The Global Through-hole Passive Components Market size is expected to reach $50.3 billion by 2028, rising at a market growth of 5.9% CAGR during the forecast period.
In electronics, passive components that are added to the printed circuit boards (PCB) with the help of through-hole technology are called through-hole passive components. The through-hole technology is a production method in which component leads are inserted through a hole drilled in the PCB. The ends of these leads coming out on the opposite side are soldered to pads, either by using the insertion mount machines or in manual assembly.
Additionally, passive components are modules that do not operate on energy, except for the alternating current (AC) that is available on the circuit to
the component it is connected to. Therefore, passive modules can neither gain power nor be an energy source. Some examples of ordinary passive components are inductors, resistors, capacitors, chassis, or transformers. All passive components share some common properties, which are no power source and no power generation.
A PCB"s performance mainly depends on the quality of the fabrication process with the proper components and assembly method selection. While a PCB can be assembled in three primary ways, namely surface-mount technology, through-hole technology (THT), and mixed technology, THT methods are widely adopted because of this technology"s high reliability.
Additionally, some PCB assemblies may also need the implementation of more than one technology. For devices and equipment that are used in harsh working environments and therefore demand high reliability, like those involved in the aerospace and military, the THT method is preferred for the assembly of PCB. Certain applications like industrial control circuits and communication hardware require additional assembly methods along with THT.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.
In electronics, passive components that are added to the printed circuit boards (PCB) with the help of through-hole technology are called through-hole passive components. The through-hole technology is a production method in which component leads are inserted through a hole drilled in the PCB. The ends of these leads coming out on the opposite side are soldered to pads, either by using the insertion mount machines or in manual assembly.
Additionally, passive components are modules that do not operate on energy, except for the alternating current (AC) that is available on the circuit to
the component it is connected to. Therefore, passive modules can neither gain power nor be an energy source. Some examples of ordinary passive components are inductors, resistors, capacitors, chassis, or transformers. All passive components share some common properties, which are no power source and no power generation.
A PCB"s performance mainly depends on the quality of the fabrication process with the proper components and assembly method selection. While a PCB can be assembled in three primary ways, namely surface-mount technology, through-hole technology (THT), and mixed technology, THT methods are widely adopted because of this technology"s high reliability.
Additionally, some PCB assemblies may also need the implementation of more than one technology. For devices and equipment that are used in harsh working environments and therefore demand high reliability, like those involved in the aerospace and military, the THT method is preferred for the assembly of PCB. Certain applications like industrial control circuits and communication hardware require additional assembly methods along with THT.
COVID-19 Impact Analysis
The pandemic significantly affected the passive components manufacturing industry and, specifically, had a negative effect on the through-hole passive components market. The temporary shutdown of manufacturing facilities and limitation of movement across international borders of several countries led to a decrease in passive components’ sales. Most industrialized nations were adversely affected, and to combat the spread of virus, the governments closed marketplaces as well. This led to a downfall in the consumption of electronic gadgets, the effects of which rippled to the passive components industry as well.Market Growth Factors
High use of through-hole components in connectors
Connectors are the most widely used electronic equipment. Virtually millions of connectors are used and manufactured each week in almost all electronic industries. Connectors use through-hole passive components owing to their high reliability. The high reliability in these components is achieved as the passive components used in these pieces also go through the board along with being soldered to their place. As a strong connection needs to be maintained between the printed circuit boards (PCB) and other components, the passive through-hole technology components are used more than the surface mount technology.Rising adoption of electronic components in the automotive industry
The increasing demand for functionality in the automotive industry is resulting in raised incorporation of ECUs and motors. But the lack of real estate on boards, especially with their increased miniaturization of them, is demanding more powerful and compact components. This has propagated the application of through-hole passive components. As a result, manufacturers are now producing parts that deliver the required output in compact sizes.Market Restraining Factor
Availability of alternative faster assembly processes
Though the through-hole assembly of components is preferred for products that require higher robustness and consistency, surface mount assembly still remains more popular. This is mainly because miniaturization is only possible to an extent with through-hole components. In most cases, the through-hole assembly also demands boards of bigger specifications. Additionally, unlike through-hole components, surface mount components are light in weight, and this does not compromise their working. So, they can be used in high-density, compact circuits.Leads Model Outlook
On the basis of leads model, the through-hole passive components market is divided into axial leads and radial leads. The axial leads segment recorded the largest revenue share in the through-hole passive components market in 2021. Pins protruding from both ends of the component are called axial leads. Electrolytic capacitors, carbon, diodes, wire-wrapped resistors, and numerous other components incorporate axial leads.Application Outlook
Based on application, the through-hole passive components market is segmented into consumer electronics, IT & telecom, automotive, industrial, aerospace & defense, healthcare & life sciences, and others. The industrial segment procured a remarkable growth rate in the through-hole passive components market in 2021. The increasing use of sensor-based devices, robotic systems, and security cameras in various industrial applications like remote monitoring and process automation are the primary factors guiding the growth of the segment.Component Outlook
Based on component, the through-hole passive components market is categorized into resistors, capacitors, inductors, diodes, transducers, sensors, and others. The capacitors segment garnered the highest revenue share in the through-hole passive components market in 2021. The growth of the segment is attributed to the increasing demand for electrical and electronic products in industries like industrial, automotive, telecommunication, and healthcare.
Regional Outlook
On the basis of region, the through-hole passive components market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment recorded the highest revenue share in the through-hole passive components market in 2021. The growth of the segment is attributable to the robust development it provides to manufacturers to supply these components to its multiple growing sectors like consumer electronics, industrial, and automotive.The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.
Scope of the Study
By Leads Model
- Axial
- Radial
By Application
- Consumer Electronics
- Automotive
- Industrial
- IT & Telecom
- Aerospace & Defense
- Healthcare & Life Sciences
- Others
By Component
- Capacitors
- Resistors
- Inductors
- Sensors
- Diodes
- Transducers
- Others
By Geography
- North America
- US
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
- LAMEA
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Vishay Intertechnology, Inc
- Yageo Corporation
- Murata Manufacturing Co., Ltd.
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Panasonic Corporation
- Bourns, Inc.
- TDK Corporation
- TE Connectivity
- Microchip Technology, Inc.
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- Exhaustive coverage
- The highest number of market tables and figures
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Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Through-hole Passive Components Market, by Leads Model
1.4.2 Global Through-hole Passive Components Market, by Application
1.4.3 Global Through-hole Passive Components Market, by Component
1.4.4 Global Through-hole Passive Components Market, by Geography
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Global Through-hole Passive Components Market by Leads Model
3.1 Global Axial Market by Region
3.2 Global Radial Market by Region
Chapter 4. Global Through-hole Passive Components Market by Application
4.1 Global Consumer Electronics Market by Region
4.2 Global Automotive Market by Region
4.3 Global Industrial Market by Region
4.4 Global IT & Telecom Market by Region
4.5 Global Aerospace & Defense Market by Region
4.6 Global Healthcare & Life Sciences Market by Region
4.7 Global Other Application Market by Region
Chapter 5. Global Through-hole Passive Components Market by Component
5.1 Global Capacitors Market by Region
5.2 Global Resistors Market by Region
5.3 Global Inductors Market by Region
5.4 Global Sensors Market by Region
5.5 Global Diodes Market by Region
5.6 Global Transducers Market by Region
5.7 Global Others Market by Region
Chapter 6. Global Through-hole Passive Components Market by Region
6.1 North America Through-hole Passive Components Market
6.1.1 North America Through-hole Passive Components Market by Leads Model
6.1.1.1 North America Axial Market by Country
6.1.1.2 North America Radial Market by Country
6.1.2 North America Through-hole Passive Components Market by Application
6.1.2.1 North America Consumer Electronics Market by Country
6.1.2.2 North America Automotive Market by Country
6.1.2.3 North America Industrial Market by Country
6.1.2.4 North America IT & Telecom Market by Country
6.1.2.5 North America Aerospace & Defense Market by Country
6.1.2.6 North America Healthcare & Life Sciences Market by Country
6.1.2.7 North America Other Application Market by Country
6.1.3 North America Through-hole Passive Components Market by Component
6.1.3.1 North America Capacitors Market by Country
6.1.3.2 North America Resistors Market by Country
6.1.3.3 North America Inductors Market by Country
6.1.3.4 North America Sensors Market by Country
6.1.3.5 North America Diodes Market by Country
6.1.3.6 North America Transducers Market by Country
6.1.3.7 North America Others Market by Country
6.1.4 North America Through-hole Passive Components Market by Country
6.1.4.1 US Through-hole Passive Components Market
6.1.4.1.1 US Through-hole Passive Components Market by Leads Model
6.1.4.1.2 US Through-hole Passive Components Market by Application
6.1.4.1.3 US Through-hole Passive Components Market by Component
6.1.4.2 Canada Through-hole Passive Components Market
6.1.4.2.1 Canada Through-hole Passive Components Market by Leads Model
6.1.4.2.2 Canada Through-hole Passive Components Market by Application
6.1.4.2.3 Canada Through-hole Passive Components Market by Component
6.1.4.3 Mexico Through-hole Passive Components Market
6.1.4.3.1 Mexico Through-hole Passive Components Market by Leads Model
6.1.4.3.2 Mexico Through-hole Passive Components Market by Application
6.1.4.3.3 Mexico Through-hole Passive Components Market by Component
6.1.4.4 Rest of North America Through-hole Passive Components Market
6.1.4.4.1 Rest of North America Through-hole Passive Components Market by Leads Model
6.1.4.4.2 Rest of North America Through-hole Passive Components Market by Application
6.1.4.4.3 Rest of North America Through-hole Passive Components Market by Component
6.2 Europe Through-hole Passive Components Market
6.2.1 Europe Through-hole Passive Components Market by Leads Model
6.2.1.1 Europe Axial Market by Country
6.2.1.2 Europe Radial Market by Country
6.2.2 Europe Through-hole Passive Components Market by Application
6.2.2.1 Europe Consumer Electronics Market by Country
6.2.2.2 Europe Automotive Market by Country
6.2.2.3 Europe Industrial Market by Country
6.2.2.4 Europe IT & Telecom Market by Country
6.2.2.5 Europe Aerospace & Defense Market by Country
6.2.2.6 Europe Healthcare & Life Sciences Market by Country
6.2.2.7 Europe Other Application Market by Country
6.2.3 Europe Through-hole Passive Components Market by Component
6.2.3.1 Europe Capacitors Market by Country
6.2.3.2 Europe Resistors Market by Country
6.2.3.3 Europe Inductors Market by Country
6.2.3.4 Europe Sensors Market by Country
6.2.3.5 Europe Diodes Market by Country
6.2.3.6 Europe Transducers Market by Country
6.2.3.7 Europe Others Market by Country
6.2.4 Europe Through-hole Passive Components Market by Country
6.2.4.1 Germany Through-hole Passive Components Market
6.2.4.1.1 Germany Through-hole Passive Components Market by Leads Model
6.2.4.1.2 Germany Through-hole Passive Components Market by Application
6.2.4.1.3 Germany Through-hole Passive Components Market by Component
6.2.4.2 UK Through-hole Passive Components Market
6.2.4.2.1 UK Through-hole Passive Components Market by Leads Model
6.2.4.2.2 UK Through-hole Passive Components Market by Application
6.2.4.2.3 UK Through-hole Passive Components Market by Component
6.2.4.3 France Through-hole Passive Components Market
6.2.4.3.1 France Through-hole Passive Components Market by Leads Model
6.2.4.3.2 France Through-hole Passive Components Market by Application
6.2.4.3.3 France Through-hole Passive Components Market by Component
6.2.4.4 Russia Through-hole Passive Components Market
6.2.4.4.1 Russia Through-hole Passive Components Market by Leads Model
6.2.4.4.2 Russia Through-hole Passive Components Market by Application
6.2.4.4.3 Russia Through-hole Passive Components Market by Component
6.2.4.5 Spain Through-hole Passive Components Market
6.2.4.5.1 Spain Through-hole Passive Components Market by Leads Model
6.2.4.5.2 Spain Through-hole Passive Components Market by Application
6.2.4.5.3 Spain Through-hole Passive Components Market by Component
6.2.4.6 Italy Through-hole Passive Components Market
6.2.4.6.1 Italy Through-hole Passive Components Market by Leads Model
6.2.4.6.2 Italy Through-hole Passive Components Market by Application
6.2.4.6.3 Italy Through-hole Passive Components Market by Component
6.2.4.7 Rest of Europe Through-hole Passive Components Market
6.2.4.7.1 Rest of Europe Through-hole Passive Components Market by Leads Model
6.2.4.7.2 Rest of Europe Through-hole Passive Components Market by Application
6.2.4.7.3 Rest of Europe Through-hole Passive Components Market by Component
6.3 Asia Pacific Through-hole Passive Components Market
6.3.1 Asia Pacific Through-hole Passive Components Market by Leads Model
6.3.1.1 Asia Pacific Axial Market by Country
6.3.1.2 Asia Pacific Radial Market by Country
6.3.2 Asia Pacific Through-hole Passive Components Market by Application
6.3.2.1 Asia Pacific Consumer Electronics Market by Country
6.3.2.2 Asia Pacific Automotive Market by Country
6.3.2.3 Asia Pacific Industrial Market by Country
6.3.2.4 Asia Pacific IT & Telecom Market by Country
6.3.2.5 Asia Pacific Aerospace & Defense Market by Country
6.3.2.6 Asia Pacific Healthcare & Life Sciences Market by Country
6.3.2.7 Asia Pacific Other Application Market by Country
6.3.3 Asia Pacific Through-hole Passive Components Market by Component
6.3.3.1 Asia Pacific Capacitors Market by Country
6.3.3.2 Asia Pacific Resistors Market by Country
6.3.3.3 Asia Pacific Inductors Market by Country
6.3.3.4 Asia Pacific Sensors Market by Country
6.3.3.5 Asia Pacific Diodes Market by Country
6.3.3.6 Asia Pacific Transducers Market by Country
6.3.3.7 Asia Pacific Others Market by Country
6.3.4 Asia Pacific Through-hole Passive Components Market by Country
6.3.4.1 China Through-hole Passive Components Market
6.3.4.1.1 China Through-hole Passive Components Market by Leads Model
6.3.4.1.2 China Through-hole Passive Components Market by Application
6.3.4.1.3 China Through-hole Passive Components Market by Component
6.3.4.2 Japan Through-hole Passive Components Market
6.3.4.2.1 Japan Through-hole Passive Components Market by Leads Model
6.3.4.2.2 Japan Through-hole Passive Components Market by Application
6.3.4.2.3 Japan Through-hole Passive Components Market by Component
6.3.4.3 India Through-hole Passive Components Market
6.3.4.3.1 India Through-hole Passive Components Market by Leads Model
6.3.4.3.2 India Through-hole Passive Components Market by Application
6.3.4.3.3 India Through-hole Passive Components Market by Component
6.3.4.4 South Korea Through-hole Passive Components Market
6.3.4.4.1 South Korea Through-hole Passive Components Market by Leads Model
6.3.4.4.2 South Korea Through-hole Passive Components Market by Application
6.3.4.4.3 South Korea Through-hole Passive Components Market by Component
6.3.4.5 Singapore Through-hole Passive Components Market
6.3.4.5.1 Singapore Through-hole Passive Components Market by Leads Model
6.3.4.5.2 Singapore Through-hole Passive Components Market by Application
6.3.4.5.3 Singapore Through-hole Passive Components Market by Component
6.3.4.6 Malaysia Through-hole Passive Components Market
6.3.4.6.1 Malaysia Through-hole Passive Components Market by Leads Model
6.3.4.6.2 Malaysia Through-hole Passive Components Market by Application
6.3.4.6.3 Malaysia Through-hole Passive Components Market by Component
6.3.4.7 Rest of Asia Pacific Through-hole Passive Components Market
6.3.4.7.1 Rest of Asia Pacific Through-hole Passive Components Market by Leads Model
6.3.4.7.2 Rest of Asia Pacific Through-hole Passive Components Market by Application
6.3.4.7.3 Rest of Asia Pacific Through-hole Passive Components Market by Component
6.4 LAMEA Through-hole Passive Components Market
6.4.1 LAMEA Through-hole Passive Components Market by Leads Model
6.4.1.1 LAMEA Axial Market by Country
6.4.1.2 LAMEA Radial Market by Country
6.4.2 LAMEA Through-hole Passive Components Market by Application
6.4.2.1 LAMEA Consumer Electronics Market by Country
6.4.2.2 LAMEA Automotive Market by Country
6.4.2.3 LAMEA Industrial Market by Country
6.4.2.4 LAMEA IT & Telecom Market by Country
6.4.2.5 LAMEA Aerospace & Defense Market by Country
6.4.2.6 LAMEA Healthcare & Life Sciences Market by Country
6.4.2.7 LAMEA Other Application Market by Country
6.4.3 LAMEA Through-hole Passive Components Market by Component
6.4.3.1 LAMEA Capacitors Market by Country
6.4.3.2 LAMEA Resistors Market by Country
6.4.3.3 LAMEA Inductors Market by Country
6.4.3.4 LAMEA Sensors Market by Country
6.4.3.5 LAMEA Diodes Market by Country
6.4.3.6 LAMEA Transducers Market by Country
6.4.3.7 LAMEA Others Market by Country
6.4.4 LAMEA Through-hole Passive Components Market by Country
6.4.4.1 Brazil Through-hole Passive Components Market
6.4.4.1.1 Brazil Through-hole Passive Components Market by Leads Model
6.4.4.1.2 Brazil Through-hole Passive Components Market by Application
6.4.4.1.3 Brazil Through-hole Passive Components Market by Component
6.4.4.2 Argentina Through-hole Passive Components Market
6.4.4.2.1 Argentina Through-hole Passive Components Market by Leads Model
6.4.4.2.2 Argentina Through-hole Passive Components Market by Application
6.4.4.2.3 Argentina Through-hole Passive Components Market by Component
6.4.4.3 UAE Through-hole Passive Components Market
6.4.4.3.1 UAE Through-hole Passive Components Market by Leads Model
6.4.4.3.2 UAE Through-hole Passive Components Market by Application
6.4.4.3.3 UAE Through-hole Passive Components Market by Component
6.4.4.4 Saudi Arabia Through-hole Passive Components Market
6.4.4.4.1 Saudi Arabia Through-hole Passive Components Market by Leads Model
6.4.4.4.2 Saudi Arabia Through-hole Passive Components Market by Application
6.4.4.4.3 Saudi Arabia Through-hole Passive Components Market by Component
6.4.4.5 South Africa Through-hole Passive Components Market
6.4.4.5.1 South Africa Through-hole Passive Components Market by Leads Model
6.4.4.5.2 South Africa Through-hole Passive Components Market by Application
6.4.4.5.3 South Africa Through-hole Passive Components Market by Component
6.4.4.6 Nigeria Through-hole Passive Components Market
6.4.4.6.1 Nigeria Through-hole Passive Components Market by Leads Model
6.4.4.6.2 Nigeria Through-hole Passive Components Market by Application
6.4.4.6.3 Nigeria Through-hole Passive Components Market by Component
6.4.4.7 Rest of LAMEA Through-hole Passive Components Market
6.4.4.7.1 Rest of LAMEA Through-hole Passive Components Market by Leads Model
6.4.4.7.2 Rest of LAMEA Through-hole Passive Components Market by Application
6.4.4.7.3 Rest of LAMEA Through-hole Passive Components Market by Component
Chapter 7. Company Profiles
7.1 Panasonic Corporation
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 TE Connectivity Ltd.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.4 Yageo Corporation
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional and Segmental Analysis
7.4.4 Recent strategies and developments:
7.4.4.1 Acquisition and Mergers:
7.5 Microchip Technology, Inc.
7.5.1 Company overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.6 Murata Manufacturing Co., Ltd.
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.7 Vishay Intertechnology, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research and Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.8 KYOCERA AVX Components Corporation (Kyocera Corporation)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.9 Bourns, Inc.
7.9.1 Company Overview
Companies Mentioned
- Vishay Intertechnology, Inc
- Yageo Corporation
- Murata Manufacturing Co., Ltd.
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Panasonic Corporation
- Bourns, Inc.
- TDK Corporation
- TE Connectivity
- Microchip Technology, Inc.
Methodology
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