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The organic substrate packaging material market is forecasted to grow by USD 3.57 billion during 2023-2028, accelerating at a CAGR of 4.6% during the forecast period. The report on the organic substrate packaging material market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by surge in global demand for consumer and smart electronic devices, significant rise in demand for portable electronic devices, and increasing adoption of self-driving vehicles.
The organic substrate packaging material market is segmented as below:
By Application
- Consumer electronics
- Automotive
- Manufacturing
- Healthcare
- Others
By Technology
- SO packages
- GA packages
- Flat no-leads packages
- Others
By Geographical Landscape
- APAC
- North America
- Europe
- Middle East and Africa
- South America
The report on the organic substrate packaging material market covers the following areas:
- Organic substrate packaging material market sizing
- Organic substrate packaging material market forecast
- Organic substrate packaging material market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by Technology
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global organic substrate packaging material market: Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT and S Austria Technologie and Systemtechnik Aktiengesellschaft, Compass Technology Co. Ltd., DuPont de Nemours Inc., Fujikura Co. Ltd., Kyocera Corp., Micro Systems Technologies Management GmbH, Mitsubishi Electric Corp., Niterra Co. Ltd., Resonac Holdings Corp., Rogers Corp., Samsung Electronics Co. Ltd., Shinko Electric Industries Co. Ltd., Sumitomo Bakelite Co. Ltd., TAIYO YUDEN Co. Ltd., TDK Corp., TONG HSING Electronics Industries Ltd., TTM Technologies Inc., and Zhen Ding Technology Holding Ltd..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is rising integration of ICS in automobiles."
According to the report, one of the major drivers for this market is the surge in global demand for consumer and smart electronic devices.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- AT and S Austria Technologie and Systemtechnik Aktiengesellschaft
- Compass Technology Co. Ltd.
- DuPont de Nemours Inc.
- Fujikura Co. Ltd.
- Kyocera Corp.
- Micro Systems Technologies Management GmbH
- Mitsubishi Electric Corp.
- Niterra Co. Ltd.
- Resonac Holdings Corp.
- Rogers Corp.
- Samsung Electronics Co. Ltd.
- Shinko Electric Industries Co. Ltd.
- Sumitomo Bakelite Co. Ltd.
- TAIYO YUDEN Co. Ltd.
- TDK Corp.
- TONG HSING Electronics Industries Ltd.
- TTM Technologies Inc.
- Zhen Ding Technology Holding Ltd.
