The Latin America, Middle East and Africa 3D IC and 2.5D IC Packaging Market should witness market growth of 13.7% CAGR during the forecast period (2023-2029).
One of the biggest market prospects is the growing use of high-end computing, data centers, and servers, as well as the shrinking of IoT devices. Electrical equipment miniaturization has emerged as a prominent market trend. Small, portable, modern, compact electronic devices are becoming increasingly well-liked across the region, particularly among millennials. The 3D IC package is an essential component of these cutting-edge micro-electrical devices. As a consequence, their rising sales quickly reflect the general expansion of the market.
Businesses are seeking to push the envelope by creating cutting-edge technologies like 3D IC and 2.5D IC as the need for silicon wafers increases. As a result, there is a growing demand for really cutting-edge technology all across the region. Because of this, businesses spend a lot of money on R&D, focusing mostly on the development of products, which is good for the market. Long-standing companies in the 2.5D and 3D IC industries are attempting to develop updated, better versions of these parts.
The consumer electronics sector also expands throughout Latin America, particularly due to the region's increased reliance on wireless networking features. Furthermore, the necessary uses of integrated circuits in manufacturing are being accelerated by the increased R&D spending in consumer electronics and technological breakthroughs, as well as the growing popularity of wearable technology. In addition, trends like IoT connectivity, AI and ML applications in smart devices, as well as industrial automation are boosting semiconductor demand. Thus, the development and growth of the regional market are being driven by the growth of telecommunication, consumer electronics, and automation applications in various industries in the region.
The Brazil market dominated the LAMEA 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $1,510.7 Million by 2029. The Argentina market is experiencing a CAGR of 14.3% during (2023-2029). Additionally, The UAE market should witness a CAGR of 13.4% during (2023-2029).
Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
One of the biggest market prospects is the growing use of high-end computing, data centers, and servers, as well as the shrinking of IoT devices. Electrical equipment miniaturization has emerged as a prominent market trend. Small, portable, modern, compact electronic devices are becoming increasingly well-liked across the region, particularly among millennials. The 3D IC package is an essential component of these cutting-edge micro-electrical devices. As a consequence, their rising sales quickly reflect the general expansion of the market.
Businesses are seeking to push the envelope by creating cutting-edge technologies like 3D IC and 2.5D IC as the need for silicon wafers increases. As a result, there is a growing demand for really cutting-edge technology all across the region. Because of this, businesses spend a lot of money on R&D, focusing mostly on the development of products, which is good for the market. Long-standing companies in the 2.5D and 3D IC industries are attempting to develop updated, better versions of these parts.
The consumer electronics sector also expands throughout Latin America, particularly due to the region's increased reliance on wireless networking features. Furthermore, the necessary uses of integrated circuits in manufacturing are being accelerated by the increased R&D spending in consumer electronics and technological breakthroughs, as well as the growing popularity of wearable technology. In addition, trends like IoT connectivity, AI and ML applications in smart devices, as well as industrial automation are boosting semiconductor demand. Thus, the development and growth of the regional market are being driven by the growth of telecommunication, consumer electronics, and automation applications in various industries in the region.
The Brazil market dominated the LAMEA 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $1,510.7 Million by 2029. The Argentina market is experiencing a CAGR of 14.3% during (2023-2029). Additionally, The UAE market should witness a CAGR of 13.4% during (2023-2029).
Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
Scope of the Study
By Packaging Technology
- 2.5D
- 3D wafer-level chip-scale packaging (WLCSP)
- 3D Through-silicon via (TSV)
By End-user
- Consumer Electronics
- Automotive
- Industrial
- Military & Aerospace
- Telecommunications
- Medical Devices & Others
By Application
- Memory
- Imaging & Optoelectronics
- MEMS/Sensors
- Logic
- LED
- Others
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Samsung Electronics Co., Ltd.
- Taiwan Semiconductor Manufacturing Company Limited
- Intel Corporation
- ASE Group (ASE Technology Holding Co., Ltd.)
- Amkor Technology, Inc.
- Broadcom, Inc.
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- United Microelectronics Corporation
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Competition Analysis - Global
Chapter 4. LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology
Chapter 5. LAMEA 3D IC and 2.5D IC Packaging Market by End-user
Chapter 6. LAMEA 3D IC and 2.5D IC Packaging Market by Application
Chapter 7. LAMEA 3D IC and 2.5D IC Packaging Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Samsung Electronics Co., Ltd.
- Taiwan Semiconductor Manufacturing Company Limited
- Intel Corporation
- ASE Group (ASE Technology Holding Co., Ltd.)
- Amkor Technology, Inc.
- Broadcom, Inc.
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- United Microelectronics Corporation
Methodology
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