The Europe DRAM Module and Component Market is expected to witness market growth of 1.3% CAGR during the forecast period (2022-2028).
Extended data out (EDO) and fast page mode (FPM) modules were both designed to increase the performance and speed of a computer system when reading or writing lines of data. The extended data out (EDO) memory chips also allowed the computer system to start up a new access call while outputting data from the previous call or cycle, effectively overlapping the memory access processes.
DRAM is typically packaged as an integrated circuit chip that contains hundreds to billions of DRAM memory cells. DRAM chips are widely utilized in digital electronics applications that demand low-cost, high-capacity computer memory. The primary memory (sometimes known as "RAM") in modern computers and graphics cards (where the "main memory" is called the graphics memory) is one of the most common uses for DRAM. Many portable electronics and video game consoles use it as well.
By 2030, Europe plans to double its semiconductor production capacity. While big multibillion-dollar projects like Intel are being planned in the region, Goodram's European manufacturing partner is working on a smaller, but equally ambitious expansion project for its DRAM factory in Poland. The good news for the region is that businesses are putting significant resources into building a more resilient supply chain that spans various areas, including Europe. Intel, for example, is planning to invest in a new chip manufacturing and related facilities in Germany, France, and Italy, as part of a global drive to expand capacity and reduce reliance on Asia for semiconductors.
The Germany market dominated the Europe DRAM Module and Component Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $6,585 million by 2028. The UK market is estimated to grow at a CAGR of 0.5% during (2022 - 2028). Additionally, The France market is expected to display a CAGR of 2.1% during (2022 - 2028).
Based on Type, the market is segmented into LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others. Based on Memory, the market is segmented into Above 8 GB, 6-8GB, 3-4GB, 2GB, and Others. Based on Industry, the market is segmented into Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., SK hynix, Inc., Super Micro Computer, Inc., Nanya Technology Corporation, Winbond Electronics Corporation, Micron Technology, Inc., Powerchip Technology Corporation, ADATA Technology Co., Ltd., Etron Technology, Inc., and Kingston Technology Company, Inc.
Extended data out (EDO) and fast page mode (FPM) modules were both designed to increase the performance and speed of a computer system when reading or writing lines of data. The extended data out (EDO) memory chips also allowed the computer system to start up a new access call while outputting data from the previous call or cycle, effectively overlapping the memory access processes.
DRAM is typically packaged as an integrated circuit chip that contains hundreds to billions of DRAM memory cells. DRAM chips are widely utilized in digital electronics applications that demand low-cost, high-capacity computer memory. The primary memory (sometimes known as "RAM") in modern computers and graphics cards (where the "main memory" is called the graphics memory) is one of the most common uses for DRAM. Many portable electronics and video game consoles use it as well.
By 2030, Europe plans to double its semiconductor production capacity. While big multibillion-dollar projects like Intel are being planned in the region, Goodram's European manufacturing partner is working on a smaller, but equally ambitious expansion project for its DRAM factory in Poland. The good news for the region is that businesses are putting significant resources into building a more resilient supply chain that spans various areas, including Europe. Intel, for example, is planning to invest in a new chip manufacturing and related facilities in Germany, France, and Italy, as part of a global drive to expand capacity and reduce reliance on Asia for semiconductors.
The Germany market dominated the Europe DRAM Module and Component Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $6,585 million by 2028. The UK market is estimated to grow at a CAGR of 0.5% during (2022 - 2028). Additionally, The France market is expected to display a CAGR of 2.1% during (2022 - 2028).
Based on Type, the market is segmented into LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others. Based on Memory, the market is segmented into Above 8 GB, 6-8GB, 3-4GB, 2GB, and Others. Based on Industry, the market is segmented into Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., SK hynix, Inc., Super Micro Computer, Inc., Nanya Technology Corporation, Winbond Electronics Corporation, Micron Technology, Inc., Powerchip Technology Corporation, ADATA Technology Co., Ltd., Etron Technology, Inc., and Kingston Technology Company, Inc.
Scope of the Study
Market Segments Covered in the Report:
By Type
- LPDRAM
- DDR2
- DDR5
- GDDR
- HBM
- DDR4
- DDR3
- Others
By Memory
- Above 8 GB
- 6-8GB
- 3-4GB
- 2GB
- Others
By Industry
- Servers
- Automobiles
- Consumer Electronics
- Computers
- Mobile Devices
- Others
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- Samsung Electronics Co., Ltd.
- SK hynix, Inc.
- Super Micro Computer, Inc.
- Nanya Technology Corporation
- Winbond Electronics Corporation
- Micron Technology, Inc.
- Powerchip Technology Corporation
- ADATA Technology Co., Ltd.
- Etron Technology, Inc.
- Kingston Technology Company, Inc.
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 4. Europe DRAM Module and Component Market by Type
Chapter 5. Europe DRAM Module and Component Market by Memory
Chapter 6. Europe DRAM Module and Component Market by Industry
Chapter 7. Europe DRAM Module and Component Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Samsung Electronics Co., Ltd.
- SK hynix, Inc.
- Super Micro Computer, Inc.
- Nanya Technology Corporation
- Winbond Electronics Corporation
- Micron Technology, Inc.
- Powerchip Technology Corporation
- ADATA Technology Co., Ltd.
- Etron Technology, Inc.
- Kingston Technology Company, Inc.
Methodology
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