The organic substrate packaging material market size is expected to see strong growth in the next few years. It will grow to $20.3 billion in 2030 at a compound annual growth rate (CAGR) of 5.5%. The growth in the forecast period can be attributed to increasing investments in advanced packaging technologies, rising adoption of electric and autonomous vehicles, expansion of high-performance computing applications, growing demand for chip miniaturization, increasing integration of ai-enabled semiconductor devices. Major trends in the forecast period include increasing adoption of advanced semiconductor packaging, rising demand for high-density interconnect substrates, growing use in automotive electronics, expansion of miniaturized electronic devices, enhanced focus on thermal and electrical performance.
The increasing adoption of self-driving vehicles is expected to propel the organic substrate packaging material market growth going forward. Self-driving vehicles, also known as autonomous cars, are capable of sensing their surroundings and operating without human interaction. These vehicles rely heavily on semiconductors to process and interpret the captured data. The growing use of semiconductors is driving demand for advanced packaging solutions, which in turn increases the need for organic substrate packaging materials. For instance, in September 2024, according to S&P Global Mobility, Autonomy Forecasts, a US-based automotive intelligence and data company, sales of autonomous vehicles in the US are projected to grow gradually, with approximately 230,000 autonomous light vehicles expected to be sold by 2034 as part of mobility-as-a-service offerings. Therefore, the increasing adoption of self-driving vehicles is driving growth in the organic substrate packaging material market.
Major companies in the organic substrate packaging material market are concentrating on innovative solutions, such as biodegradable materials and eco-friendly laminations, to meet the growing demand for sustainable packaging options that enhance product safety and environmental responsibility. The Ultra C vac-p flux cleaning tool is a vacuum-based technology designed to efficiently remove flux residues from chip structures in fan-out panel-level packaging (FOPLP), ensuring optimal cleanliness for advanced semiconductor packaging processes. For instance, in July 2024, ACM Research, Inc., a US-based semiconductor company, launched the Ultra C vac-p flux cleaning tool for FOPLP. Utilizing vacuum technology, the new tool efficiently removes flux residues from chiplet structures. ACM also announced that it received a purchase order from a major China-based semiconductor manufacturer. ACM’s Ultra C vac-p represents a significant advancement in addressing the cleaning challenges associated with next-generation advanced packaging technologies.
In May 2023, TIPA Compostable Packaging, an Israel-based producer of flexible compostable and sustainable packaging solutions, acquired Bio4Pack for an undisclosed amount. With this acquisition, TIPA aimed to broaden its product portfolio and strengthen its footprint in European markets by integrating Bio4Pack’s compostable films, laminates, bags, and trays into its offering. Bio4Pack is a Germany-based manufacturer of compostable and bio-based packaging materials for food, retail, and consumer-goods applications.
Major companies operating in the organic substrate packaging material market are Amkor Technology, Incorporated, Advanced Semiconductor Engineering, Incorporated, Shinko Electric Industries, Co., Ltd., Showa Denko, K.K., Kyocera Corporation, WUS Printed Circuit, Co., Ltd., Unimicron Technology Corporation, Ibiden Co., Ltd., AT&S Austria Technologie & Systemtechnik, Aktiengesellschaft, Samsung Electro-Mechanics Co., Ltd., Nippon Mektron, Ltd., Tripod Technology Corporation, Compeq Manufacturing Co., Ltd., HannStar Board Corporation, Kingboard Chemical Holdings Limited, Sumitomo Bakelite Co., Ltd., Panasonic Corporation, Rogers Corporation, Shenzhen Kinwong Electronic Co., Ltd., Unitech Printed Circuit Board Corporation, Young Poong Electronics Co., Ltd., CMK Corporation, Daeduck GDS Co., Ltd., Dynamic Electronics Co., Ltd., Flexium Interconnect, Inc., Interflex Co., Ltd., LG Innotek Co., Ltd.
Asia-Pacific was the largest region in the organic substrate packaging material market share in 2025. North America was the second-largest region in the organic substrate packaging material market. The regions covered in the organic substrate packaging material market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the organic substrate packaging material market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The organic substrate packaging material market consists of sales of integrated circuit packaging, flip-chip scale packaging, and high-density multilayers. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Organic Substrate Packaging Material Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses organic substrate packaging material market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for organic substrate packaging material? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The organic substrate packaging material market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Report Scope
Markets Covered:
1) By Technology: Small Outline (SO) Packages; Grid Array (GA) Packages; Flat No-Leads Packages; Quad Flat Package (QFP)2) By Application: Mobile Phones; FPD (Flat Panel Display); Other End-Uses
3) By End-Use: Consumer Electronics Manufacturers; Automotive Electronics Manufacturers; Healthcare & Medical Device Electronics; Aerospace & Defense Electronics
Subsegments:
1) By Small Outline (SO) Packages: Small Outline Integrated Circuit (SOIC); Small Outline Transistor (SOT)2) By Grid Array (GA) Packages: Ball Grid Array (BGA); Column Grid Array (CGA)
3) By Flat No-Leads Packages: Thin Profile No-Lead (TPNL) Packages; Quad No-Lead (QNL) Packages
4) By Quad Flat Package (QFP): Thin Quad Flat Package (TQFP); Low-Profile Quad Flat Package (LQFP)
Companies Mentioned: Amkor Technology, Incorporated; Advanced Semiconductor Engineering, Incorporated; Shinko Electric Industries, Co., Ltd.; Showa Denko, K.K.; Kyocera Corporation; WUS Printed Circuit, Co., Ltd.; Unimicron Technology Corporation; Ibiden Co., Ltd.; AT&S Austria Technologie & Systemtechnik, Aktiengesellschaft; Samsung Electro-Mechanics Co., Ltd.; Nippon Mektron, Ltd.; Tripod Technology Corporation; Compeq Manufacturing Co., Ltd.; HannStar Board Corporation; Kingboard Chemical Holdings Limited; Sumitomo Bakelite Co., Ltd.; Panasonic Corporation; Rogers Corporation; Shenzhen Kinwong Electronic Co., Ltd.; Unitech Printed Circuit Board Corporation; Young Poong Electronics Co., Ltd.; CMK Corporation; Daeduck GDS Co., Ltd.; Dynamic Electronics Co., Ltd.; Flexium Interconnect, Inc.; Interflex Co., Ltd.; LG Innotek Co., Ltd.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Organic Substrate Packaging Material market report include:- Amkor Technology, Incorporated
- Advanced Semiconductor Engineering, Incorporated
- Shinko Electric Industries, Co., Ltd.
- Showa Denko, K.K.
- Kyocera Corporation
- WUS Printed Circuit, Co., Ltd.
- Unimicron Technology Corporation
- Ibiden Co., Ltd.
- AT&S Austria Technologie & Systemtechnik, Aktiengesellschaft
- Samsung Electro-Mechanics Co., Ltd.
- Nippon Mektron, Ltd.
- Tripod Technology Corporation
- Compeq Manufacturing Co., Ltd.
- HannStar Board Corporation
- Kingboard Chemical Holdings Limited
- Sumitomo Bakelite Co., Ltd.
- Panasonic Corporation
- Rogers Corporation
- Shenzhen Kinwong Electronic Co., Ltd.
- Unitech Printed Circuit Board Corporation
- Young Poong Electronics Co., Ltd.
- CMK Corporation
- Daeduck GDS Co., Ltd.
- Dynamic Electronics Co., Ltd.
- Flexium Interconnect, Inc.
- Interflex Co., Ltd.
- LG Innotek Co., Ltd.
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 16.37 Billion |
| Forecasted Market Value ( USD | $ 20.3 Billion |
| Compound Annual Growth Rate | 5.5% |
| Regions Covered | Global |
| No. of Companies Mentioned | 28 |


