Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance.
Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances.
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Table of Contents
1. Applications and Key Performance Indicators for Data Communications 2. Integrated Semiconductor Lasers 3. Integrated Optical Modulators 4. Integrated Photodetectors 5. Passive Silicon Photonic Devices 6. Coherent PICs for Data Center Interconnects 7. PICs for switched network interconnects 8. Photonics Switch Fabrics in Datacentre/HPC networks 9. PICs and Optical Fabrics for Heterogenous Compute Systems 10. PIC Design Methods and Tools 11. PIC Fabrication, and Test Approaches 12. PIC Packaging & Test Technologies for DC and HPC Applications 13. PIC Quality and Reliability for DC and HPC Applications
Authors
Madeleine Glick Senior Research Scientist, Columbia University. Dr. Madeleine Glick is a Senior Research Scientist at Columbia University where her current research focuses on applications of photonic devices and optical interconnects to bandwidth dense, energy efficient computing systems. Madeleine received her Ph.D. in Physics from Columbia University in 1989. She subsequently conducted research on optical properties of III-V materials at the Department of Physics, Ecole Polytechnique Federale de Lausanne (EPFL) Lausanne, Switzerland. She was also a Research Associate with the European Organization for Nuclear Research, CERN, Geneva, Switzerland. In the early 2000s Madeleine initiated and led research activities on the use of photonics in computer networks. From 2002-2011 she was Principal Engineer at Intel Research leading research on optical interconnects for data centers where she led one of the first research groups to explore optical interconnects and optical switching for computer networks and data centers. While at Intel, she initiated and led projects exploring digital signal processing (DSP) for optical links - an impactful research collaboration with University College London and Carnegie Mellon University. Her work has extended to research and collaborations with industry and universities, including University of Oxford, University of Cambridge, MIT and Lawrence Berkeley National Laboratory. Madeleine's contributions have been recognized in both the photonics and computing communities. She is one of the few optics researchers to have been published by top-tier computing conferences (Sigcomm 2016, SC19, SC20) and to be invited to the technical committee of the major supercomputing conference (SC18-SC22; Vice Chair of the Networks and Architectures subcommittee SC18). Madeleine is a Fellow of Optica and the Institute of Physics UK (IOP). In 2022 she received the Distinguished Service Award from the IEEE Photonics Society. Ling Liao Intel Fellow and Chief Architect of Photonic Integration, Intel's Silicon Photonic Product Division, USA.Dr. Liao Ling is an Intel Fellow and chief architect of photonic integration in Intel's Silicon Photonics Product Division. She joined Intel in 1997 and spearheaded research in high-speed silicon modulation, optical transmitter integration, and co-packaged optics. She currently leads the development of multi terabit per second photonic engines to be co-packaged with switch SOCs and XPUs for future power, cost, and bandwidth density scaling. Ling earned her B.S. and M.S. in materials science and engineering from the Massachusetts Institute of Technology and Ph.D. in electrical engineering from the University of Surrey in the UK.
Katharine Schmidtke Director of Sourcing for ASICs and Custom Silicon, Facebook.Dr. Katharine Schmidtke is Director of Sourcing for ASICs and Custom Silicon at Facebook. Over the past five years she led Facebook's Optical Technology strategy and worked closely with OCP to specify the 100G-CWDM4-OCP optical transceiver optimized for data center applications. Katharine obtained a Ph.D. in non-linear optics from Southampton University in the UK and completed post-doctoral research at Stanford University.
