The semiconductor bonding market in South America is expected to grow from US$ 16.23 million in 2022 to US$ 18.82 million by 2028. It is estimated to grow at a CAGR of 2.5% from 2022 to 2028.
Rising Demand for Hybrid Bonding
The growing need for I/O density and faster connections between chips is transforming system designs that include 3D architectures and hybrid bonding. Hybrid bonding connects power and signal-carrying copper pads and the surrounding dielectric through die-to-wafer or wafer-to-wafer connections, providing up to 1,000X more connections than coppermicrobumps. While accelerating bump density by three orders of magnitude above 2.5D integration techniques, it reduces signal delay to approximately nonexistent levels. Hybrid bonding is currently only used in a few high-end applications, such as processor/cache and HBM (High Bandwidth Memory), but it is expected that its adoption will increase in 3D DRAM, RF modems, and GaN/Si bonding for microLEDs. Hybrid bonding presents a practical alternative to transistor node scaling, where high performance is required. Thus, to meet the enormous demand from high-end processors, HBM, microLED, and other applications, hybrid bonding will create a lucrative opportunity for the growth of the South America semiconductor bonding market during the forecast period. Moreover, various market players are forming joint ventures and agreements to cater to the growing demand for hybrid bonding. Thus, various collaborative approaches by the market players in bringing forward the hybrid bonding technology will further lead to the growth of the South America semiconductor bonding market during the forecast period.Market Overview
South America Semiconductor Bonding Market Segmentation
The South America semiconductor bonding market is segmented into type, application, and country.- Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
- Based on application, the market is segmented into RF devices,MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held the largest market share in 2022.
- Based on country, the market is segmented into Brazil, Argentina, and the Rest of South America. Brazil dominated the market share in 2022.
Table of Contents
1. Introduction1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. SAM Semiconductor Bonding Market Landscape
4.1 Market Overview
4.2 SAM PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinions
5. SAM Semiconductor Bonding Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
5.2 Market Restraints
5.2.1 Fluctuation in the Price of Semiconductor Components
5.3 Market Opportunities
5.3.1 Rising Demand for Hybrid Bonding
5.4 Future Trends
5.4.1 Adoption of Die Bonding in Telecommunication
5.5 Impact Analysis of Drivers and Restraints
6. Semiconductor Bonding Market - SAM Market Analysis
6.1 SAM Semiconductor Bonding Market Overview
6.2 SAM Semiconductor Bonding Market Revenue Forecast and Analysis
7. Semiconductor Bonding Market Revenue and Forecast to 2028 - Type
7.1 SAM Semiconductor Bonding Market, By Type (2021 And 2028)
7.2 Die Bonder
7.2.1 Overview
7.2.2 Die Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.3 Wafer Bonder
7.3.1 Overview
7.3.2 Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.4 Flip Chip Bonder
7.4.1 Overview
7.4.2 Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8. SAM Semiconductor Bonding Market Revenue and Forecast to 2028 - Application
8.1 Overview
8.2 SAM Semiconductor Bonding Market, By Application (2021 And 2028)
8.3 RF Devices
8.3.1 Overview
8.3.2 RF Devices: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.4 MEMS and Sensors
8.4.1 Overview
8.4.2 MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.5 LED
8.5.1 Overview
8.5.2 LED: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.6 3D NAND
8.6.1 Overview
8.6.2 3D NAND: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.7 CMOS Image Sensors
8.7.1 Overview
8.7.2 CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
9. SAM Semiconductor Bonding Market - Country Analysis
9.1 Overview
9.1.1 SAM: Semiconductor Bonding Market, by Key Country
9.1.1.1 Brazil: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.1.1 Brazil: Semiconductor Bonding Market, by Type
9.1.1.1.2 Brazil: Semiconductor Bonding Market, by Application
9.1.1.2 Argentina: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.2.1 Argentina: Semiconductor Bonding Market, by Type
9.1.1.2.2 Argentina: Semiconductor Bonding Market, by Application
9.1.1.3 Rest of SAM: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.3.1 Rest of SAM: Semiconductor Bonding Market, by Type
9.1.1.3.2 Rest of SAM: Semiconductor Bonding Market, by Application
10. Industry Landscape
10.1 Overview
10.2 Market Initiative
10.3 New Product Launch
11. Company Profiles
11.1 Palomar Technologies
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Products and Services
11.1.4 Financial Overview
11.1.5 SWOT Analysis
11.1.6 Key Developments
11.2 Panasonic Corporation
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Products and Services
11.2.4 Financial Overview
11.2.5 SWOT Analysis
11.2.6 Key Developments
11.3 Toray Industries Inc
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Products and Services
11.3.4 Financial Overview
11.3.5 SWOT Analysis
11.3.6 Key Developments
11.4 Kulicke & Soffa Industries, Inc.
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Products and Services
11.4.4 Financial Overview
11.4.5 SWOT Analysis
11.4.6 Key Developments
11.5 ASMPT
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Products and Services
11.5.4 Financial Overview
11.5.5 SWOT Analysis
11.5.6 Key Developments
11.6 Yamaha Motor Corporation
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Products and Services
11.6.4 Financial Overview
11.6.5 SWOT Analysis
11.6.6 Key Developments
11.7 EV Group
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Products and Services
11.7.4 Financial Overview
11.7.5 SWOT Analysis
11.7.6 Key Developments
11.8 WestBond, Inc.
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Products and Services
11.8.4 Financial Overview
11.8.5 SWOT Analysis
11.8.6 Key Developments
12. Appendix
12.1 About the Publisher
12.2 Word Index
List of Tables
Table 1. SAM Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Table 2. Brazil: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 3. Brazil: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 4. Argentina: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 5. Argentina: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 6. Rest of SAM: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
Table 7. Rest of SAM: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 8. List of Abbreviation
List of Figures
Figure 1. SAM Semiconductor Bonding Market Segmentation
Figure 2. SAM Semiconductor Bonding Market Segmentation - By Country
Figure 3. SAM Semiconductor Bonding Market Overview
Figure 4. SAM Semiconductor Bonding Market, by Type
Figure 5. SAM Semiconductor Bonding Market, by Application
Figure 6. SAM Semiconductor Bonding Market, by Country
Figure 7. SAM - PEST Analysis
Figure 8. SAM Semiconductor Bonding Market- Ecosystem Analysis
Figure 9. Expert Opinions
Figure 10. SAM Semiconductor Bonding Market Impact Analysis of Drivers and Restraints
Figure 11. SAM Semiconductor Bonding Market Revenue Forecast and Analysis (US$ Million)
Figure 12. SAM Semiconductor Bonding Market, By Type (2021 and 2028)
Figure 13. SAM Die Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 14. SAM Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 15. SAM Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 16. SAM Semiconductor Bonding Market, By Application (2021 and 2028)
Figure 17. SAM RF Devices: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 18. SAM MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 19. SAM LED: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 20. SAM 3D NAND: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 21. SAM CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 22. SAM: Semiconductor Bonding Market, by Key Country - Revenue (2021) (US$ Million)
Figure 23. SAM: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
Figure 24. Brazil: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 25. Argentina: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 26. Rest of SAM: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Companies Mentioned
- ASMPT
- EV Group
- Kulicke & Soffa Industries, Inc.
- Palomar Technologies
- Panasonic Corporation
- Toray Industries Inc
- WestBond, Inc.
- Yamaha Motor Corporation
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 106 |
| Published | December 2022 |
| Forecast Period | 2022 - 2028 |
| Estimated Market Value ( USD | $ 16.23 Million |
| Forecasted Market Value ( USD | $ 18.82 Million |
| Compound Annual Growth Rate | 2.5% |
| No. of Companies Mentioned | 8 |
