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LAMEA Passive And Interconnecting Electronic Components Market Size, Share & Industry Trends Analysis Report By Type (Interconnecting, and Passive), By Interconnecting Type, By Passive Type, By Application, By Country and Growth Forecast, 2022 - 2028

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    Report

  • 122 Pages
  • June 2022
  • Region: Africa, Middle East
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5636569
The Latin America, Middle East and Africa Passive And Interconnecting Electronic Components Market is expected to witness market growth of 8.3% CAGR during the forecast period (2022-2028).

An electronic interconnect device connects two conductors, allowing current or light waves to pass from one to the other. An integrated circuit (IC) on a silicon or metal die is housed in an electronic packaging that is made of plastic, ceramic, or metal.

The international market for passive and linking electronic components is expanding rapidly, and this trend is projected to continue in the next years. Electronic components that are passive and interconnected are utilized in electronic devices such as cellphones, laptops, electrical home appliances, and game consoles. Computers, consumer electronics, telecommunications, and a variety of other industries rely on these components. Sockets, connectors, printed circuit boards, relays, switches, and other interconnecting devices are only a few examples.

In May 2013, the UAE embarked on a two-year effort to transition from eGovernment to mGovernment. Following a gathering of government leaders, a new government vision was announced. The goal was to make all priority services accessible online through two channels: Mobile phone applications and websites.
The UAE has a great rate of mobile governance in 2015. With the help of 41 government agencies, 96.3 percent of the UAE government's most used 337 services were converted to mGovernment and mServices in just 730 days. The most significant change that occurred during those two years was a shift in the philosophy and culture of government service management. Today, service delivery is based on advanced technology and innovative minds rather than physical offices and thousands of personnel, which has resulted in a tremendous increase in the rate of smart transformation, with 98.18 percent of federal government services available online.

In the UAE, illiteracy is less than 1%, hence it is not a barrier to internet use. Emirati schools are progressively becoming internet-connected and equipped with eLearning resources, and many of them encourage students to use tablet computers. The Mohammed Bin Rashid Smart Learning Program was developed with the goal of creating a unique learning environment in schools by introducing 'smart' classes.

The Brazil market dominated the LAMEA Passive And Interconnecting Electronic Components Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $5,179.9 million by 2028. The Argentina market is estimated to grow at a CAGR of 8.9% during (2022-2028). Additionally, The UAE market is expected to witness a CAGR of 8% during (2022-2028).

Based on Type, the market is segmented into Interconnecting, and Passive. Based on Interconnecting Type, the market is segmented into Connectors/Sockets, PCB, Switches, Relays, and Others. Based on Passive Type, the market is segmented into Capacitors, Resistors & Inductors, Transformers and Diode. Based on Application, the market is segmented into Consumer Electronics, Aerospace & Defense, IT & Telecom, Automotive, Industrial, Healthcare and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include TE Connectivity Ltd., Samsung Electro-Mechanics Co., Ltd. (Samsung Group), Fujitsu Limited, Vishay Intertechnology, Inc., Panasonic Corporation, Rohm Semiconductors Co., Ltd., TDK Corporation, Murata Manufacturing Co., Ltd., Yageo Corporation, and Koch Industries, Inc. (Molex LLC).

Scope of the Study


Market Segments Covered in the Report:


By Type
  • Interconnecting
  • Connectors/Sockets
  • PCB
  • Switches
  • Relays
  • Others
  • Passive
  • Capacitors
  • Resistors & Inductors
  • Transformers
  • Diode
By Application
  • Consumer Electronics
  • Aerospace & Defense
  • IT & Telecom
  • Automotive
  • Industrial
  • Healthcare
  • Others
By Country
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players


List of Companies Profiled in the Report:

  • TE Connectivity Ltd.
  • Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
  • Fujitsu Limited
  • Vishay Intertechnology, Inc.
  • Panasonic Corporation
  • Rohm Semiconductors Co., Ltd.
  • TDK Corporation
  • Murata Manufacturing Co., Ltd.
  • Yageo Corporation
  • Koch Industries, Inc. (Molex LLC)

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Passive And Interconnecting Electronic Components Market, by Type
1.4.2 LAMAE Passive And Interconnecting Electronic Components Market, by Application
1.4.3 LAMEA Passive And Interconnecting Electronic Components Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies deployed in Passive And Interconnecting Electronic Components Market
Chapter 4. LAMEA Passive And Interconnecting Electronic Components Market by Type
4.1 LAMEA Interconnecting Market by Country
4.2 LAMEA Passive And Interconnecting Electronic Components Market by Interconnecting Type
4.2.1 LAMEA Connectors/Sockets Market by Country
4.2.2 LAMEA PCB Market by Country
4.2.3 LAMEA Switches Market by Country
4.2.4 LAMEA Relays Market by Country
4.2.5 LAMEA Others Market by Country
4.3 LAMEA Passive Market by Country
4.4 LAMEA Passive And Interconnecting Electronic Components Market by Passive Type
4.4.1 LAMEA Capacitors Market by Country
4.4.2 LAMEA Resistors & Inductors Market by Country
4.4.3 LAMEA Transformers Market by Country
4.4.4 LAMEA Diode Market by Country
Chapter 5. LAMEA Passive And Interconnecting Electronic Components Market by Application
5.1 LAMEA Consumer Electronics Market by Country
5.2 LAMEA Aerospace & Defense Market by Country
5.3 LAMEA IT & Telecom Market by Country
5.4 LAMEA Automotive Market by Country
5.5 LAMEA Industrial Market by Country
5.6 LAMEA Healthcare Market by Country
5.7 LAMEA Others Market by Country
Chapter 6. LAMEA Passive And Interconnecting Electronic Components Market by Country
6.1 Brazil Passive And Interconnecting Electronic Components Market
6.1.1 Brazil Passive And Interconnecting Electronic Components Market by Type
6.1.1.1 Brazil Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.1.1.2 Brazil Passive And Interconnecting Electronic Components Market by Passive Type
6.1.2 Brazil Passive And Interconnecting Electronic Components Market by Application
6.2 Argentina Passive And Interconnecting Electronic Components Market
6.2.1 Argentina Passive And Interconnecting Electronic Components Market by Type
6.2.1.1 Argentina Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.2.1.2 Argentina Passive And Interconnecting Electronic Components Market by Passive Type
6.2.2 Argentina Passive And Interconnecting Electronic Components Market by Application
6.3 UAE Passive And Interconnecting Electronic Components Market
6.3.1 UAE Passive And Interconnecting Electronic Components Market by Type
6.3.1.1 UAE Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.3.1.2 UAE Passive And Interconnecting Electronic Components Market by Passive Type
6.3.2 UAE Passive And Interconnecting Electronic Components Market by Application
6.4 Saudi Arabia Passive And Interconnecting Electronic Components Market
6.4.1 Saudi Arabia Passive And Interconnecting Electronic Components Market by Type
6.4.1.1 Saudi Arabia Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.4.1.2 Saudi Arabia Passive And Interconnecting Electronic Components Market by Passive Type
6.4.2 Saudi Arabia Passive And Interconnecting Electronic Components Market by Application
6.5 South Africa Passive And Interconnecting Electronic Components Market
6.5.1 South Africa Passive And Interconnecting Electronic Components Market by Type
6.5.1.1 South Africa Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.5.1.2 South Africa Passive And Interconnecting Electronic Components Market by Passive Type
6.5.2 South Africa Passive And Interconnecting Electronic Components Market by Application
6.6 Nigeria Passive And Interconnecting Electronic Components Market
6.6.1 Nigeria Passive And Interconnecting Electronic Components Market by Type
6.6.1.1 Nigeria Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.6.1.2 Nigeria Passive And Interconnecting Electronic Components Market by Passive Type
6.6.2 Nigeria Passive And Interconnecting Electronic Components Market by Application
6.7 Rest of LAMEA Passive And Interconnecting Electronic Components Market
6.7.1 Rest of LAMEA Passive And Interconnecting Electronic Components Market by Type
6.7.1.1 Rest of LAMEA Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.7.1.2 Rest of LAMEA Passive And Interconnecting Electronic Components Market by Passive Type
6.7.2 Rest of LAMEA Passive And Interconnecting Electronic Components Market by Application
Chapter 7. Company Profiles
7.1 TE Connectivity Ltd.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 Recent strategies and developments
7.1.5.1 Product Launches and Product Expansions
7.1.5.2 Acquisition and Mergers
7.1.6 SWOT Analysis
7.2 Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 SWOT Analysis
7.3 Fujitsu Limited
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental Analysis
7.3.4 SWOT Analysis
7.4 Vishay Intertechnology, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research and Development Expense
7.4.5 Recent strategies and developments
7.4.5.1 Product Launches and Product Expansions
7.4.5.2 Acquisition and Mergers
7.5 Panasonic Corporation
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments
7.5.5.1 Product Launches and Product Expansions
7.6 Rohm Semiconductors Co., Ltd.
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.7 TDK Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.8 Murata Manufacturing Co., Ltd.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.9 Yageo Corporation
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional and Segmental Analysis
7.10. Koch Industries, Inc. (Molex LLC)
7.10.1 Company Overview

Companies Mentioned

  • TE Connectivity Ltd.
  • Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
  • Fujitsu Limited
  • Vishay Intertechnology, Inc.
  • Panasonic Corporation
  • Rohm Semiconductors Co., Ltd.
  • TDK Corporation
  • Murata Manufacturing Co., Ltd.
  • Yageo Corporation
  • Koch Industries, Inc. (Molex LLC)

Methodology

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