The global quad-flat-no-lead packaging market is envisioned to garner $1.1 billion by 2031, growing from $0.4 billion in 2021 at a CAGR of 8.8% from 2022 to 2031.
No-lead packaging like the quad flat no-lead (QFN) is becoming more and more common for IC devices. This packaging type was initially created as low-form factor containers for hand-held consumer electronics. Additionally, they are less expensive overall than comparable packaging, use less board space, have great thermal management qualities, and may have higher electrical performance. The use of QFN packages has increased recently in the telecom and automotive industries, where the criteria for long-term board-level reliability for thermal fatigue resistance are more stringent than in consumer applications. These factors are anticipated to boost the demand for quad-flat-no-lead packaging market share in consumer electronics applications.
The quad-flat-no-lead packaging failure due to solder thermal fatigue is a major worry due to the non-leaded package's inherent high coefficient of thermal expansion mismatch, low solder standoff, and non-compliant peripheral interconnects. These packages also pose difficulties for solder assembly, which may have an even greater effect on broad-level reliability. The packaging industry is moving toward larger bodies, finer pitches, and more pins, which all pose reliability risks and assembly issues for the quad-flat-no-lead packaging market size.
The advancement of micro lead film (MLF) packaging technology has been able to expand its capacity for offering solutions in the power sector due to the flexible lead design. The power QFN (PQFN) is an MLF technology version that provides numerous exposed pads with multiple fused leads. The PQFN packaging solution offers the thermal performance required for power metal-oxide-semiconductor field-effect transistor (MOSFET) designs while maintaining its compact size. This is achieved by combining the integration abilities of copper (Cu) clips and heat. All types of portable, handheld and electronic charging devices are quickly adopting these methods. The sintering paste and the solder die attachment both have additional extended PQFN solution thermal performance. Thermal dissipation for precisely manufactured PQFN devices has been particularly robust. Devices capable of a sustained drain current of 15 amps and drain-to-source voltages of 150 volts can be supported by the embedded heat slug and external heat sink. The use of Cu lead frames and lead-free solders are crucial components of this packaging solution that enable the on-resistance performance required for devices with demanding high-power needs.
The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. There were import-export restrictions laid down on various countries such as the U.S., China, India, and others which imposed significant challenges on the market. Demand for quad-flat-no-lead packaging used in consumer electronics applications declined during the pandemic. Mobile phone sales were sharply down due to shifting in customer preferences toward less-priced phones, which hampered the market growth.
The key players profiled in this report include Amkor Technology, Inc., Texas Instruments Incorporated, Microchip Technology Inc., STATS ChipPAC Pte Ltd, ASE, NXP Semiconductors, JCET Group, Powertech Technology Inc., Tianshui Huatian Technology Co., Ltd, ChipMOS TECHNOLOGIES INC.
No-lead packaging like the quad flat no-lead (QFN) is becoming more and more common for IC devices. This packaging type was initially created as low-form factor containers for hand-held consumer electronics. Additionally, they are less expensive overall than comparable packaging, use less board space, have great thermal management qualities, and may have higher electrical performance. The use of QFN packages has increased recently in the telecom and automotive industries, where the criteria for long-term board-level reliability for thermal fatigue resistance are more stringent than in consumer applications. These factors are anticipated to boost the demand for quad-flat-no-lead packaging market share in consumer electronics applications.
The quad-flat-no-lead packaging failure due to solder thermal fatigue is a major worry due to the non-leaded package's inherent high coefficient of thermal expansion mismatch, low solder standoff, and non-compliant peripheral interconnects. These packages also pose difficulties for solder assembly, which may have an even greater effect on broad-level reliability. The packaging industry is moving toward larger bodies, finer pitches, and more pins, which all pose reliability risks and assembly issues for the quad-flat-no-lead packaging market size.
The advancement of micro lead film (MLF) packaging technology has been able to expand its capacity for offering solutions in the power sector due to the flexible lead design. The power QFN (PQFN) is an MLF technology version that provides numerous exposed pads with multiple fused leads. The PQFN packaging solution offers the thermal performance required for power metal-oxide-semiconductor field-effect transistor (MOSFET) designs while maintaining its compact size. This is achieved by combining the integration abilities of copper (Cu) clips and heat. All types of portable, handheld and electronic charging devices are quickly adopting these methods. The sintering paste and the solder die attachment both have additional extended PQFN solution thermal performance. Thermal dissipation for precisely manufactured PQFN devices has been particularly robust. Devices capable of a sustained drain current of 15 amps and drain-to-source voltages of 150 volts can be supported by the embedded heat slug and external heat sink. The use of Cu lead frames and lead-free solders are crucial components of this packaging solution that enable the on-resistance performance required for devices with demanding high-power needs.
The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. There were import-export restrictions laid down on various countries such as the U.S., China, India, and others which imposed significant challenges on the market. Demand for quad-flat-no-lead packaging used in consumer electronics applications declined during the pandemic. Mobile phone sales were sharply down due to shifting in customer preferences toward less-priced phones, which hampered the market growth.
The key players profiled in this report include Amkor Technology, Inc., Texas Instruments Incorporated, Microchip Technology Inc., STATS ChipPAC Pte Ltd, ASE, NXP Semiconductors, JCET Group, Powertech Technology Inc., Tianshui Huatian Technology Co., Ltd, ChipMOS TECHNOLOGIES INC.
Key Benefits For Stakeholders
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the quad-flat-no-lead packaging market analysis from 2021 to 2031 to identify the prevailing quad-flat-no-lead packaging market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's Five Forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the quad-flat-no-lead packaging market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global quad-flat-no-lead packaging market trends, key players, market segments, application areas, and market growth Strategies.
Key Market Segments
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
By Industry Vertical
- Consumer Electronics
- Industrial
- Automotive
- Computing/Networking
- Communications
By Type
- Air-cavity QFN
- Plastic-moulded QFN
By Moulding Method
- Punched
- Sawn
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- UK
- France
- Spain
- Italy
- Rest of Europe
- Asia-Pacific
- Taiwan
- China
- Japan
- India
- South Korea
- Rest Of Asia
- LAMEA
- Brazil
- United Arab Emirates
- Saudi Arabia
- South Africa
- Rest of LAMEA
Key Market Players
- Amkor Technology, Inc.
- Texas Instruments Incorporated
- Microchip Technology Inc.
- STATS ChipPAC Pte Ltd
- ASE
- NXP Semiconductors
- JCET Group
- Powertech Technology Inc.
- Tianshui Huatian Technology Co.,Ltd
- ChipMOS TECHNOLOGIES INC.
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Table of Contents
CHAPTER 1: INTRODUCTION1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.2. Restraints
3.4.3. Opportunities
3.5. COVID-19 Impact Analysis on the market
3.6. Key Regulation Analysis
3.7. Market Share Analysis
3.8. Patent Landscape
3.9. Regulatory Guidelines
3.10. Value Chain Analysis
CHAPTER 4: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Air-cavity QFN
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Plastic-moulded QFN
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Others
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
CHAPTER 5: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD
5.1. Overview
5.1.1. Market size and forecast
5.2. Punched
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Sawn
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
CHAPTER 6: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS
6.1. Overview
6.1.1. Market size and forecast
6.2. Fully Exposed Terminal Ends
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market share analysis by country
6.3. Pull-back Terminal Ends
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market share analysis by country
6.4. Side Wettable Flank Terminal Ends
6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market share analysis by country
CHAPTER 7: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL
7.1. Overview
7.1.1. Market size and forecast
7.2. Consumer Electronics
7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis by country
7.3. Industrial
7.3.1. Key market trends, growth factors and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis by country
7.4. Automotive
7.4.1. Key market trends, growth factors and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis by country
7.5. Computing/Networking
7.5.1. Key market trends, growth factors and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis by country
7.6. Communications
7.6.1. Key market trends, growth factors and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market share analysis by country
CHAPTER 8: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast By Region
8.2. North America
8.2.1. Key trends and opportunities
8.2.2. Market size and forecast, by Type
8.2.3. Market size and forecast, by Moulding Method
8.2.4. Market size and forecast, by Terminal Pads
8.2.5. Market size and forecast, by Industry Vertical
8.2.6. Market size and forecast, by country
8.2.6.1. U.S.
8.2.6.1.1. Key market trends, growth factors and opportunities
8.2.6.1.2. Market size and forecast, by Type
8.2.6.1.3. Market size and forecast, by Moulding Method
8.2.6.1.4. Market size and forecast, by Terminal Pads
8.2.6.1.5. Market size and forecast, by Industry Vertical
8.2.6.2. Canada
8.2.6.2.1. Key market trends, growth factors and opportunities
8.2.6.2.2. Market size and forecast, by Type
8.2.6.2.3. Market size and forecast, by Moulding Method
8.2.6.2.4. Market size and forecast, by Terminal Pads
8.2.6.2.5. Market size and forecast, by Industry Vertical
8.2.6.3. Mexico
8.2.6.3.1. Key market trends, growth factors and opportunities
8.2.6.3.2. Market size and forecast, by Type
8.2.6.3.3. Market size and forecast, by Moulding Method
8.2.6.3.4. Market size and forecast, by Terminal Pads
8.2.6.3.5. Market size and forecast, by Industry Vertical
8.3. Europe
8.3.1. Key trends and opportunities
8.3.2. Market size and forecast, by Type
8.3.3. Market size and forecast, by Moulding Method
8.3.4. Market size and forecast, by Terminal Pads
8.3.5. Market size and forecast, by Industry Vertical
8.3.6. Market size and forecast, by country
8.3.6.1. Germany
8.3.6.1.1. Key market trends, growth factors and opportunities
8.3.6.1.2. Market size and forecast, by Type
8.3.6.1.3. Market size and forecast, by Moulding Method
8.3.6.1.4. Market size and forecast, by Terminal Pads
8.3.6.1.5. Market size and forecast, by Industry Vertical
8.3.6.2. UK
8.3.6.2.1. Key market trends, growth factors and opportunities
8.3.6.2.2. Market size and forecast, by Type
8.3.6.2.3. Market size and forecast, by Moulding Method
8.3.6.2.4. Market size and forecast, by Terminal Pads
8.3.6.2.5. Market size and forecast, by Industry Vertical
8.3.6.3. France
8.3.6.3.1. Key market trends, growth factors and opportunities
8.3.6.3.2. Market size and forecast, by Type
8.3.6.3.3. Market size and forecast, by Moulding Method
8.3.6.3.4. Market size and forecast, by Terminal Pads
8.3.6.3.5. Market size and forecast, by Industry Vertical
8.3.6.4. Spain
8.3.6.4.1. Key market trends, growth factors and opportunities
8.3.6.4.2. Market size and forecast, by Type
8.3.6.4.3. Market size and forecast, by Moulding Method
8.3.6.4.4. Market size and forecast, by Terminal Pads
8.3.6.4.5. Market size and forecast, by Industry Vertical
8.3.6.5. Italy
8.3.6.5.1. Key market trends, growth factors and opportunities
8.3.6.5.2. Market size and forecast, by Type
8.3.6.5.3. Market size and forecast, by Moulding Method
8.3.6.5.4. Market size and forecast, by Terminal Pads
8.3.6.5.5. Market size and forecast, by Industry Vertical
8.3.6.6. Rest of Europe
8.3.6.6.1. Key market trends, growth factors and opportunities
8.3.6.6.2. Market size and forecast, by Type
8.3.6.6.3. Market size and forecast, by Moulding Method
8.3.6.6.4. Market size and forecast, by Terminal Pads
8.3.6.6.5. Market size and forecast, by Industry Vertical
8.4. Asia-Pacific
8.4.1. Key trends and opportunities
8.4.2. Market size and forecast, by Type
8.4.3. Market size and forecast, by Moulding Method
8.4.4. Market size and forecast, by Terminal Pads
8.4.5. Market size and forecast, by Industry Vertical
8.4.6. Market size and forecast, by country
8.4.6.1. Taiwan
8.4.6.1.1. Key market trends, growth factors and opportunities
8.4.6.1.2. Market size and forecast, by Type
8.4.6.1.3. Market size and forecast, by Moulding Method
8.4.6.1.4. Market size and forecast, by Terminal Pads
8.4.6.1.5. Market size and forecast, by Industry Vertical
8.4.6.2. China
8.4.6.2.1. Key market trends, growth factors and opportunities
8.4.6.2.2. Market size and forecast, by Type
8.4.6.2.3. Market size and forecast, by Moulding Method
8.4.6.2.4. Market size and forecast, by Terminal Pads
8.4.6.2.5. Market size and forecast, by Industry Vertical
8.4.6.3. Japan
8.4.6.3.1. Key market trends, growth factors and opportunities
8.4.6.3.2. Market size and forecast, by Type
8.4.6.3.3. Market size and forecast, by Moulding Method
8.4.6.3.4. Market size and forecast, by Terminal Pads
8.4.6.3.5. Market size and forecast, by Industry Vertical
8.4.6.4. India
8.4.6.4.1. Key market trends, growth factors and opportunities
8.4.6.4.2. Market size and forecast, by Type
8.4.6.4.3. Market size and forecast, by Moulding Method
8.4.6.4.4. Market size and forecast, by Terminal Pads
8.4.6.4.5. Market size and forecast, by Industry Vertical
8.4.6.5. South Korea
8.4.6.5.1. Key market trends, growth factors and opportunities
8.4.6.5.2. Market size and forecast, by Type
8.4.6.5.3. Market size and forecast, by Moulding Method
8.4.6.5.4. Market size and forecast, by Terminal Pads
8.4.6.5.5. Market size and forecast, by Industry Vertical
8.4.6.6. Rest Of Asia
8.4.6.6.1. Key market trends, growth factors and opportunities
8.4.6.6.2. Market size and forecast, by Type
8.4.6.6.3. Market size and forecast, by Moulding Method
8.4.6.6.4. Market size and forecast, by Terminal Pads
8.4.6.6.5. Market size and forecast, by Industry Vertical
8.5. LAMEA
8.5.1. Key trends and opportunities
8.5.2. Market size and forecast, by Type
8.5.3. Market size and forecast, by Moulding Method
8.5.4. Market size and forecast, by Terminal Pads
8.5.5. Market size and forecast, by Industry Vertical
8.5.6. Market size and forecast, by country
8.5.6.1. Brazil
8.5.6.1.1. Key market trends, growth factors and opportunities
8.5.6.1.2. Market size and forecast, by Type
8.5.6.1.3. Market size and forecast, by Moulding Method
8.5.6.1.4. Market size and forecast, by Terminal Pads
8.5.6.1.5. Market size and forecast, by Industry Vertical
8.5.6.2. United Arab Emirates
8.5.6.2.1. Key market trends, growth factors and opportunities
8.5.6.2.2. Market size and forecast, by Type
8.5.6.2.3. Market size and forecast, by Moulding Method
8.5.6.2.4. Market size and forecast, by Terminal Pads
8.5.6.2.5. Market size and forecast, by Industry Vertical
8.5.6.3. Saudi Arabia
8.5.6.3.1. Key market trends, growth factors and opportunities
8.5.6.3.2. Market size and forecast, by Type
8.5.6.3.3. Market size and forecast, by Moulding Method
8.5.6.3.4. Market size and forecast, by Terminal Pads
8.5.6.3.5. Market size and forecast, by Industry Vertical
8.5.6.4. South Africa
8.5.6.4.1. Key market trends, growth factors and opportunities
8.5.6.4.2. Market size and forecast, by Type
8.5.6.4.3. Market size and forecast, by Moulding Method
8.5.6.4.4. Market size and forecast, by Terminal Pads
8.5.6.4.5. Market size and forecast, by Industry Vertical
8.5.6.5. Rest of LAMEA
8.5.6.5.1. Key market trends, growth factors and opportunities
8.5.6.5.2. Market size and forecast, by Type
8.5.6.5.3. Market size and forecast, by Moulding Method
8.5.6.5.4. Market size and forecast, by Terminal Pads
8.5.6.5.5. Market size and forecast, by Industry Vertical
CHAPTER 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product Mapping of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
9.6. Top player positioning, 2021
CHAPTER 10: COMPANY PROFILES
10.1. Amkor Technology, Inc.
10.1.1. Company overview
10.1.2. Key Executives
10.1.3. Company snapshot
10.2. Texas Instruments Incorporated
10.2.1. Company overview
10.2.2. Key Executives
10.2.3. Company snapshot
10.3. Microchip Technology Inc.
10.3.1. Company overview
10.3.2. Key Executives
10.3.3. Company snapshot
10.4. STATS ChipPAC Pte Ltd
10.4.1. Company overview
10.4.2. Key Executives
10.4.3. Company snapshot
10.5. ASE
10.5.1. Company overview
10.5.2. Key Executives
10.5.3. Company snapshot
10.6. NXP Semiconductors
10.6.1. Company overview
10.6.2. Key Executives
10.6.3. Company snapshot
10.7. JCET Group
10.7.1. Company overview
10.7.2. Key Executives
10.7.3. Company snapshot
10.8. Powertech Technology Inc.
10.8.1. Company overview
10.8.2. Key Executives
10.8.3. Company snapshot
10.9. Tianshui Huatian Technology Co.,Ltd
10.9.1. Company overview
10.9.2. Key Executives
10.9.3. Company snapshot
10.10. ChipMOS TECHNOLOGIES INC.
10.10.1. Company overview
10.10.2. Key Executives
10.10.3. Company snapshot
List of Tables
Table 01. Global Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 02. Quad-Flat-No-Lead Packaging Market for Air-Cavity Qfn, by Region, 2021-2031 (Revenue, $Million)
Table 03. Quad-Flat-No-Lead Packaging Market for Plastic-Moulded Qfn, by Region, 2021-2031 (Revenue, $Million)
Table 04. Quad-Flat-No-Lead Packaging Market for Others, by Region, 2021-2031 (Revenue, $Million)
Table 05. Global Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 06. Quad-Flat-No-Lead Packaging Market for Punched, by Region, 2021-2031 (Revenue, $Million)
Table 07. Quad-Flat-No-Lead Packaging Market for Sawn, by Region, 2021-2031 (Revenue, $Million)
Table 08. Global Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 09. Quad-Flat-No-Lead Packaging Market for Fully Exposed Terminal Ends, by Region, 2021-2031 (Revenue, $Million)
Table 10. Quad-Flat-No-Lead Packaging Market for Pull-Back Terminal Ends, by Region, 2021-2031 (Revenue, $Million)
Table 11. Quad-Flat-No-Lead Packaging Market for Side Wettable Flank Terminal Ends, by Region, 2021-2031 (Revenue, $Million)
Table 12. Global Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 13. Quad-Flat-No-Lead Packaging Market for Consumer Electronics, by Region, 2021-2031 (Revenue, $Million)
Table 14. Quad-Flat-No-Lead Packaging Market for Industrial, by Region, 2021-2031 (Revenue, $Million)
Table 15. Quad-Flat-No-Lead Packaging Market for Automotive, by Region, 2021-2031 (Revenue, $Million)
Table 16. Quad-Flat-No-Lead Packaging Market for Computing/Networking, by Region, 2021-2031 (Revenue, $Million)
Table 17. Quad-Flat-No-Lead Packaging Market for Communications, by Region, 2021-2031 (Revenue, $Million)
Table 18. Quad-Flat-No-Lead Packaging Market, by Region, 2021-2031 (Revenue, $Million)
Table 19. North America Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 20. North America Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 21. North America Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 22. North America Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 23. North America Quad-Flat-No-Lead Packaging Market, by Country, 2021-2031 (Revenue, $Million)
Table 24. U.S. Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 25. U.S. Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 26. U.S. Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 27. U.S. Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 28. Canada Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 29. Canada Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 30. Canada Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 31. Canada Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 32. Mexico Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 33. Mexico Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 34. Mexico Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 35. Mexico Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 36. Europe Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 37. Europe Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 38. Europe Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 39. Europe Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 40. Europe Quad-Flat-No-Lead Packaging Market, by Country, 2021-2031 (Revenue, $Million)
Table 41. Germany Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 42. Germany Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 43. Germany Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 44. Germany Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 45. UK Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 46. UK Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 47. UK Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 48. UK Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 49. France Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 50. France Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 51. France Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 52. France Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 53. Spain Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 54. Spain Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 55. Spain Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 56. Spain Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 57. Italy Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 58. Italy Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 59. Italy Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 60. Italy Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 61. Rest of Europe Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 62. Rest of Europe Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 63. Rest of Europe Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 64. Rest of Europe Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 65. Asia-Pacific Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 66. Asia-Pacific Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 67. Asia-Pacific Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 68. Asia-Pacific Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 69. Asia-Pacific Quad-Flat-No-Lead Packaging Market, by Country, 2021-2031 (Revenue, $Million)
Table 70. Taiwan Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 71. Taiwan Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 72. Taiwan Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 73. Taiwan Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 74. China Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 75. China Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 76. China Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 77. China Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 78. Japan Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 79. Japan Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 80. Japan Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 81. Japan Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 82. India Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 83. India Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 84. India Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 85. India Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 86. South Korea Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 87. South Korea Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 88. South Korea Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 89. South Korea Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 90. Rest of Asia Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 91. Rest of Asia Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 92. Rest of Asia Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 93. Rest of Asia Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 94. LAMEA Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 95. LAMEA Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 96. LAMEA Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 97. LAMEA Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 98. LAMEA Quad-Flat-No-Lead Packaging Market, by Country, 2021-2031 (Revenue, $Million)
Table 99. Brazil Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 100. Brazil Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 101. Brazil Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 102. Brazil Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 103. United Arab Emirates Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 104. United Arab Emirates Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 105. United Arab Emirates Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 106. United Arab Emirates Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 107. Saudi Arabia Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 108. Saudi Arabia Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 109. Saudi Arabia Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 110. Saudi Arabia Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 111. South Africa Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 112. South Africa Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 113. South Africa Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 114. South Africa Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 115. Rest of LAMEA Quad-Flat-No-Lead Packaging Market, by Type, 2021-2031 (Revenue, $Million)
Table 116. Rest of LAMEA Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021-2031 (Revenue, $Million)
Table 117. Rest of LAMEA Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021-2031 (Revenue, $Million)
Table 118. Rest of LAMEA Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021-2031 (Revenue, $Million)
Table 119. Amkor Technology, Inc.: Key Executives
Table 120. Amkor Technology, Inc.: Company Snapshot
Table 121. Texas Instruments Incorporated: Key Executives
Table 122. Texas Instruments Incorporated: Company Snapshot
Table 123. Microchip Technology Inc.: Key Executives
Table 124. Microchip Technology Inc.: Company Snapshot
Table 125. Stats Chippac Pte Ltd.: Key Executives
Table 126. Stats Chippac Pte Ltd.: Company Snapshot
Table 127. Ase: Key Executives
Table 128. Ase: Company Snapshot
Table 129. Nxp Semiconductors: Key Executives
Table 130. Nxp Semiconductors: Company Snapshot
Table 131. Jcet Group: Key Executives
Table 132. Jcet Group: Company Snapshot
Table 133. Powertech Technology Inc.: Key Executives
Table 134. Powertech Technology Inc.: Company Snapshot
Table 135. Tianshui Huatian Technology Co.,Ltd.: Key Executives
Table 136. Tianshui Huatian Technology Co.,Ltd.: Company Snapshot
Table 137. Chipmos Technologies Inc.: Key Executives
Table 138. Chipmos Technologies Inc.: Company Snapshot
List of Figures
Figure 01. Quad-Flat-No-Lead Packaging Market, 2021-2031
Figure 02. Segmentation of Quad-Flat-No-Lead Packaging Market, 2021-2031
Figure 03. Top Investment Pockets in Quad-Flat-No-Lead Packaging Market (2022-2031)
Figure 04. Porter Five-1
Figure 05. Porter Five-2
Figure 06. Porter Five-3
Figure 07. Porter Five-4
Figure 08. Porter Five-5
Figure 09. Drivers, Restraints and Opportunities: Globalquad-Flat-No-Lead Packaging Market
Figure 10. Impact of Key Regulation: Quad-Flat-No-Lead Packaging Market
Figure 11. Market Share Analysis: Quad-Flat-No-Lead Packaging Market
Figure 12. Patent Analysis by Company
Figure 13. Patent Analysis by Country
Figure 14. Regulatory Guidelines: Quad-Flat-No-Lead Packaging Market
Figure 15. Value Chain Analysis: Quad-Flat-No-Lead Packaging Market
Figure 16. Quad-Flat-No-Lead Packaging Market, by Type, 2021(%)
Figure 17. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Air-Cavity Qfn, by Country 2021-2031(%)
Figure 18. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Plastic-Moulded Qfn, by Country 2021-2031(%)
Figure 19. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Others, by Country 2021-2031(%)
Figure 20. Quad-Flat-No-Lead Packaging Market, by Moulding Method, 2021(%)
Figure 21. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Punched, by Country 2021-2031(%)
Figure 22. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Sawn, by Country 2021-2031(%)
Figure 23. Quad-Flat-No-Lead Packaging Market, by Terminal Pads, 2021(%)
Figure 24. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Fully Exposed Terminal Ends, by Country 2021-2031(%)
Figure 25. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Pull-Back Terminal Ends, by Country 2021-2031(%)
Figure 26. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Side Wettable Flank Terminal Ends, by Country 2021-2031(%)
Figure 27. Quad-Flat-No-Lead Packaging Market, by Industry Vertical, 2021(%)
Figure 28. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Consumer Electronics, by Country 2021-2031(%)
Figure 29. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Industrial, by Country 2021-2031(%)
Figure 30. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Automotive, by Country 2021-2031(%)
Figure 31. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Computing/Networking, by Country 2021-2031(%)
Figure 32. Comparative Share Analysis of Quad-Flat-No-Lead Packaging Market for Communications, by Country 2021-2031(%)
Figure 33. Quad-Flat-No-Lead Packaging Market by Region, 2021
Figure 34. U.S. Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 35. Canada Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 36. Mexico Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 37. Germany Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 38. UK Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 39. France Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 40. Spain Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 41. Italy Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 42. Rest of Europe Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 43. Taiwan Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 44. China Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 45. Japan Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 46. India Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 47. South Korea Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 48. Rest of Asia Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 49. Brazil Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 50. United Arab Emirates Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 51. Saudi Arabia Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 52. South Africa Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 53. Rest of LAMEA Quad-Flat-No-Lead Packaging Market, 2021-2031 ($Million)
Figure 54. Top Winning Strategies, by Year
Figure 55. Top Winning Strategies, by Development
Figure 56. Top Winning Strategies, by Company
Figure 57. Product Mapping of Top 10 Players
Figure 58. Competitive Dashboard
Figure 59. Competitive Heatmap: Quad-Flat-No-Lead Packaging Market
Figure 60. Top Player Positioning, 2021
Executive Summary
According to the report titled, 'Quad-Flat-No-Lead Packaging Market,' the quad-flat-no-lead packaging market was valued at $453.10 million in 2021, and is estimated to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031.Quad-flat-no-lead package is referred to as a QFN. It is a tiny, leadless package with a moderate capacity for heat dissipation in printed circuit boards. The purpose of QFN packaging is to attach the IC's silicon die to the circuit board, just like any other IC package.
Key factors driving the growth of the Quad-flat-no-lead package market include the desire for automation in material handling across sectors, rising medical automation for repeatability and precision, the emergence of the e-commerce sector, and increased productivity made possible by improved supply chain procedures. The quad-flat-no-lead packaging's flexible factor enables the technology to serve all markets while fulfilling unique dimensional and application requirements. The QFN packaging solution is being used in various devices to tackle space and functional issues. The capacity to generate cavities has resulted in the QFN becoming a widely utilized and adaptable solution in microelectromechanical systems and sensor devices. However, by reducing passive parts, the high-frequency power supply can be made in a compact form factor. To maximize the electrical performance of Gallium nitride (GaN) devices, integrated architecture with driver IC and GaN mosfet in QFN-SIP (System in package) is the preferred solution. However, this QFN-SIP has its own thermal challenge as it contains driver IC power dissipation and GaN mosfet power dissipation in one package, and hence thermal improvement solution of QFN-SIP is required.
The market also offers growth opportunities to the key players in the market. The difficulty of chip design today can be overcome by knowing all design data and metadata related to the IP that goes into semiconductors in the future of semiconductor design. Future developments in technology, markets, and business models have an effect on semiconductor design. The COVID-19 pandemic's significant global disruptions accelerated the already-rapid adoption of digital technologies since they were essential for keeping people and businesses connected during lockdowns. The market leaders have created differentiated offerings that have strengthened their leadership positions through ongoing capital investments in R&D. Notably, recent experience demonstrates that it is challenging for businesses to overtake rivals who are leaders in specific technological fields. These results taken together imply that semiconductor companies should investigate three directions when creating plans to prosper in the post-pandemic future.
The quad-flat-no-lead package market is segmented into type, molding method, terminal pads, industry vertical, and region. On the basis of type, the market is categorized into air-cavity QFN, plastic-molded QFN, and others. On the basis of molding method, it is categorized into punched and sawn. On the basis of terminal pads, it is fragmented into fully exposed terminal ends, pull-back terminal ends, and side wettable flank terminal ends. On the basis of industry vertical, it is fragmented into consumer electronics, industrial, automotive, computing/networking, and communications. Region-wise, it is analyzed across North America (the U.S., Canada, and Mexico), Europe (UK, Germany, Italy, France, Spain, and the rest of Europe), Asia-Pacific (China, India, Japan, Australia, South Korea and rest of Asia-Pacific), and LAMEA (Brazil, Saudi Arabia, United Arab Emirates, South Africa, and rest of LAMEA.
The key players profiled in the study include Amkor Technology, Inc., Texas Instruments Incorporated, Microchip Technology Inc., STATS ChipPAC Pte Ltd, ASE, NXP Semiconductors, JCET Group, Powertech Technology Inc., Tianshui Huatian Technology Co., Ltd, ChipMOS TECHNOLOGIES INC. The players in the market have been actively engaged in the adoption of various Strategies such as acquisition, product launch, and expansion to remain competitive and gain an advantage over the competitors in the market. For instance, in October 2020, Microchip Technology Inc. announced the acquisition of Tekron International Limited, a global leader in GPS and atomic clock time-keeping technology and solutions for smart grids and other industrial applications.
Key Market Insights
By type, the air-cavity QFN segment was the highest revenue contributor to the market; it does have outstanding mechanical dependability. Dry air inside the package has a substantially lower dielectric constant as compared to molding materials, which reduces losses at high frequencies and enhances electrical performance in high-frequency semiconductor circuits.By molding method, the punched segment dominated the global market, such a QFN's package is created utilizing a single mold cavity configuration. Additionally, a punch tool is used to divide the mold cavity, thus the name.
Based on terminal pads, the fully exposed terminal ends segment was the highest revenue contributor to the market. In this type, such as Pull-back terminal ends and Side wettable flank terminal ends, the terminals are entirely exposed at the package edge and package side.
Based on industry vertical, the consumer electronics segment was the highest revenue contributor to the market. Consumer electronics are any devices used for communication, amusement, or entertainment.
Based on region, Asia Pacific was the highest revenue contributor to the market share and it is projected to maintain this position during the forecast period.
Companies Mentioned
- Amkor Technology, Inc.
- Texas Instruments Incorporated
- Microchip Technology Inc.
- STATS ChipPAC Pte Ltd
- ASE
- NXP Semiconductors
- JCET Group
- Powertech Technology Inc.
- Tianshui Huatian Technology Co.,Ltd
- ChipMOS TECHNOLOGIES INC.
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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