The semiconductor bonding market in North America is expected to grow from US$ 134.90 million in 2022 to US$ 204.23 million by 2028. It is estimated to grow at a CAGR of 7.2% from 2022 to 2028.
Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions is Driving the Growth of the Market
The growing demand for semiconductor bonders has compelled the market players to increase investments in the development of new and innovative product offerings. A few of the major product developments and launches are mentioned below:- In September 2021, Palomar Technologies announced the launch of its new Palomar 3880-II Die Bonder. The upgraded version provides maximum productivity and reduces programming time up to 95%.
- In September 2020, Palomar Technologies launched a new Palomar 8100 Wire Bonder. It is a fully automated, thermosonic high-speed ball-and-stitch wire bonder. It is capable of ball bumping and customized looping profiles.
- In September 2021, SUSS MicroTec SE announced its partnership with SET Corporation SA. Under this partnership, the companies will provide a fully automated, customizable, and highest-yield equipment solution to its customers.
- In October 2020, Applied Materials, Inc. announced that they are collaborating with BE Semiconductor Industries N.V. to develop solutions for die-based hybrid bonding. It is an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications such as high-performance computing, AI, and 5G.
- In May 2019, Xperi Corporation announced a new IC package bonding technology for semiconductor devices. DBI Ultra, a new semiconductor wafer bonding technology is used for in the production of smartphone image sensors. In addition, it is also used for various applications, including IoT devices, mobile devices, and others in industrial, automotive, and medical industries.
Market Overview
North America Semiconductor Bonding Market Segmentation
The North America semiconductor bonding market is segmented into type, technology, and country.- Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
- Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.
- Based on country, the market is segmented into the US, Canada, and Mexico. The US dominated the market share in 2022.
Table of Contents
1. Introduction1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. North America Semiconductor Bonding Market Landscape
4.1 Market Overview
4.2 North America PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinions
5. North America Semiconductor Bonding Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
5.2 Market Restraints
5.2.1 Fluctuation in the Price of Semiconductor Components
5.3 Market Opportunities
5.3.1 Rising Demand for Hybrid Bonding
5.4 Future Trends
5.4.1 Adoption of Die Bonding in Telecommunication
5.5 Impact Analysis of Drivers and Restraints
6. Semiconductor Bonding Market - North America Market Analysis
6.1 North America Semiconductor Bonding Market Overview
6.2 North America Semiconductor Bonding Market Revenue Forecast and Analysis
7. North America Semiconductor Bonding Market Revenue and Forecast to 2028 - Type
7.1 North America Semiconductor Bonding Market, By Type (2021 And 2028)
7.2 Die Bonder
7.2.1 Overview
7.2.2 Die Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.3 Wafer Bonder
7.3.1 Overview
7.3.2 Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.4 Flip Chip Bonder
7.4.1 Overview
7.4.2 Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8. North America Semiconductor Bonding Market Revenue and Forecast to 2028 - Application
8.1 Overview
8.2 North America Semiconductor Bonding Market, By Application (2021 And 2028)
8.3 RF Devices
8.3.1 Overview
8.3.2 RF Devices: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.4 MEMS and Sensors
8.4.1 Overview
8.4.2 MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.5 LED
8.5.1 Overview
8.5.2 LED: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.6 3D NAND
8.6.1 Overview
8.6.2 3D NAND: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.7 CMOS Image Sensors
8.7.1 Overview
8.7.2 CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
9. North America Semiconductor Bonding Market - Country Analysis
9.1 Overview
9.1.1 North America: Semiconductor Bonding Market, by Key Country
9.1.1.1 US: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.1.1 US: Semiconductor Bonding Market, by Type
9.1.1.1.2 US: Semiconductor Bonding Market, by Application
9.1.1.2 Canada: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.2.1 Canada: Semiconductor Bonding Market, by Type
9.1.1.2.2 Canada: Semiconductor Bonding Market, by Application
9.1.1.3 Mexico: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.3.1 Mexico: Semiconductor Bonding Market, by Type
9.1.1.3.2 Mexico: Semiconductor Bonding Market, by Application
10. Industry Landscape
10.1 Overview
10.2 Market Initiative
10.3 New Product Launch
11. Company Profiles
11.1 Palomar Technologies
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Products and Services
11.1.4 Financial Overview
11.1.5 SWOT Analysis
11.1.6 Key Developments
11.2 Panasonic Corporation
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Products and Services
11.2.4 Financial Overview
11.2.5 SWOT Analysis
11.2.6 Key Developments
11.3 Toray Industries Inc
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Products and Services
11.3.4 Financial Overview
11.3.5 SWOT Analysis
11.3.6 Key Developments
11.4 Kulicke & Soffa Industries, Inc.
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Products and Services
11.4.4 Financial Overview
11.4.5 SWOT Analysis
11.4.6 Key Developments
11.5 DIAS Automation (HK) Ltd.
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Products and Services
11.5.4 Financial Overview
11.5.5 SWOT Analysis
11.5.6 Key Developments
11.6 ASMPT
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Products and Services
11.6.4 Financial Overview
11.6.5 SWOT Analysis
11.6.6 Key Developments
11.7 Yamaha Motor Corporation
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Products and Services
11.7.4 Financial Overview
11.7.5 SWOT Analysis
11.7.6 Key Developments
11.8 EV Group
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Products and Services
11.8.4 Financial Overview
11.8.5 SWOT Analysis
11.8.6 Key Developments
11.9 WestBond, Inc.
11.9.1 Key Facts
11.9.2 Business Description
11.9.3 Products and Services
11.9.4 Financial Overview
11.9.5 SWOT Analysis
11.9.6 Key Developments
12. Appendix
12.1 About the Publisher
12.2 Word Index
List of Tables
Table 1. North America Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Table 2. US: Semiconductor Bonding Market, by Type-Revenue and Forecast to 2028 (US$ Million)
Table 3. US: Semiconductor Bonding Market, by Application-Revenue and Forecast to 2028 (US$ Million)
Table 4. Canada: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 5. Canada: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 6. Mexico: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 7. Mexico: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 8. List of Abbreviation
List of Figures
Figure 1. North America Semiconductor Bonding Market Segmentation
Figure 2. North America Semiconductor Bonding Market Segmentation - By Country
Figure 3. North America Semiconductor Bonding Market Overview
Figure 4. North America Semiconductor Bonding Market, by Type
Figure 5. North America Semiconductor Bonding Market, by Application
Figure 6. North America Semiconductor Bonding Market, by Country
Figure 7. North America - PEST Analysis
Figure 8. North America Semiconductor Bonding Market- Ecosystem Analysis
Figure 9. Expert Opinions
Figure 10. North America Semiconductor Bonding Market Impact Analysis of Drivers and Restraints
Figure 11. North America Semiconductor Bonding Market Revenue Forecast and Analysis (US$ Million)
Figure 12. North America Semiconductor Bonding Market, By Type (2021 and 2028)
Figure 13. North America Die Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 14. North America Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 15. North America Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 16. North America Semiconductor Bonding Market, By Application (2021 and 2028)
Figure 17. North America RF Devices: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 18. North America MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 19. North America LED: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 20. North America 3D NAND: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 21. North America CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 22. North America: Semiconductor Bonding Market, by Key Country- Revenue (2021) (US$ Million)
Figure 23. North America: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
Figure 24. US: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 25. Canada: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 26. Mexico: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Companies Mentioned
- ASMPT
- DIAS Automation (HK) Ltd.
- EV Group
- Kulicke & Soffa Industries, Inc.
- Palomar Technologies
- Panasonic Corporation
- Toray Industries Inc
- WestBond, Inc.
- Yamaha Motor Corporation
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 110 |
| Published | December 2022 |
| Forecast Period | 2022 - 2028 |
| Estimated Market Value ( USD | $ 134.9 Million |
| Forecasted Market Value ( USD | $ 204.23 Million |
| Compound Annual Growth Rate | 7.2% |
| Regions Covered | North America |
| No. of Companies Mentioned | 9 |
