Embedded Die Packaging Technology Market By Platform, By Industry Vertical: Global Opportunity Analysis and Industry Forecast, 2021-2031

Table of Contents

CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.3.1. Moderate bargaining power of suppliers
3.3.2. Moderate bargaining power of buyers
3.3.3. Moderate threat of substitutes
3.3.4. Moderate threat of new entrants
3.3.5. Moderate intensity of rivalry
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Impending need for circuit miniaturization in microelectronic devices
3.4.1.2. Advantages over other packaging technologies
3.4.1.3. Increase in demand for consumer electronics and 5G network technology
3.4.2. Restraints
3.4.2.1. High initial cost
3.4.3. Opportunities
3.4.3.1. Rise in trend of Internet of Things (IoT)
3.5. COVID-19 Impact Analysis on the market

CHAPTER 4: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM
4.1. Overview
4.1.1. Market size and forecast
4.2. Embedded Die in IC Package Substrate
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Embedded Die in Rigid Board
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Embedded Die in Flexible Board
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country

CHAPTER 5: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL
5.1. Overview
5.1.1. Market size and forecast
5.2. Consumer Electronics
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. IT and Telecommunication
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
5.4. Automotive
5.4.1. Key market trends, growth factors and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis by country
5.5. Healthcare
5.5.1. Key market trends, growth factors and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market share analysis by country
5.6. Others
5.6.1. Key market trends, growth factors and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market share analysis by country

CHAPTER 6: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY REGION
6.1. Overview
6.1.1. Market size and forecast By Region
6.2. North America
6.2.1. Key trends and opportunities
6.2.2. Market size and forecast, by Platform
6.2.3. Market size and forecast, by Industry Vertical
6.2.4. Market size and forecast, by country
6.2.4.1. U.S.
6.2.4.1.1. Key market trends, growth factors and opportunities
6.2.4.1.2. Market size and forecast, by Platform
6.2.4.1.3. Market size and forecast, by Industry Vertical
6.2.4.2. Canada
6.2.4.2.1. Key market trends, growth factors and opportunities
6.2.4.2.2. Market size and forecast, by Platform
6.2.4.2.3. Market size and forecast, by Industry Vertical
6.2.4.3. Mexico
6.2.4.3.1. Key market trends, growth factors and opportunities
6.2.4.3.2. Market size and forecast, by Platform
6.2.4.3.3. Market size and forecast, by Industry Vertical
6.3. Europe
6.3.1. Key trends and opportunities
6.3.2. Market size and forecast, by Platform
6.3.3. Market size and forecast, by Industry Vertical
6.3.4. Market size and forecast, by country
6.3.4.1. UK
6.3.4.1.1. Key market trends, growth factors and opportunities
6.3.4.1.2. Market size and forecast, by Platform
6.3.4.1.3. Market size and forecast, by Industry Vertical
6.3.4.2. Germany
6.3.4.2.1. Key market trends, growth factors and opportunities
6.3.4.2.2. Market size and forecast, by Platform
6.3.4.2.3. Market size and forecast, by Industry Vertical
6.3.4.3. France
6.3.4.3.1. Key market trends, growth factors and opportunities
6.3.4.3.2. Market size and forecast, by Platform
6.3.4.3.3. Market size and forecast, by Industry Vertical
6.3.4.4. Rest of Europe
6.3.4.4.1. Key market trends, growth factors and opportunities
6.3.4.4.2. Market size and forecast, by Platform
6.3.4.4.3. Market size and forecast, by Industry Vertical
6.4. Asia-Pacific
6.4.1. Key trends and opportunities
6.4.2. Market size and forecast, by Platform
6.4.3. Market size and forecast, by Industry Vertical
6.4.4. Market size and forecast, by country
6.4.4.1. China
6.4.4.1.1. Key market trends, growth factors and opportunities
6.4.4.1.2. Market size and forecast, by Platform
6.4.4.1.3. Market size and forecast, by Industry Vertical
6.4.4.2. Japan
6.4.4.2.1. Key market trends, growth factors and opportunities
6.4.4.2.2. Market size and forecast, by Platform
6.4.4.2.3. Market size and forecast, by Industry Vertical
6.4.4.3. Taiwan
6.4.4.3.1. Key market trends, growth factors and opportunities
6.4.4.3.2. Market size and forecast, by Platform
6.4.4.3.3. Market size and forecast, by Industry Vertical
6.4.4.4. India
6.4.4.4.1. Key market trends, growth factors and opportunities
6.4.4.4.2. Market size and forecast, by Platform
6.4.4.4.3. Market size and forecast, by Industry Vertical
6.4.4.5. South Korea
6.4.4.5.1. Key market trends, growth factors and opportunities
6.4.4.5.2. Market size and forecast, by Platform
6.4.4.5.3. Market size and forecast, by Industry Vertical
6.4.4.6. Rest of Asia-Pacific
6.4.4.6.1. Key market trends, growth factors and opportunities
6.4.4.6.2. Market size and forecast, by Platform
6.4.4.6.3. Market size and forecast, by Industry Vertical
6.5. LAMEA
6.5.1. Key trends and opportunities
6.5.2. Market size and forecast, by Platform
6.5.3. Market size and forecast, by Industry Vertical
6.5.4. Market size and forecast, by country
6.5.4.1. Latin America
6.5.4.1.1. Key market trends, growth factors and opportunities
6.5.4.1.2. Market size and forecast, by Platform
6.5.4.1.3. Market size and forecast, by Industry Vertical
6.5.4.2. Middle East
6.5.4.2.1. Key market trends, growth factors and opportunities
6.5.4.2.2. Market size and forecast, by Platform
6.5.4.2.3. Market size and forecast, by Industry Vertical
6.5.4.3. Africa
6.5.4.3.1. Key market trends, growth factors and opportunities
6.5.4.3.2. Market size and forecast, by Platform
6.5.4.3.3. Market size and forecast, by Industry Vertical

CHAPTER 7: COMPETITIVE LANDSCAPE
7.1. Introduction
7.2. Top winning Strategies
7.3. Product Mapping of Top 10 Player
7.4. Competitive Dashboard
7.5. Competitive Heatmap
7.6. Top player positioning, 2021

CHAPTER 8: COMPANY PROFILES
8.1. Amkor Technology Inc.
8.1.1. Company overview
8.1.2. Key Executives
8.1.3. Company snapshot
8.1.4. Operating business segments
8.1.5. Product portfolio
8.1.6. Business performance
8.1.7. Key strategic moves and developments
8.2. ASE GROUP
8.2.1. Company overview
8.2.2. Key Executives
8.2.3. Company snapshot
8.2.4. Operating business segments
8.2.5. Product portfolio
8.2.6. Business performance
8.2.7. Key strategic moves and developments
8.3. AT&S Group
8.3.1. Company overview
8.3.2. Key Executives
8.3.3. Company snapshot
8.3.4. Operating business segments
8.3.5. Product portfolio
8.3.6. Business performance
8.3.7. Key strategic moves and developments
8.4. Fujikura
8.4.1. Company overview
8.4.2. Key Executives
8.4.3. Company snapshot
8.4.4. Operating business segments
8.4.5. Product portfolio
8.4.6. Business performance
8.4.7. Key strategic moves and developments
8.5. General Electric
8.5.1. Company overview
8.5.2. Key Executives
8.5.3. Company snapshot
8.5.4. Operating business segments
8.5.5. Product portfolio
8.5.6. Business performance
8.6. Infenion Technologies AG
8.6.1. Company overview
8.6.2. Key Executives
8.6.3. Company snapshot
8.6.4. Operating business segments
8.6.5. Product portfolio
8.6.6. Business performance
8.6.7. Key strategic moves and developments
8.7. Microsemi
8.7.1. Company overview
8.7.2. Key Executives
8.7.3. Company snapshot
8.7.4. Operating business segments
8.7.5. Product portfolio
8.7.6. Business performance
8.8. SCHWEIZER ELECTRONIC AG
8.8.1. Company overview
8.8.2. Key Executives
8.8.3. Company snapshot
8.8.4. Operating business segments
8.8.5. Product portfolio
8.8.6. Business performance
8.8.7. Key strategic moves and developments
8.9. Taiwan Semiconductor Manufacturing Company Limited
8.9.1. Company overview
8.9.2. Key Executives
8.9.3. Company snapshot
8.9.4. Operating business segments
8.9.5. Product portfolio
8.9.6. Business performance
8.9.7. Key strategic moves and developments
8.10. TDK Corporation
8.10.1. Company overview
8.10.2. Key Executives
8.10.3. Company snapshot
8.10.4. Operating business segments
8.10.5. Product portfolio
8.10.6. Business performance
8.10.7. Key strategic moves and developments

List of Tables
Table 01. Global Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 02. Embedded Die Packaging Technology Market for Embedded Die in Ic Package Substrate, by Region, 2021-2031 (Revenue, $Million)
Table 03. Embedded Die Packaging Technology Market for Embedded Die in Rigid Board, by Region, 2021-2031 (Revenue, $Million)
Table 04. Embedded Die Packaging Technology Market for Embedded Die in Flexible Board, by Region, 2021-2031 (Revenue, $Million)
Table 05. Global Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 06. Embedded Die Packaging Technology Market for Consumer Electronics, by Region, 2021-2031 (Revenue, $Million)
Table 07. Embedded Die Packaging Technology Market for IT and Telecommunication, by Region, 2021-2031 (Revenue, $Million)
Table 08. Embedded Die Packaging Technology Market for Automotive, by Region, 2021-2031 (Revenue, $Million)
Table 09. Embedded Die Packaging Technology Market for Healthcare, by Region, 2021-2031 (Revenue, $Million)
Table 10. Embedded Die Packaging Technology Market for Others, by Region, 2021-2031 (Revenue, $Million)
Table 11. Embedded Die Packaging Technology Market, by Region, 2021-2031 (Revenue, $Million)
Table 12. North America Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 13. North America Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 14. North America Embedded Die Packaging Technology Market, by Country, 2021-2031 (Revenue, $Million)
Table 15. U.S. Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 16. U.S. Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 17. Canada Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 18. Canada Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 19. Mexico Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 20. Mexico Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 21. Europe Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 22. Europe Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 23. Europe Embedded Die Packaging Technology Market, by Country, 2021-2031 (Revenue, $Million)
Table 24. UK Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 25. UK Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 26. Germany Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 27. Germany Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 28. France Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 29. France Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 30. Rest of Europe Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 31. Rest of Europe Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 32. Asia-Pacific Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 33. Asia-Pacific Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 34. Asia-Pacific Embedded Die Packaging Technology Market, by Country, 2021-2031 (Revenue, $Million)
Table 35. China Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 36. China Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 37. Japan Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 38. Japan Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 39. Taiwan Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 40. Taiwan Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 41. India Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 42. India Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 43. South Korea Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 44. South Korea Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 45. Rest of Asia-Pacific Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 46. Rest of Asia-Pacific Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 47. LAMEA Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 48. LAMEA Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 49. LAMEA Embedded Die Packaging Technology Market, by Country, 2021-2031 (Revenue, $Million)
Table 50. Latin America Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 51. Latin America Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 52. Middle East Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 53. Middle East Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 54. Africa Embedded Die Packaging Technology Market, by Platform, 2021-2031 (Revenue, $Million)
Table 55. Africa Embedded Die Packaging Technology Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 56. Amkor Technology Inc.: Key Executives
Table 57. Amkor Technology Inc.: Company Snapshot
Table 58. Amkor Technology Inc.: Service Segments
Table 59. Amkor Technology Inc.: Product Portfolio
Table 60. Amkor Technology Inc.: Key Strategies
Table 61. Ase Group: Key Executives
Table 62. Ase Group: Company Snapshot
Table 63. Ase Group: Service Segments
Table 64. Ase Group: Product Portfolio
Table 65. Ase Group: Key Strategies
Table 66. At&S Group: Key Executives
Table 67. At&S Group: Company Snapshot
Table 68. At&S Group: Service Segments
Table 69. At&S Group: Product Portfolio
Table 70. At&S Group: Key Strategies
Table 71. Fujikura: Key Executives
Table 72. Fujikura: Company Snapshot
Table 73. Fujikura: Service Segments
Table 74. Fujikura: Product Portfolio
Table 75. Fujikura: Key Strategies
Table 76. General Electric: Key Executives
Table 77. General Electric: Company Snapshot
Table 78. General Electric: Service Segments
Table 79. General Electric: Product Portfolio
Table 80. Infenion Technologies AG: Key Executives
Table 81. Infenion Technologies AG: Company Snapshot
Table 82. Infenion Technologies AG: Service Segments
Table 83. Infenion Technologies AG: Product Portfolio
Table 84. Infenion Technologies AG: Key Strategies
Table 85. Microsemi: Key Executives
Table 86. Microsemi: Company Snapshot
Table 87. Microsemi: Service Segments
Table 88. Microsemi: Product Portfolio
Table 89. Schweizer Electronic AG: Key Executives
Table 90. Schweizer Electronic AG: Company Snapshot
Table 91. Schweizer Electronic AG: Service Segments
Table 92. Schweizer Electronic AG: Product Portfolio
Table 93. Schweizer Electronic AG: Key Strategies
Table 94. Taiwan Semiconductor Manufacturing Company Limited: Key Executives
Table 95. Taiwan Semiconductor Manufacturing Company Limited: Company Snapshot
Table 96. Taiwan Semiconductor Manufacturing Company Limited: Service Segments
Table 97. Taiwan Semiconductor Manufacturing Company Limited: Product Portfolio
Table 98. Taiwan Semiconductor Manufacturing Company Limited: Key Strategies
Table 99. Tdk Corporation: Key Executives
Table 100. Tdk Corporation: Company Snapshot
Table 101. Tdk Corporation: Product Segments
Table 102. Tdk Corporation: Product Portfolio
Table 103. Tdk Corporation: Key Strategies

List of Figures
Figure 01. Embedded Die Packaging Technology Market, 2021-2031
Figure 02. Segmentation of Embedded Die Packaging Technology Market, 2021-2031
Figure 03. Top Investment Pockets in Embedded Die Packaging Technology Market (2022-2031)
Figure 04. Moderate Bargaining Power of Suppliers
Figure 05. Moderate Bargaining Power of Buyers
Figure 06. Moderate Threat of Substitutes
Figure 07. Moderate Threat of New Entrants
Figure 08. Moderate Intensity of Rivalry
Figure 09. Drivers, Restraints and Opportunities: Globalembedded Die Packaging Technology Market
Figure 10. Embedded Die Packaging Technology Market, by Platform, 2021(%)
Figure 11. Comparative Share Analysis of Embedded Die Packaging Technology Market for Embedded Die in Ic Package Substrate, by Country 2021-2031(%)
Figure 12. Comparative Share Analysis of Embedded Die Packaging Technology Market for Embedded Die in Rigid Board, by Country 2021-2031(%)
Figure 13. Comparative Share Analysis of Embedded Die Packaging Technology Market for Embedded Die in Flexible Board, by Country 2021-2031(%)
Figure 14. Embedded Die Packaging Technology Market, by Industry Vertical, 2021(%)
Figure 15. Comparative Share Analysis of Embedded Die Packaging Technology Market for Consumer Electronics, by Country 2021-2031(%)
Figure 16. Comparative Share Analysis of Embedded Die Packaging Technology Market for IT and Telecommunication, by Country 2021-2031(%)
Figure 17. Comparative Share Analysis of Embedded Die Packaging Technology Market for Automotive, by Country 2021-2031(%)
Figure 18. Comparative Share Analysis of Embedded Die Packaging Technology Market for Healthcare, by Country 2021-2031(%)
Figure 19. Comparative Share Analysis of Embedded Die Packaging Technology Market for Others, by Country 2021-2031(%)
Figure 20. Embedded Die Packaging Technology Market by Region, 2021
Figure 21. U.S. Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 22. Canada Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 23. Mexico Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 24. UK Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 25. Germany Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 26. France Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 27. Rest of Europe Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 28. China Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 29. Japan Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 30. Taiwan Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 31. India Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 32. South Korea Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 33. Rest of Asia-Pacific Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 34. Latin America Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 35. Middle East Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 36. Africa Embedded Die Packaging Technology Market, 2021-2031 ($Million)
Figure 37. Top Winning Strategies, by Year
Figure 38. Top Winning Strategies, by Development
Figure 39. Top Winning Strategies, by Company
Figure 40. Product Mapping of Top 10 Players
Figure 41. Competitive Dashboard
Figure 42. Competitive Heatmap: Embedded Die Packaging Technology Market
Figure 43. Top Player Positioning, 2021
Figure 44. Ase Group: Net Revenue, 2019-2021 ($Million)
Figure 45. Ase Group: Research & Development Expenditure, 2019-2021
Figure 46. Ase Group: Revenue Share by Segment, 2021 (%)
Figure 47. Ase Group: Revenue Share by Region, 2021 (%)
Figure 48. At&S Group: Net Revenue, 2019-2021 ($Million)
Figure 49. At&S Group: Research & Development Expenditure, 2019-2021
Figure 50. At&S Group: Revenue Share by Segment, 2021 (%)
Figure 51. At&S Group: Revenue Share by Region, 2021 (%)
Figure 52. Fujikura: Net Revenue, 2019-2021 ($Million)
Figure 53. Fujikura: Research & Development Expenditure, 2019-2021
Figure 54. Fujikura: Revenue Share by Segment, 2021 (%)
Figure 55. Fujikura: Revenue Share by Region, 2021 (%)
Figure 56. General Electric: Net Revenue, 2019-2021 ($Million)
Figure 57. General Electric: Research & Development Expenditure, 2019-2021
Figure 58. General Electric: Revenue Share by Segment, 2021 (%)
Figure 59. General Electric: Revenue Share by Region, 2021 (%)
Figure 60. Infenion Technologies AG: Net Revenue, 2019-2021 ($Million)
Figure 61. Infenion Technologies AG: Research & Development Expenditure, 2019-2021
Figure 62. Infenion Technologies AG: Revenue Share by Segment, 2021 (%)
Figure 63. Infenion Technologies AG: Revenue Share by Region, 2021 (%)
Figure 64. Microsemi: Net Revenue, 2020-2022 ($Million)
Figure 65. Microsemi: Research & Development Expenditure, 2020-2022
Figure 66. Microsemi: Revenue Share by Region, 2022 (%)
Figure 67. Microsemi: Revenue Share by Segment, 2022 (%)
Figure 68. Schweizer Electronic AG: Net Revenue, 2019-2021 ($Million)
Figure 69. Schweizer Electronic AG: Research & Development Expenditure, 2019-2021
Figure 70. Schweizer Electronic AG: Revenue Share by Segment, 2021 (%)
Figure 71. Schweizer Electronic AG: Revenue Share by Region, 2021 (%)
Figure 72. Taiwan Semiconductor Manufacturing Company Limited: Net Revenue, 2019-2021 ($Million)
Figure 73. Taiwan Semiconductor Manufacturing Company Limited: Research & Development Expenditure, 2019-2021
Figure 74. Tdk Corporation: Research & Development Expenditure, 2019-2021 ($Million)
Figure 75. Tdk Corporation: Net Sales, 2019-2021 ($Million)
Figure 76. Tdk Corporation: Revenue Share by Segment, 2021 (%)
Figure 77. Tdk Corporation: Revenue Share by Region, 2021 (%)

Executive Summary

According to the report titled, 'Embedded Die Packaging Technology Market,' the embedded die packaging technology market was valued at $69.18 million in 2021, and is estimated to reach $370.7 million by 2031, growing at a CAGR of 18.3% from 2022 to 2031.

The embedded die packaging technology market is likely to experience a significant growth rate of 19.2% from 2021-2031 owing to increasing sales of smart and power-efficient electronic devices.

Embedded die packaging technology is an IC packaging technology. It is used to embedded components in substrates with a multi-step manufacturing process. It I used in the manufacturing of printed circuit boards (PCBs). Some of the advantages of using this technology are increased functional density or reduced size, package robustness and high reliability.

Key factors driving the growth of embedded die packaging technology market include requirement of circuit miniaturization in microelectronic devices, increased demand for 5G technology and consumer electronics, and advantages over other packaging technologies. Embedded die packaging technology is better than other such technologies not only because it can fit components in a smaller area, but also because it has several other advantages such as enhanced chip quality, superior reliability, and better security. Unlike other technologies, in embedded die packaging, the die is embedded and thus consumes no area on the chip. This packaging provides flip chip and wire bonding, resulting in more flexibility in the design. The die is supported by mechanical barriers offering enhanced robustness to the complete structure. These packaging technologies also offer improved thermal and electrical performance. Such advantages make embedded die packaging technology highly suitable for niche applications such as industrial sensing, medical implants, sports/fitness devices, medical wearable devices and security.

The market also offers growth opportunities to the key players in the embedded die packaging technology market. Internet of things (IoT) is a technology, which interconnects daily use objects and allows them to exchange data through a wireless medium. This is facilitated with the help of miniature electronic circuits attached inside these devices. The growth in the IoT market is anticipated to fuel the adoption of embedded die packaging technology. The number of connected devices through Internet of things is anticipated to increase very rapidly in the next decade and this rapid growth is expected to open new opportunities for the overall embedded die packaging technology market during the forecast period.

The embedded die packaging technology market is segmented on the basis of platform, industry vertical, and region. On the basis of platform, it is segmented into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. On the basis of industry vertical, the market is segmented into consumer electronics, IT and telecommunication, automotive, healthcare, and others. In terms of region, the market is divided into North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The key players profiled in the study include Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer. Various Strategies have been adopted the key players to strengthen their position in the market. These include new product launch and business expansion steps. For instance, in May 2022, ASE Technology developed embedded die technology, dubbed ''Advanced Embedded Active System Integration'(aEASI), mainly applied to processing automotive electronic modules.

Key Market Insights

In 2021, the embedded die in IC package substrate segment was responsible for the largest share in the market, while the embedded die in flexible board segment is estimated to expand at a fast CAGR during the forecast period.

In 2021, the consumer electronics segment was the dominant segment in the global embedded die packaging technology market, while the others segment is expected to have a higher growth rate in the forecast period.

In 2021, Asia-Pacific contributed the maximum revenue to the embedded die packaging technology market, and it is also likely to grow at the fastest rate in the forecast period.

Companies Mentioned

• Amkor Technology Inc.
• ASE GROUP
• Fujikura
• General Electric
• Microsemi
• SCHWEIZER ELECTRONIC AG
• Taiwan Semiconductor Manufacturing Company Limited
• AT&S Group
• Infenion Technologies AG
• TDK Corporation

Methodology

The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.

They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.

They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:

• Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
• Scientific and technical writings for product information and related preemptions
• Regional government and statistical databases for macro analysis
• Authentic news articles and other related releases for market evaluation
• Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast

Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.