The Global Quad-Flat-No-Lead Packaging Market size is expected to reach $749.2 Million by 2028, rising at a market growth of 8.4% CAGR during the forecast period.
Flat no-leads packages, like quad-flat no-leads (QFN),connect integrated circuits (ICs)to printed circuit boards (PCBs)both physically and electrically. Flat no-leads, called SON (small-outline no-leads) and micro leadframe (MLF), is a surface-mount method connecting ICs to the PCB'ssurfacewithout using through-holes. Flat no-lead is a plastic-encased package comprising a planar copper andlead frame substrate approaching chip scale.
Electrical connections to the PCB are made via perimeter lands on the bottom of thepackage. In addition, flat no-lead packages incorporate an exposed thermal pad (into the PCB) to increase heat conduction out of the IC. The QFN package is comparable to the QFP and ball grid array packages (BGA).
This package has several advantages, including low lead inductance, a small 'near chip scale'footprint, a thin profile, and low weight. It also employs perimeter I/O pads to facilitate PCB trace routing, as well as the exposed copper (Cu)die-pad architecture provides excellent electrical and thermal performance. These characteristics make the QFN an excellent candidate for a wide range of novel applications where dimension, weight, and electrical and thermal performance are critical.
Due to four factors, namely, low cost, tiny form factor, and excellent thermal and electrical performance, the QFN (Quad Flat No-lead) package is perhaps the most prominent semiconductor package available nowadays. QFN is a lead frame-based package, also known as a CSP (Chip Scale Package) that allows users to inspect and connect leads after assembly.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Toshiba Corporation, Fujitsu Limited, NXP Semiconductors N.V., ASE Group (ASE Technology Holding), Amkor Technology, Inc., Microchip Technology Incorporated, Texas Instruments, Inc., JCET Group, Powertech Technology, Inc., and Tianshui Huatian Technology Co.,Ltd.
Flat no-leads packages, like quad-flat no-leads (QFN),connect integrated circuits (ICs)to printed circuit boards (PCBs)both physically and electrically. Flat no-leads, called SON (small-outline no-leads) and micro leadframe (MLF), is a surface-mount method connecting ICs to the PCB'ssurfacewithout using through-holes. Flat no-lead is a plastic-encased package comprising a planar copper andlead frame substrate approaching chip scale.
Electrical connections to the PCB are made via perimeter lands on the bottom of thepackage. In addition, flat no-lead packages incorporate an exposed thermal pad (into the PCB) to increase heat conduction out of the IC. The QFN package is comparable to the QFP and ball grid array packages (BGA).
This package has several advantages, including low lead inductance, a small 'near chip scale'footprint, a thin profile, and low weight. It also employs perimeter I/O pads to facilitate PCB trace routing, as well as the exposed copper (Cu)die-pad architecture provides excellent electrical and thermal performance. These characteristics make the QFN an excellent candidate for a wide range of novel applications where dimension, weight, and electrical and thermal performance are critical.
Due to four factors, namely, low cost, tiny form factor, and excellent thermal and electrical performance, the QFN (Quad Flat No-lead) package is perhaps the most prominent semiconductor package available nowadays. QFN is a lead frame-based package, also known as a CSP (Chip Scale Package) that allows users to inspect and connect leads after assembly.
COVID-19 Impact Analysis
Due to the COVID-19 pandemic, the semiconductor manufacturing industry's demand for QFN decreased. This was because different governments worldwide imposed restrictions, such as lockdowns and social distancing laws, which affected the semiconductor industry's capacity to produce semiconductors. As a result, quad-flat-no-lead packaging technology became less popular. COVID-19 had a major impact on the semiconductor industry from both the demand and supply sides. Due to a short-term mismatch in demand from the consumer electronics industry, semiconductor businesses had to shut down. The supply chain was also impacted, which evidently impacted lead times, commitments to the backlog, predictions, costs, and labor management.Market Growth Factors
Increasing consumer electronics industry demand
Mobile phones use memory-integrated circuits to store the operating system and customizable functions, including the phone directory. They are utilized in various technologies, including oscillators, microprocessors, computer memory, and amplifiers. Due to ongoing developments in the smartphone industry, it is anticipated that the integrated circuit industry will expand significantly. In addition, due to the intense competition among mobile phone makers, more advanced handsets with better performance are being released at lower prices. This element is fueling the market for Quad-Flat-No-Lead packaging.Rising use of electronic components in the automotive sector
ECUs and motors are being incorporated into vehicles at a higher rate because of the rising demand for functionality in the automotive sector. However, the limited space on boards, particularly with their increased downsizing, calls for more potent and compact components. Surface mount component applications have grown as a result of this. Manufacturers are increasingly creating components that give the needed output in small sizes. The power supply circuits for automotive systems and the current sensing in motors both use surface mountcomponents. These Factor is helping the market for Quad-Flat-No-Lead packaginggrow.
Market Restraining Factors
Issues of performance reliability of QFN packaging
There are tiny, closely spaced pins on the quad-flat-no-lead package. They are susceptible to damage and deformation from negligent handling. Additionally, precisely reformatting them is quite difficult. To provide adequate security during transportation, they are typically shipped in specialized packaging that must be handled carefully to prevent damage. This packaging reduces handling to a minimum and greatly reduces the possibility of damage. These elements are predicted to limit the market's expansion for quad-flat, lead-free packaging.Terminal Pads Outlook
Based on terminal pads, the Quad-Flat-No-Lead packaging market is categorized into fully exposed terminal ends, pull-back terminal ends, and side wettable flank terminal ends. The side wettable flank terminal ends segment procured a considerable growth rate in the Quad-Flat-No-Lead packaging market in 2021. These terminal ends differ from fully exposed terminal ends in several ways. For the purpose of creating solder fillets, side wettable flank terminal ends permit solder wetting. If uniform solder fillets are created, the inspection of solder failure using AOI is made simpler.Vertical Outlook
On the basis of vertical, the Quad-Flat-No-Lead packaging market is divided into consumer electronics, industrial, automotive, computing/networking, and communications. The consumer electronics segment recorded a significant revenue share in the Quad-Flat-No-Lead packaging market in 2021. It is anticipated that consumer electronics will experience rapid growth in the coming years. This generous growth is attributed to the increased adoption of trend-setting inventions, such as wearable device accessories. Wearable gadgets, for instance, individual therapeutic observing gadgets, wristwatches, and others are tiny electronic gadgets that are extensively utilized by customers, hence increasing the demand for UQFN or QFN bundles.Type Outlook
Based on type, the Quad-Flat-No-Lead packaging market is segmented into air-cavity, plastic-moulded, and others. The air-cavity QFN segment garnered the maximum revenue share in the Quad-Flat-No-Lead packaging market in 2021. The air-cavity QFN packaging is a better variant of the conventionalQFN molds. The metal leads are attached directly to a printed circuit board, and air surrounds the chip. In addition, the ceramic material is typically used for the sidewalls and lids of the containers, allowing them to tolerate high temperatures without melting, flowing, breaking,or decomposing. Quad-flat-no-lead packaging market opportunity is predicted to arise due to these reasons.Moulding Method Outlook
On the basis of moulding method, the Quad-Flat-No-Lead packaging market is bifurcated into punched and sawn. The punched segment acquired the highest revenue share in the Quad-Flat-No-Lead packaging market in 2021. Die cutting and Stamping the exterior lead wire distinguishes the punched QFN moulding procedure. Due to the sealing of every cavity with resin, the exterior pins of the package are embossed. Because the release of pressure during the punched moulding procedure, there is a little protruding pin on the exterior of the circuit board.Regional Outlook
Region wise, the Quad-Flat-No-Lead packaging market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment witnessed the largest revenue share in the Quad-Flat-No-Lead packaging market in 2021. Large-scale international investment Due to supportive government policies in countries like China and India, FDI is entering the region. The main companies are establishing their manufacturing facilities due to the accessible and reasonably priced production-related supplies in this region. India and China rapidly act as international electrical device manufacturing hubs. China, the country with the highest opportunity in Asia-Pacific, is where significant investments are being made in no-lead packaging materials.The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Toshiba Corporation, Fujitsu Limited, NXP Semiconductors N.V., ASE Group (ASE Technology Holding), Amkor Technology, Inc., Microchip Technology Incorporated, Texas Instruments, Inc., JCET Group, Powertech Technology, Inc., and Tianshui Huatian Technology Co.,Ltd.
Scope of the Study
By Moulding Method
- Punched
- Sawn
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
By Type
- Air Cavity
- Plastic-moulded
- Others
By Vertical
- Automotive
- Consumer Electronics
- Industrial
- Computing / Networking
- Communications
By Geography
- North America
- US
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
- LAMEA
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Quad-Flat-No-Lead Packaging Market, by Moulding Method
1.4.2 Global Quad-Flat-No-Lead Packaging Market, by Terminal Pads
1.4.3 Global Quad-Flat-No-Lead Packaging Market, by Type
1.4.4 Global Quad-Flat-No-Lead Packaging Market, by Vertical
1.4.5 Global Quad-Flat-No-Lead Packaging Market, by Geography
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Global Quad-Flat-No-Lead Packaging Market by Moulding Method
3.1 Global Punched Market by Region
3.2 Global Sawn Market by Region
Chapter 4. Global Quad-Flat-No-Lead Packaging Market by Terminal Pads
4.1 Global Fully Exposed Terminal Ends Market by Region
4.2 Global Pull-back Terminal Ends Market by Region
4.3 Global Side Wettable Flank Terminal Ends Market by Region
Chapter 5. Global Quad-Flat-No-Lead Packaging Market by Type
5.1 Global Air Cavity Market by Region
5.2 Global Plastic-moulded Market by Region
5.3 Global Others Market by Region
Chapter 6. Global Quad-Flat-No-Lead Packaging Market by Vertical
6.1 Global Automotive Market by Region
6.2 Global Consumer Electronics Market by Region
6.3 Global Industrial Market by Region
6.4 Global Computing / Networking Market by Region
6.5 Global Communications Market by Region
Chapter 7. Global Quad-Flat-No-Lead Packaging Market by Region
7.1 North America Quad-Flat-No-Lead Packaging Market
7.1.1 North America Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.1.1 North America Punched Market by Country
7.1.1.2 North America Sawn Market by Country
7.1.2 North America Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.2.1 North America Fully Exposed Terminal Ends Market by Country
7.1.2.2 North America Pull-back Terminal Ends Market by Country
7.1.2.3 North America Side Wettable Flank Terminal Ends Market by Country
7.1.3 North America Quad-Flat-No-Lead Packaging Market by Type
7.1.3.1 North America Air Cavity Market by Country
7.1.3.2 North America Plastic-moulded Market by Country
7.1.3.3 North America Others Market by Country
7.1.4 North America Quad-Flat-No-Lead Packaging Market by Vertical
7.1.4.1 North America Automotive Market by Country
7.1.4.2 North America Consumer Electronics Market by Country
7.1.4.3 North America Industrial Market by Country
7.1.4.4 North America Computing / Networking Market by Country
7.1.4.5 North America Communications Market by Country
7.1.5 North America Quad-Flat-No-Lead Packaging Market by Country
7.1.5.1 US Quad-Flat-No-Lead Packaging Market
7.1.5.1.1 US Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.5.1.2 US Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.5.1.3 US Quad-Flat-No-Lead Packaging Market by Type
7.1.5.1.4 US Quad-Flat-No-Lead Packaging Market by Vertical
7.1.5.2 Canada Quad-Flat-No-Lead Packaging Market
7.1.5.2.1 Canada Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.5.2.2 Canada Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.5.2.3 Canada Quad-Flat-No-Lead Packaging Market by Type
7.1.5.2.4 Canada Quad-Flat-No-Lead Packaging Market by Vertical
7.1.5.3 Mexico Quad-Flat-No-Lead Packaging Market
7.1.5.3.1 Mexico Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.5.3.2 Mexico Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.5.3.3 Mexico Quad-Flat-No-Lead Packaging Market by Type
7.1.5.3.4 Mexico Quad-Flat-No-Lead Packaging Market by Vertical
7.1.5.4 Rest of North America Quad-Flat-No-Lead Packaging Market
7.1.5.4.1 Rest of North America Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.5.4.2 Rest of North America Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.5.4.3 Rest of North America Quad-Flat-No-Lead Packaging Market by Type
7.1.5.4.4 Rest of North America Quad-Flat-No-Lead Packaging Market by Vertical
7.2 Europe Quad-Flat-No-Lead Packaging Market
7.2.1 Europe Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.1.1 Europe Punched Market by Country
7.2.1.2 Europe Sawn Market by Country
7.2.2 Europe Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.2.1 Europe Fully Exposed Terminal Ends Market by Country
7.2.2.2 Europe Pull-back Terminal Ends Market by Country
7.2.2.3 Europe Side Wettable Flank Terminal Ends Market by Country
7.2.3 Europe Quad-Flat-No-Lead Packaging Market by Type
7.2.3.1 Europe Air Cavity Market by Country
7.2.3.2 Europe Plastic-moulded Market by Country
7.2.3.3 Europe Others Market by Country
7.2.4 Europe Quad-Flat-No-Lead Packaging Market by Vertical
7.2.4.1 Europe Automotive Market by Country
7.2.4.2 Europe Consumer Electronics Market by Country
7.2.4.3 Europe Industrial Market by Country
7.2.4.4 Europe Computing / Networking Market by Country
7.2.4.5 Europe Communications Market by Country
7.2.5 Europe Quad-Flat-No-Lead Packaging Market by Country
7.2.5.1 Germany Quad-Flat-No-Lead Packaging Market
7.2.5.1.1 Germany Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.5.1.2 Germany Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.5.1.3 Germany Quad-Flat-No-Lead Packaging Market by Type
7.2.5.1.4 Germany Quad-Flat-No-Lead Packaging Market by Vertical
7.2.5.2 UK Quad-Flat-No-Lead Packaging Market
7.2.5.2.1 UK Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.5.2.2 UK Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.5.2.3 UK Quad-Flat-No-Lead Packaging Market by Type
7.2.5.2.4 UK Quad-Flat-No-Lead Packaging Market by Vertical
7.2.5.3 France Quad-Flat-No-Lead Packaging Market
7.2.5.3.1 France Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.5.3.2 France Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.5.3.3 France Quad-Flat-No-Lead Packaging Market by Type
7.2.5.3.4 France Quad-Flat-No-Lead Packaging Market by Vertical
7.2.5.4 Russia Quad-Flat-No-Lead Packaging Market
7.2.5.4.1 Russia Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.5.4.2 Russia Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.5.4.3 Russia Quad-Flat-No-Lead Packaging Market by Type
7.2.5.4.4 Russia Quad-Flat-No-Lead Packaging Market by Vertical
7.2.5.5 Spain Quad-Flat-No-Lead Packaging Market
7.2.5.5.1 Spain Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.5.5.2 Spain Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.5.5.3 Spain Quad-Flat-No-Lead Packaging Market by Type
7.2.5.5.4 Spain Quad-Flat-No-Lead Packaging Market by Vertical
7.2.5.6 Italy Quad-Flat-No-Lead Packaging Market
7.2.5.6.1 Italy Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.5.6.2 Italy Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.5.6.3 Italy Quad-Flat-No-Lead Packaging Market by Type
7.2.5.6.4 Italy Quad-Flat-No-Lead Packaging Market by Vertical
7.2.5.7 Rest of Europe Quad-Flat-No-Lead Packaging Market
7.2.5.7.1 Rest of Europe Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.5.7.2 Rest of Europe Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.5.7.3 Rest of Europe Quad-Flat-No-Lead Packaging Market by Type
7.2.5.7.4 Rest of Europe Quad-Flat-No-Lead Packaging Market by Vertical
7.3 Asia Pacific Quad-Flat-No-Lead Packaging Market
7.3.1 Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.1.1 Asia Pacific Punched Market by Country
7.3.1.2 Asia Pacific Sawn Market by Country
7.3.2 Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.2.1 Asia Pacific Fully Exposed Terminal Ends Market by Country
7.3.2.2 Asia Pacific Pull-back Terminal Ends Market by Country
7.3.2.3 Asia Pacific Side Wettable Flank Terminal Ends Market by Country
7.3.3 Asia Pacific Quad-Flat-No-Lead Packaging Market by Type
7.3.3.1 Asia Pacific Air Cavity Market by Country
7.3.3.2 Asia Pacific Plastic-moulded Market by Country
7.3.3.3 Asia Pacific Others Market by Country
7.3.4 Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical
7.3.4.1 Asia Pacific Automotive Market by Country
7.3.4.2 Asia Pacific Consumer Electronics Market by Country
7.3.4.3 Asia Pacific Industrial Market by Country
7.3.4.4 Asia Pacific Computing / Networking Market by Country
7.3.4.5 Asia Pacific Communications Market by Country
7.3.5 Asia Pacific Quad-Flat-No-Lead Packaging Market by Country
7.3.5.1 China Quad-Flat-No-Lead Packaging Market
7.3.5.1.1 China Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.5.1.2 China Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.5.1.3 China Quad-Flat-No-Lead Packaging Market by Type
7.3.5.1.4 China Quad-Flat-No-Lead Packaging Market by Vertical
7.3.5.2 Japan Quad-Flat-No-Lead Packaging Market
7.3.5.2.1 Japan Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.5.2.2 Japan Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.5.2.3 Japan Quad-Flat-No-Lead Packaging Market by Type
7.3.5.2.4 Japan Quad-Flat-No-Lead Packaging Market by Vertical
7.3.5.3 India Quad-Flat-No-Lead Packaging Market
7.3.5.3.1 India Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.5.3.2 India Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.5.3.3 India Quad-Flat-No-Lead Packaging Market by Type
7.3.5.3.4 India Quad-Flat-No-Lead Packaging Market by Vertical
7.3.5.4 South Korea Quad-Flat-No-Lead Packaging Market
7.3.5.4.1 South Korea Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.5.4.2 South Korea Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.5.4.3 South Korea Quad-Flat-No-Lead Packaging Market by Type
7.3.5.4.4 South Korea Quad-Flat-No-Lead Packaging Market by Vertical
7.3.5.5 Singapore Quad-Flat-No-Lead Packaging Market
7.3.5.5.1 Singapore Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.5.5.2 Singapore Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.5.5.3 Singapore Quad-Flat-No-Lead Packaging Market by Type
7.3.5.5.4 Singapore Quad-Flat-No-Lead Packaging Market by Vertical
7.3.5.6 Malaysia Quad-Flat-No-Lead Packaging Market
7.3.5.6.1 Malaysia Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.5.6.2 Malaysia Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.5.6.3 Malaysia Quad-Flat-No-Lead Packaging Market by Type
7.3.5.6.4 Malaysia Quad-Flat-No-Lead Packaging Market by Vertical
7.3.5.7 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market
7.3.5.7.1 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.5.7.2 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.5.7.3 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Type
7.3.5.7.4 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical
7.4 LAMEA Quad-Flat-No-Lead Packaging Market
7.4.1 LAMEA Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.1.1 LAMEA Punched Market by Country
7.4.1.2 LAMEA Sawn Market by Country
7.4.2 LAMEA Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.2.1 LAMEA Fully Exposed Terminal Ends Market by Country
7.4.2.2 LAMEA Pull-back Terminal Ends Market by Country
7.4.2.3 LAMEA Side Wettable Flank Terminal Ends Market by Country
7.4.3 LAMEA Quad-Flat-No-Lead Packaging Market by Type
7.4.3.1 LAMEA Air Cavity Market by Country
7.4.3.2 LAMEA Plastic-moulded Market by Country
7.4.3.3 LAMEA Others Market by Country
7.4.4 LAMEA Quad-Flat-No-Lead Packaging Market by Vertical
7.4.4.1 LAMEA Automotive Market by Country
7.4.4.2 LAMEA Consumer Electronics Market by Country
7.4.4.3 LAMEA Industrial Market by Country
7.4.4.4 LAMEA Computing / Networking Market by Country
7.4.4.5 LAMEA Communications Market by Country
7.4.5 LAMEA Quad-Flat-No-Lead Packaging Market by Country
7.4.5.1 Brazil Quad-Flat-No-Lead Packaging Market
7.4.5.1.1 Brazil Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.5.1.2 Brazil Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.5.1.3 Brazil Quad-Flat-No-Lead Packaging Market by Type
7.4.5.1.4 Brazil Quad-Flat-No-Lead Packaging Market by Vertical
7.4.5.2 Argentina Quad-Flat-No-Lead Packaging Market
7.4.5.2.1 Argentina Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.5.2.2 Argentina Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.5.2.3 Argentina Quad-Flat-No-Lead Packaging Market by Type
7.4.5.2.4 Argentina Quad-Flat-No-Lead Packaging Market by Vertical
7.4.5.3 UAE Quad-Flat-No-Lead Packaging Market
7.4.5.3.1 UAE Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.5.3.2 UAE Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.5.3.3 UAE Quad-Flat-No-Lead Packaging Market by Type
7.4.5.3.4 UAE Quad-Flat-No-Lead Packaging Market by Vertical
7.4.5.4 Saudi Arabia Quad-Flat-No-Lead Packaging Market
7.4.5.4.1 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.5.4.2 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.5.4.3 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Type
7.4.5.4.4 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Vertical
7.4.5.5 South Africa Quad-Flat-No-Lead Packaging Market
7.4.5.5.1 South Africa Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.5.5.2 South Africa Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.5.5.3 South Africa Quad-Flat-No-Lead Packaging Market by Type
7.4.5.5.4 South Africa Quad-Flat-No-Lead Packaging Market by Vertical
7.4.5.6 Nigeria Quad-Flat-No-Lead Packaging Market
7.4.5.6.1 Nigeria Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.5.6.2 Nigeria Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.5.6.3 Nigeria Quad-Flat-No-Lead Packaging Market by Type
7.4.5.6.4 Nigeria Quad-Flat-No-Lead Packaging Market by Vertical
7.4.5.7 Rest of LAMEA Quad-Flat-No-Lead Packaging Market
7.4.5.7.1 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.5.7.2 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.5.7.3 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Type
7.4.5.7.4 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Vertical
Chapter 8. Company Profiles
8.1 Toshiba Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research and Development Expense
8.1.5 SWOT Analysis
8.2 Fujitsu Limited
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 SWOT Analysis
8.3 NXP Semiconductors N.V.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expense
8.6 Microchip Technology Incorporated
8.6.1 Company overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. Tianshui Huatian Technology Co.,Ltd
8.10.1 Company Overview
Companies Mentioned
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Methodology
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