The Europe Through-hole Passive Components Market should witness market growth of 5.2% CAGR during the forecast period (2022-2028).
The increasing penetration of IoT and interconnected devices and the demand for digitalization and electronic devices in automobile and medical industries are further increasing the need for through-hole passive components. Additionally, industrial computers employed for the operation of mechanical and electrical processes, often referred to as programmable logic controllers (PLC), are also assembled with through-hole passive components.
The high demand for the through-hole passive components is also because of Industry 4.0, which is guiding the implementation of automation and robotics along with cloud computing, big data, and 5G. Furthermore, numerous governments globally are supporting initiatives that aim to assist industrial automation, widening the growth prospects for the technology’s implementation.
Additionally, the growing implementation of connected devices like security systems, gaming consoles, smart meters, smartphones, and home appliances, across various industries is driving innovation in the through-hole passive components’ development and usage. Manufacturers of these technologies are also paying attention to the provision of breakthrough solutions to guide the use of connected devices. Furthermore, the increasing number of battery-operated connected applications are demanding batteries with prolonged life to lower the need for maintenance or replacement, which has expedited the innovation drive in this industry.
The European region holds a strategically important asset in the application of semiconductors. Success in the development of semiconductor technology depends on a mix of manufacturing (fabrication and equipment) and advanced engineering (design and research) capabilities. Combining these abilities has been well-known strength of the region, like in the automotive sector. This is spurring the additional advancements in mature semiconductor technology, which would scale into the rest of the industrial ecosystem. As a consequence, the demand for essential passive components is increasing in the region.
The Germany market dominated the Europe Through-hole Passive Components Market by Country in 2021; thereby, achieving a market value of $3, 148.3 million by 2028. The UK market is exhibiting a CAGR of 4.3% during (2022-2028). Additionally, The France market would experience a CAGR of 6% during (2022-2028).
Based on Leads Model, the market is segmented into Axial and Radial. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, IT & Telecom, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on Component, the market is segmented into Capacitors, Resistors, Inductors, Sensors, Diodes, Transducers and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.
The increasing penetration of IoT and interconnected devices and the demand for digitalization and electronic devices in automobile and medical industries are further increasing the need for through-hole passive components. Additionally, industrial computers employed for the operation of mechanical and electrical processes, often referred to as programmable logic controllers (PLC), are also assembled with through-hole passive components.
The high demand for the through-hole passive components is also because of Industry 4.0, which is guiding the implementation of automation and robotics along with cloud computing, big data, and 5G. Furthermore, numerous governments globally are supporting initiatives that aim to assist industrial automation, widening the growth prospects for the technology’s implementation.
Additionally, the growing implementation of connected devices like security systems, gaming consoles, smart meters, smartphones, and home appliances, across various industries is driving innovation in the through-hole passive components’ development and usage. Manufacturers of these technologies are also paying attention to the provision of breakthrough solutions to guide the use of connected devices. Furthermore, the increasing number of battery-operated connected applications are demanding batteries with prolonged life to lower the need for maintenance or replacement, which has expedited the innovation drive in this industry.
The European region holds a strategically important asset in the application of semiconductors. Success in the development of semiconductor technology depends on a mix of manufacturing (fabrication and equipment) and advanced engineering (design and research) capabilities. Combining these abilities has been well-known strength of the region, like in the automotive sector. This is spurring the additional advancements in mature semiconductor technology, which would scale into the rest of the industrial ecosystem. As a consequence, the demand for essential passive components is increasing in the region.
The Germany market dominated the Europe Through-hole Passive Components Market by Country in 2021; thereby, achieving a market value of $3, 148.3 million by 2028. The UK market is exhibiting a CAGR of 4.3% during (2022-2028). Additionally, The France market would experience a CAGR of 6% during (2022-2028).
Based on Leads Model, the market is segmented into Axial and Radial. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, IT & Telecom, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on Component, the market is segmented into Capacitors, Resistors, Inductors, Sensors, Diodes, Transducers and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.
Scope of the Study
By Leads Model
- Axial
- Radial
By Application
- Consumer Electronics
- Automotive
- Industrial
- IT & Telecom
- Aerospace & Defense
- Healthcare & Life Sciences
- Others
By Component
- Capacitors
- Resistors
- Inductors
- Sensors
- Diodes
- Transducers
- Others
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- Vishay Intertechnology, Inc
- Yageo Corporation
- Murata Manufacturing Co., Ltd.
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Panasonic Corporation
- Bourns, Inc.
- TDK Corporation
- TE Connectivity
- Microchip Technology, Inc.
Unique Offerings
- Exhaustive coverage
- The highest number of market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Through-hole Passive Components Market, by Leads Model
1.4.2 Europe Through-hole Passive Components Market, by Application
1.4.3 Europe Through-hole Passive Components Market, by Component
1.4.4 Europe Through-hole Passive Components Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Europe Through-hole Passive Components Market by Leads Model
3.1 Europe Axial Market by Country
3.2 Europe Radial Market by Country
Chapter 4. Europe Through-hole Passive Components Market by Application
4.1 Europe Consumer Electronics Market by Country
4.2 Europe Automotive Market by Country
4.3 Europe Industrial Market by Country
4.4 Europe IT & Telecom Market by Country
4.5 Europe Aerospace & Defense Market by Country
4.6 Europe Healthcare & Life Sciences Market by Country
4.7 Europe Other Application Market by Country
Chapter 5. Europe Through-hole Passive Components Market by Component
5.1 Europe Capacitors Market by Country
5.2 Europe Resistors Market by Country
5.3 Europe Inductors Market by Country
5.4 Europe Sensors Market by Country
5.5 Europe Diodes Market by Country
5.6 Europe Transducers Market by Country
5.7 Europe Others Market by Country
Chapter 6. Europe Through-hole Passive Components Market by Country
6.1 Germany Through-hole Passive Components Market
6.1.1 Germany Through-hole Passive Components Market by Leads Model
6.1.2 Germany Through-hole Passive Components Market by Application
6.1.3 Germany Through-hole Passive Components Market by Component
6.2 UK Through-hole Passive Components Market
6.2.1 UK Through-hole Passive Components Market by Leads Model
6.2.2 UK Through-hole Passive Components Market by Application
6.2.3 UK Through-hole Passive Components Market by Component
6.3 France Through-hole Passive Components Market
6.3.1 France Through-hole Passive Components Market by Leads Model
6.3.2 France Through-hole Passive Components Market by Application
6.3.3 France Through-hole Passive Components Market by Component
6.4 Russia Through-hole Passive Components Market
6.4.1 Russia Through-hole Passive Components Market by Leads Model
6.4.2 Russia Through-hole Passive Components Market by Application
6.4.3 Russia Through-hole Passive Components Market by Component
6.5 Spain Through-hole Passive Components Market
6.5.1 Spain Through-hole Passive Components Market by Leads Model
6.5.2 Spain Through-hole Passive Components Market by Application
6.5.3 Spain Through-hole Passive Components Market by Component
6.6 Italy Through-hole Passive Components Market
6.6.1 Italy Through-hole Passive Components Market by Leads Model
6.6.2 Italy Through-hole Passive Components Market by Application
6.6.3 Italy Through-hole Passive Components Market by Component
6.7 Rest of Europe Through-hole Passive Components Market
6.7.1 Rest of Europe Through-hole Passive Components Market by Leads Model
6.7.2 Rest of Europe Through-hole Passive Components Market by Application
6.7.3 Rest of Europe Through-hole Passive Components Market by Component
Chapter 7. Company Profiles
7.1 Panasonic Corporation
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 TE Connectivity Ltd.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.4 Yageo Corporation
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional and Segmental Analysis
7.4.4 Recent strategies and developments:
7.4.4.1 Acquisition and Mergers:
7.5 Microchip Technology, Inc.
7.5.1 Company overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.6 Murata Manufacturing Co., Ltd.
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.7 Vishay Intertechnology, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research and Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.8 KYOCERA AVX Components Corporation (Kyocera Corporation)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.9 Bourns, Inc.
7.9.1 Company Overview
Companies Mentioned
- Vishay Intertechnology, Inc
- Yageo Corporation
- Murata Manufacturing Co., Ltd.
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Panasonic Corporation
- Bourns, Inc.
- TDK Corporation
- TE Connectivity
- Microchip Technology, Inc.
Methodology
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