The Europe 3D IC and 2.5D IC Packaging Market should witness market growth of 9.6% CAGR during the forecast period (2023-2029).
3D ICs and 2.5D ICs have the best electronic architecture. In the future, IC packaging will be required for all electrical devices. The market is consequently closely related to increasing sales and demand. The need for these semiconductors is increasing as modern technologies like high-performance computers, artificial intelligence (AI), and 5G continue to develop. Utilizing these devices enhances the bandwidth, performance, as well as latency of electronic equipment. The demand for smartphones, tablets, and gaming devices, as well as other factors, are also driving the business. In addition, demand is also anticipated to increase due to the growing adoption of advanced design in electronic goods and the move toward smaller electronic devices.
ICs are frequently the primary source of power for medical devices. These include blood collection tools, heart monitors, and some kinds of surgical instruments. As a result, surgery has been more effective because of IC-powered medical equipment, which has improved patient outcomes. These tools let surgeons carry out procedures more precisely and avoid numerous common human errors.
The European semiconductor industry is represented by an organization known as ESIA, which stands for the European Semiconductor Industry Association. In addition to advancing economic growth and responding to pressing societal issues as a supplier of essential supporting technologies, the sector offers creative solutions for the growth of local enterprises. In general, micro- and nanoelectronics allow Europe and the rest of the globe to produce at least 10% of GDP. Furthermore, IC packaging solutions in this region would benefit from expanding the semiconductor sector. Therefore, this element will fuel the regional market's expansion in the upcoming years.
The Germany market dominated the Europe 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $4,544.2 Million by 2029. The UK market is estimated to grow at a CAGR of 8.7% during (2023-2029). Additionally, The France market would exhibit a CAGR of 10.4% during (2023-2029).
Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
3D ICs and 2.5D ICs have the best electronic architecture. In the future, IC packaging will be required for all electrical devices. The market is consequently closely related to increasing sales and demand. The need for these semiconductors is increasing as modern technologies like high-performance computers, artificial intelligence (AI), and 5G continue to develop. Utilizing these devices enhances the bandwidth, performance, as well as latency of electronic equipment. The demand for smartphones, tablets, and gaming devices, as well as other factors, are also driving the business. In addition, demand is also anticipated to increase due to the growing adoption of advanced design in electronic goods and the move toward smaller electronic devices.
ICs are frequently the primary source of power for medical devices. These include blood collection tools, heart monitors, and some kinds of surgical instruments. As a result, surgery has been more effective because of IC-powered medical equipment, which has improved patient outcomes. These tools let surgeons carry out procedures more precisely and avoid numerous common human errors.
The European semiconductor industry is represented by an organization known as ESIA, which stands for the European Semiconductor Industry Association. In addition to advancing economic growth and responding to pressing societal issues as a supplier of essential supporting technologies, the sector offers creative solutions for the growth of local enterprises. In general, micro- and nanoelectronics allow Europe and the rest of the globe to produce at least 10% of GDP. Furthermore, IC packaging solutions in this region would benefit from expanding the semiconductor sector. Therefore, this element will fuel the regional market's expansion in the upcoming years.
The Germany market dominated the Europe 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $4,544.2 Million by 2029. The UK market is estimated to grow at a CAGR of 8.7% during (2023-2029). Additionally, The France market would exhibit a CAGR of 10.4% during (2023-2029).
Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
Scope of the Study
By Packaging Technology
- 2.5D
- 3D wafer-level chip-scale packaging (WLCSP)
- 3D Through-silicon via (TSV)
By End-user
- Consumer Electronics
- Automotive
- Industrial
- Military & Aerospace
- Telecommunications
- Medical Devices & Others
By Application
- Memory
- Imaging & Optoelectronics
- MEMS/Sensors
- Logic
- LED
- Others
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- Samsung Electronics Co., Ltd.
- Taiwan Semiconductor Manufacturing Company Limited
- Intel Corporation
- ASE Group (ASE Technology Holding Co., Ltd.)
- Amkor Technology, Inc.
- Broadcom, Inc.
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- United Microelectronics Corporation
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Competition Analysis - Global
Chapter 4. Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology
Chapter 5. Europe 3D IC and 2.5D IC Packaging Market by End-user
Chapter 6. Europe 3D IC and 2.5D IC Packaging Market by Application
Chapter 7. Europe 3D IC and 2.5D IC Packaging Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Samsung Electronics Co., Ltd.
- Taiwan Semiconductor Manufacturing Company Limited
- Intel Corporation
- ASE Group (ASE Technology Holding Co., Ltd.)
- Amkor Technology, Inc.
- Broadcom, Inc.
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- United Microelectronics Corporation
Methodology
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