North America Outsourced Semiconductor Assembly and Testing Market Size, Share & Industry Trends Analysis Report By Application, By Packaging Type, By Process, By Country and Growth Forecast, 2022 - 2028

The North America Outsourced Semiconductor Assembly and Testing Market is expected to witness market growth of 4.3% CAGR during the forecast period (2022-2028).

The urbanization boom and rising consumer electronics demand are what is driving the market's expansion. Additionally, a rise in global disposable income has significantly increased sales of consumer electronics products like TVs, mobile phones, and tablets, which in turn has increased demand for the industry of outsourced semiconductor assembly and testing.

Additionally, the growth of the market for outsourced semiconductor assembly and testing is significantly fueled by the rise in smartphone adoption. On the other hand, OSAT companies are expected to benefit greatly from growth in the chip market. Furthermore, the transition toward OSAT in developing nations like South Korea, China, and India is increasing. In order to capitalize on the lucrative automotive OSAT market opportunity, manufacturers are compelled to offer new products with a brief lifespan and a compact design.

The United States is home to one of biggest automotive industries in the world. The requirement for commercial vehicles is greatly affected by the growth of delivery & logistics services in addition to major e-commerce behemoths like Amazon, etc. The development of engine technology is accelerating as global emission standards are raised. These elements have a big impact on the expansion of the automotive industry in the region. The region is home to a number of sizable automotive OEMs, and its broad support system and pro-electric vehicle policies are advantageous.

The US market dominated the North America Outsourced Semiconductor Assembly and Testing Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $10,686.6 million by 2028. The Canada market is poised to grow at a CAGR of 6.7% during (2022 - 2028). Additionally, The Mexico market is expected to witness a CAGR of 5.7% during (2022 - 2028).

Based on Application, the market is segmented into Consumer Electronics, Industrial, Telecommunications, Medical & Healthcare, Automotive, Aerospace & Defense, and Logistics & Transportation. Based on Packaging Type, the market is segmented into Ball Grid Array, Quad & Dual, Multi-package, Chip Scale Package, and Stacked Die. Based on Process, the market is segmented into Testing, Sorting, Sawing, Assembly. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Amkor Technology, Inc., Advanced Silicon S.A, Alphacore, Inc., Device Engineering, Inc., HiDensity Group, Luminar Technologies, Inc., Presto Engineering, Sencio BV, Shortlink AB, and SiFive, Inc.

Scope of the Study

Market Segments Covered in the Report:

By Application

• Consumer Electronics
• Industrial
• Telecommunications
• Medical & Healthcare
• Automotive
• Aerospace & Defense
• Logistics & Transportation

By Packaging Type

• Ball Grid Array
• Quad & Dual
• Multi-package
• Chip Scale Package
• Stacked Die

By Process

• Testing
• Sorting
• Sawing
• Assembly

By Country

• US
• Canada
• Mexico
• Rest of North America

Key Market Players

List of Companies Profiled in the Report:

• Amkor Technology, Inc.
• Advanced Silicon S.A
• Alphacore, Inc.
• Device Engineering, Inc.
• HiDensity Group
• Luminar Technologies, Inc.
• Presto Engineering
• Sencio BV
• Shortlink AB
• SiFive, Inc.

Unique Offerings from the Publisher

• Exhaustive coverage
• The highest number of market tables and figures
• Subscription-based model available
• Guaranteed best price
• Assured post sales research support with 10% customization free