Results for tag: "Organic Substrate Packaging"

Organic Substrate Packaging is a type of semiconductor packaging technology that uses organic materials such as polymers, ceramics, and glass-ceramics as the substrate material. This technology is used to package integrated circuits (ICs) and other electronic components. It offers advantages such as improved thermal performance, reduced weight, and improved electrical performance. Organic Substrate Packaging also provides a cost-effective solution for high-density packaging applications. Organic Substrate Packaging is used in a variety of applications, including consumer electronics, automotive, medical, and industrial. It is also used in the development of advanced semiconductor devices such as microprocessors, memory chips, and radio frequency (RF) components. Organic Substrate Packaging is a rapidly growing market, driven by the increasing demand for high-performance, low-cost semiconductor packaging solutions. Companies in this market include Amkor Technology, STATS ChipPAC, ASE Group, and Chipbond Technology. Show Less Read more