, Inc.
  • Powerchip Technology Corporation
  • ADATA Technology Co., Ltd.
  • Etron Technology, Inc.
  • Kingston Technology Company, Inc.

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Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific DRAM Module and Component Market, by Type
1.4.2 Asia Pacific DRAM Module and Component Market, by Memory
1.4.3 Asia Pacific DRAM Module and Component Market, by Industry
1.4.4 Asia Pacific DRAM Module and Component Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in DRAM Module and Component Market
Chapter 4. Asia Pacific DRAM Module and Component Market by Type
4.1 Asia Pacific LPDRAM Market by Country
4.2 Asia Pacific DDR2 Market by Country
4.3 Asia Pacific DDR5 Market by Country
4.4 Asia Pacific GDDR Market by Country
4.5 Asia Pacific HBM Market by Country
4.6 Asia Pacific DDR4 Market by Country
4.7 Asia Pacific DDR3 Market by Country
4.8 Asia Pacific Others Market by Country
Chapter 5. Asia Pacific DRAM Module and Component Market by Memory
5.1 Asia Pacific Above 8 GB Market by Country
5.2 Asia Pacific 6-8GB Market by Country
5.3 Asia Pacific 3-4GB Market by Country
5.4 Asia Pacific 2GB Market by Country
5.5 Asia Pacific Others Market by Country
Chapter 6. Asia Pacific DRAM Module and Component Market by Industry
6.1 Asia Pacific Servers Market by Country
6.2 Asia Pacific Automobiles Market by Country
6.3 Asia Pacific Consumer Electronics Market by Country
6.4 Asia Pacific Computers Market by Country
6.5 Asia Pacific Mobile Devices Market by Country
6.6 Asia Pacific Others Market by Country
Chapter 7. Asia Pacific DRAM Module and Component Market by Country
7.1 China DRAM Module and Component Market
7.1.1 China DRAM Module and Component Market by Type
7.1.2 China DRAM Module and Component Market by Memory
7.1.3 China DRAM Module and Component Market by Industry
7.2 Japan DRAM Module and Component Market
7.2.1 Japan DRAM Module and Component Market by Type
7.2.2 Japan DRAM Module and Component Market by Memory
7.2.3 Japan DRAM Module and Component Market by Industry
7.3 India DRAM Module and Component Market
7.3.1 India DRAM Module and Component Market by Type
7.3.2 India DRAM Module and Component Market by Memory
7.3.3 India DRAM Module and Component Market by Industry
7.4 South Korea DRAM Module and Component Market
7.4.1 South Korea DRAM Module and Component Market by Type
7.4.2 South Korea DRAM Module and Component Market by Memory
7.4.3 South Korea DRAM Module and Component Market by Industry
7.5 Singapore DRAM Module and Component Market
7.5.1 Singapore DRAM Module and Component Market by Type
7.5.2 Singapore DRAM Module and Component Market by Memory
7.5.3 Singapore DRAM Module and Component Market by Industry
7.6 Malaysia DRAM Module and Component Market
7.6.1 Malaysia DRAM Module and Component Market by Type
7.6.2 Malaysia DRAM Module and Component Market by Memory
7.6.3 Malaysia DRAM Module and Component Market by Industry
7.7 Rest of Asia Pacific DRAM Module and Component Market
7.7.1 Rest of Asia Pacific DRAM Module and Component Market by Type
7.7.2 Rest of Asia Pacific DRAM Module and Component Market by Memory
7.7.3 Rest of Asia Pacific DRAM Module and Component Market by Industry
Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.1 Financial Analysis
8.1.2 Segmental and Regional Analysis
8.1.3 Research & Development Expense
8.1.4 Recent strategies and developments:
8.1.4.1 Product Launches and Product Expansions:
8.2 SK hynix, Inc.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments:
8.2.5.1 Product Launches and Product Expansions:
8.3 Super Micro Computer, Inc.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.4 Nanya Technology Corporation
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Regional & Segmental Analysis
8.4.4 Research & Development Expenses
8.5 Winbond Electronics Corporation
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments:
8.5.5.1 Partnerships, Collaborations, and Agreements:
8.6 Micron Technology, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments:
8.6.5.1 Product Launches and Product Expansions:
8.7 Powerchip Technology Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Regional Analysis
8.7.4 Research & Development Expenses
8.8 ADATA Technology Co., Ltd.
8.8.1 Company Overview
8.8.2 Recent strategies and developments:
8.8.2.1 Product Launches and Product Expansions:
8.9 Etron Technology, Inc.
8.9.1 Company Overview
8.10. Kingston Technology Company, Inc.
8.10.1 Company Overview
8.10.2 Recent strategies and developments:
8.10.2.1 Partnerships, Collaborations, and Agreements:

Companies Mentioned

  • Samsung Electronics Co., Ltd.
  • SK hynix, Inc.
  • Super Micro Computer, Inc.
  • Nanya Technology Corporation
  • Winbond Electronics Corporation
  • Micron Technology, Inc.
  • Powerchip Technology Corporation
  • ADATA Technology Co., Ltd.
  • Etron Technology, Inc.
  • Kingston Technology Company, Inc.

Methodology

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