The Asia Pacific Wafer Level Packaging Market is expected to witness market growth of 18.4% CAGR during the forecast period (2022-2028).
The demand for wafer-level packaging is likely to propel the wafer-level packaging market in the coming years due to the increased demand for high-speed and small-size electronic goods. In addition, the market is expected to grow in the coming years due to the growing popularity of the Internet of Things and portable gadgets. Additionally, the market is likely to be fueled by the technological advantages of WLP over conventional packaging methods and the growing requirement for circuit miniaturization in microelectronic devices. Wires were used to link the chips to the substrate before the emergence of wafer level packaging, from the chip's edges to the corresponding pads/pins on the substrate, in a process known as wire-bonding.
Wafer-Level Packaging technologies have conquered one of the most important domains in the smartphone industry. Because of the stringent and ever-increasing size limits, mobile devices are the ideal application for WLP packages, which include wireless connectivity, sensors, cameras, and power management.
In terms of consumption, China is one of the largest markets for semiconductors, and leading semiconductor corporations in 2018 has a presence in China, ranging from R&D centers to fabrication sites. This is due to China's vast and expanding demand for chips, which are utilized in both locally produced and consumed items as well as exported goods. According to the Journal of International Commerce and Economics of the United States International Trade Commission, mainland China produces 90% of the world's cellphones, 65% of personal computers, and 67% of smart televisions. China's vast and expanding demand for chips is supported by domestic consumption as well as assembly for export.
The China market dominated the Asia Pacific Wafer Level Packaging Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $1,571 million by 2028. The Japan market is poised to grow at a CAGR of 17.7% during (2022 - 2028). Additionally, The India market is expected to exhibit a CAGR of 19.1% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
The demand for wafer-level packaging is likely to propel the wafer-level packaging market in the coming years due to the increased demand for high-speed and small-size electronic goods. In addition, the market is expected to grow in the coming years due to the growing popularity of the Internet of Things and portable gadgets. Additionally, the market is likely to be fueled by the technological advantages of WLP over conventional packaging methods and the growing requirement for circuit miniaturization in microelectronic devices. Wires were used to link the chips to the substrate before the emergence of wafer level packaging, from the chip's edges to the corresponding pads/pins on the substrate, in a process known as wire-bonding.
Wafer-Level Packaging technologies have conquered one of the most important domains in the smartphone industry. Because of the stringent and ever-increasing size limits, mobile devices are the ideal application for WLP packages, which include wireless connectivity, sensors, cameras, and power management.
In terms of consumption, China is one of the largest markets for semiconductors, and leading semiconductor corporations in 2018 has a presence in China, ranging from R&D centers to fabrication sites. This is due to China's vast and expanding demand for chips, which are utilized in both locally produced and consumed items as well as exported goods. According to the Journal of International Commerce and Economics of the United States International Trade Commission, mainland China produces 90% of the world's cellphones, 65% of personal computers, and 67% of smart televisions. China's vast and expanding demand for chips is supported by domestic consumption as well as assembly for export.
The China market dominated the Asia Pacific Wafer Level Packaging Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $1,571 million by 2028. The Japan market is poised to grow at a CAGR of 17.7% during (2022 - 2028). Additionally, The India market is expected to exhibit a CAGR of 19.1% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Others
ByType
- WLCSP
- 5D TSV WLP
- 3D TSV WLP
- Nano WLP
- Others
By Technology
- Fan IN
- Fan OUT
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Asia Pacific Wafer Level Packaging Market by End User
Chapter 4. Asia Pacific Wafer Level Packaging Market by Type
Chapter 5. Asia Pacific Wafer Level Packaging Market by Technology
Chapter 6. Asia Pacific Wafer Level Packaging Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
Methodology
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