Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging
Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance.
The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area.
Sample topics covered in Thermal Management Materials for Electronic Packaging include: - Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids - Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials - Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure - Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation
Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.
Table of Contents
Overview of Works xv
Acknowledgments xvii
1 Physical Basis of Thermal Conduction 1
Xian Zhang, Ping Zhang, Chao Xiao, Yanyan Wang, Xin Ding, Xianglan Liu, and Xingyou Tian
1.1 Basic Concepts and Laws of Thermal Conduction 1
1.1.1 Description of Temperature Field 1
1.1.2 Temperature Gradient 2
1.1.3 Fourier’s Law 2
1.1.4 Heat Flux Density Field 2
1.1.5 Thermal Conductivity 3
1.2 Heat Conduction Differential Equation and Finite Solution 3
1.2.1 Heat Conduction Differential Equation 3
1.2.2 Definite Conditions 5
1.3 Heat Conduction Mechanism and Theoretical Calculation 5
1.3.1 Gases 6
1.3.2 Solids 6
1.3.2.1 Metals 6
1.3.2.2 Inorganic Nonmetals 8
1.3.3 Liquids 11
1.4 Factors Affecting Thermal Conductivity of Inorganic Nonmetals 12
1.4.1 Temperature 12
1.4.2 Pressure 13
1.4.3 Crystal Structure 14
1.4.4 Thermal Resistance 14
1.4.5 Others 15
References 15
2 Electronic Packaging Materials for Thermal Management 19
Xian Zhang, Ping Zhang, Chao Xiao, Yanyan Wang, Xin Ding, Xianglan Liu, and Xingyou Tian
2.1 Definition and Classification of Electronic Packaging 19
2.1.1 Definition of Electronic Packaging 19
2.1.2 Functions of Electronic Packaging 20
2.1.3 The Levels of Electronic Packaging 21
2.2 Thermal Management in Electronic Equipment 22
2.2.1 Thermal Sources 22
2.2.2 Thermal Failure Rate 23
2.2.3 The Thermal Management at Different Package Levels 23
2.3 Requirements of Electronic Packaging Materials 24
2.3.1 Thermal Interface Material 24
2.3.2 Heat Dissipation Substrate 25
2.3.3 Epoxy Molding Compound 26
2.4 Electronic Packaging Materials 27
2.4.1 Metal Matrix Packaging Materials 27
2.4.2 Ceramic Matrix Packaging Materials 30
2.4.3 Polymer Matrix Packaging Materials 33
2.4.4 Carbon-Carbon Composite 36
References 36
3 Characterization Methods for Thermal Management Materials 39
Kang Zheng and Xingyou Tian
3.1 Overview of the Development of Thermal Conductivity Test Methods 39
3.2 Test Method Classification and Standard Samples 40
3.2.1 Steady-State Measurement Method 41
3.2.2 Non-Steady-State Measurement Method 42
3.3 Steady-State Method 42
3.3.1 Longitudinal Heat Flow Method 43
3.3.2 Guarded Heat Flow Meter Method 44
3.3.3 Guarded Hot Plate Method 44
3.4 Non-Steady-State Method 46
3.4.1 Laser Flash Method 46
3.4.2 Hot-Wire Method 46
3.4.3 Transient Planar Heat Source (TPS) Method 47
3.5 Electrical Properties and Measurement Techniques 48
3.5.1 Electric Conductivity and Resistivity 49
3.5.1.1 Testing Resistivity of Bulk Material 50
3.5.1.2 Four-Probe Method 50
3.5.1.3 The Van der Pauw Method 51
3.5.2 Dielectric Constant and Its Characterization 52
3.6 Material Characterization Analysis Technology 54
3.6.1 Optical Microscope 54
3.6.2 X-ray Diffraction 55
3.6.2.1 Phase Analysis 56
3.6.2.2 Determination of Crystallinity 56
3.6.2.3 Precise Measurement of Lattice Parameters 56
3.6.3 Scanning Electron Microscope 57
3.6.4 Transmission Electron Microscope 58
3.6.5 Scanning Acoustic Microscope 60
3.6.6 Atomic Force Microscope 62
3.6.7 Thermal Mechanical Analysis (TMA) 64
3.6.8 Dynamic Mechanical Analysis (DMA) 66
3.7 Reliability Analysis and Environmental Performance Evaluation 68
3.7.1 Failure Modes and Mechanisms 69
3.7.1.1 Residual Stress 69
3.7.1.2 Stress Void 70
3.7.1.3 Adherence Strength 70
3.7.1.4 Moisture 70
3.7.2 Reliability Certification 71
3.7.2.1 Viscosity of Plastic Packaging Material 71
3.7.2.2 The Moisture Test 71
3.7.2.3 Hygroscopic Strain and Humidity Measurement 72
3.7.2.4 Temperature Adaptability 72
3.7.2.5 Tightness 72
3.7.2.6 Defects in Manufacturing Process Control 72
3.7.2.7 Quality Control Procedure for High-Reliability Plastic Packaging Devices 73
3.7.2.8 Selection of High-Reliability Plastic Packaging Devices 73
3.8 Conclusion 73
References 74
4 Construction of Thermal Conductivity Network and Performance Optimization of Polymer Substrate 77
Hua Wang, Xingyou Tian, Haiping Hong, Hao Li, Yanyan Liu, Xiaoxiao Li, Yusheng Da, Qiang Liu, Bin Yao, Ding Lou, Mingyang Mao, and Zhong Hu
4.1 Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates 77
4.1.1 Synthesis of Hexagonal Boron Nitride Nanosheets by Halide-Assisted Hydrothermal Method at Low Temperature 77
4.1.2 Modification and Compounding of Inorganic Thermal Conductive Silicon Carbide Filler 77
4.1.3 Preparation and Characterization of Intrinsic Polymer with High Thermal Conductivity 78
4.2 Study on Polymer Thermal Conductive Composites with Oriented Structure 80
4.2.1 Epoxy Composites Filled with Boron Nitride and Amino Carbon Nanotubes 80
4.2.2 Reduction of Graphene Oxide by Amino Functionalization/Hexagonal Boron Nitride 84
4.2.3 The Interconnection Thermal Conductive Network of Three-Dimensional Staggered Boron Nitride Sheet/Amino-Functionalized Carbon Nanotubes 87
4.3 Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure 88
4.3.1 Preparation of Hollow Boron Nitride Microspheres and Its Epoxy Resin Composite 88
4.3.2 Three-Dimensional Skeleton and Its Epoxy Resin Composite 93
4.4 Improved Thermal Conductivity of Fluids and Composites Using Boron Nitride Nanoparticles Through Hydrogen Bonding 100
4.4.1 Preparation and Characterization of Improved Thermal Conductivity of Fluids and Composites Using Boron Nitride Nanoparticles 100
4.4.2 Discussion and Analysis of BN Composites as Thermal Interface Materials 102
4.5 Improved Thermal Conductivity of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 107
4.5.1 Preparation and Characterization of Thermal Conductivity of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 107
4.5.2 Discussion and Analysis of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 109
4.6 Conclusion 114
References 114
5 Optimal Design of High Thermal Conductive Metal Substrate System for High-Power Devices 117
Hong Guo, Zhongnan Xie, and DingBang Xiong
5.1 Power Devices and Thermal Conduction 117
5.2 Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components 120
5.2.1 Preparation and Thermal Conductivity of Gr/Cu Composites 120
5.2.1.1 Gr/Cu In Situ Composite Method 121
5.2.1.2 Thermal Conductivity of Gr/Cu Micro-Nano-Laminated Composites 124
5.2.1.3 Coefficient of Thermal Expansion of Composite Materials 126
5.2.2 Preparation and Thermal Conductivity of Graphite/Cu Composites 130
5.2.2.1 Variations in the Intrinsic Thermophysical Properties of Graphite Sheets During the Compounding Process 131
5.2.2.2 Orientation Modulation of Graphite Sheets in Composites 133
5.2.2.3 Effect of Graphite Sheet Orientation on the Thermal Conductivity of Graphite/Cu Composites 136
5.2.3 Preparation and Thermal Conductivity of Graphite/Gr/Cu Composites 136
5.2.3.1 Thermal Conductivity of Graphite/Gr/Cu Composites 140
5.2.3.2 Thermal Expansion Coefficient of Graphite/Gr/Cu Composites 141
5.3 Formation and Evolution Rules of High Thermal Conductive Interface and Its Control Method 143
5.3.1 Theoretical Calculation of High Thermal Conductive Interface Design 143
5.3.2 Study on Interface Regulation of Chromium-Modified Diamond/Cu Composites 146
5.3.3 Study on Interface Regulation of Boron-Modified Diamond/Cu Composites 150
5.3.4 Study on Interface Regulation of Gr-Modified Diamond/Cu Composites 153
5.4 Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and Its Control Method 157
5.4.1 Configurated Diamond/Metal Composites with High Thermal Conductivity 157
5.4.2 Effect of Secondary Diamond Addition on Properties of Composites 159
5.4.3 Effect of Secondary Particle Size on the Properties of Composites 160
5.4.4 Thermal Expansion Behavior of Composite Materials with Different Thermal Conductive Configurations 161
References 162
6 Preparation and Performance Study of Silicon Nitride Ceramic Substrate with High Thermal Conductivity 165
Yao Dongxu, Wang Weide, and Zeng Yu-ping
6.1 Rapid Nitridation of Silicon Compact 165
6.1.1 Rapid Nitridation of Silicon Compact 165
6.1.1.1 Optimization (YEu)2O3 /MgO Sintering Additive 167
6.1.1.2 Further Optimization of the SRBSN with 2YE5M as Sintering Additive 173
6.2 Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics 181
6.2.1 Preparation of High Thermal Conductivity Silicon Nitride Ceramics Using ZrSi2 as a Sintering Aid 182
6.2.1.1 Reaction Mechanism of ZrSi2 182
6.2.1.2 Effect of ZrSi2 on the Phase Composition 185
6.2.1.3 Effect of ZrSi2 on Microstructure 186
6.2.1.4 Effect of ZrSi2 on Thermal Conductivity 188
6.2.1.5 Effect of ZrSi2 on Mechanical Properties and Electrical Resistivity 189
6.2.2 High Thermal Conductivity Si3N4 Sintered with YH2 as Sintering Aid 190
6.2.2.1 Pre-sintering of the Compact 191
6.2.2.2 Effect of YH2 on the Densification and Weight Loss 194
6.2.2.3 Effect of YH2 on Elements Distribution and Phase Composition 196
6.2.2.4 Effect of YH2 on Microstructure 197
6.2.2.5 Effect of YH2 on Thermal Conductivity 200
6.2.2.6 Effect of YH2 on Mechanical Properties 201
6.2.2.7 Differences in the Effect of Different REH2 on the Thermal Conductivity of Silicon Nitride 203
6.3 Investigation of Cu-Metalized Si3N4 Substrates Via Active Metal Brazing (AMB) Method 204
6.3.1 Effect of Brazing Temperature on the Peeling Strength of Cu-Metalized Si3N4 Substrates 204
6.3.2 Effect of Holding Time on the Peeling Strength of Cu-Metalized Ceramic Substrates 205
6.3.3 Effect of Brazing Ball Milling Time on the Peeling Strength of Cu-Metalized Ceramic Substrates 207
References 207
7 Preparation and Properties of Thermal Interface Materials 211
Xiaoliang Zeng, Linlin Ren, and Rong Sun
7.1 Conception of Thermal Interface Materials 211
7.2 Polymer-Based Thermal Interface Materials 214
7.2.1 Filler Surface Functionalization 214
7.2.2 Covalent Bonding Among Fillers 215
7.2.3 Construction of Thermally Conductive Pathways 215
7.2.3.1 In-Plane Thermally Conductive Pathways 215
7.2.3.2 Out-of-Plane Thermally Conductive Pathways 216
7.2.3.3 Isotropic Thermally Conductive Pathways 220
7.2.4 Enhance the Bonding Force and Construct Thermally Conductive Pathways 221
7.2.4.1 Non-Covalent Bonds and Thermally Conductive Pathways 221
7.2.4.2 Covalent Bonds and Thermally Conductive Pathways 221
7.2.4.3 Welding and Thermally Conductive Pathways 223
7.3 Metal-Based Thermal Interface Materials 223
7.4 Carbon-Based Thermal Interface Materials 229
7.5 Molecular Simulation Study of Interfacial Thermal Transfer 238
7.6 Conclusion 240
References 241
8 Study on Simulation of Thermal Conductive Composite Filling Theory 257
Bin Wu, Peng Chen, and Jiasheng Qian
8.1 Molecular Simulation Algorithms for Thermal Conductivity Calculating 257
8.1.1 MD (Green-Kubo) Method 257
8.1.2 NEMD Method 258
8.1.3 e-DPD Method 259
8.2 Molecular Simulation Study on Polymers 261
8.3 Molecular Simulation Study on TC of Si3N4 Ceramic 265
8.4 Molecular Simulation Study on TC of Diamond/Copper Composites 268
8.5 Simulation Study on Polymer-Based Composites 270
8.5.1 Simulation Analysis in Heat Transfer Pathways Construction 270
8.5.2 Simulation Analysis of Low Thermal Resistance Interface Structure Construction 275
8.5.2.1 Covalent Bonding Construct Interface Structure 275
8.5.2.2 Non-covalent Construct Bonding Interface Structure 283
References 283
9 Market and Future Prospects of High Thermal Conductivity Composite Materials 287
Chen Hongda and Zhang Xu
9.1 Basic Concept of Composite Materials 287
9.1.1 The History of Composite Materials 287
9.1.2 The Introduction of Composite Materials 288
9.1.3 The Application of Composite Materials 288
9.2 Thermal Conductivity Mechanism and Thermal Conductivity Model 290
9.2.1 Electron Conduction Mechanism 290
9.2.2 Phonon Heat Conduction Mechanism 291
9.2.3 Thermal Conduction Mechanism 291
9.2.4 Thermal Conductivity Model 293
9.3 Composite Materials in Electronic Devices 294
9.3.1 Electronic Heat Dissipation and Thermal Adaptation Materials 295
9.3.2 Preparation and Application of Thermally Adaptive Composites 296
9.4 Thermal Functional Composites 298
9.4.1 Thermally Conductive Composites 299
9.4.1.1 Review of the Latest Research Progress 299
9.4.1.2 Comparative Analysis at Home and Abroad 299
9.4.2 Heat-Resistant Composite Materials 299
9.4.2.1 Review of the Latest Research Progress 299
9.4.2.2 Comparative Analysis at Home and Abroad 300
9.4.3 Thermal Storage Composites 300
9.4.3.1 Review of the Latest Research Progress 300
9.4.3.2 Domestic and Foreign Comparative Analysis 301
9.4.4 Application Foresight 301
9.4.5 Future Forecast 302
9.5 The Modification of Composite Materials 302
9.6 The New Packaging Material 310
9.6.1 Third-Generation Packaging Material-Near-Net Shape of High-Volume-Fraction SiCp/Al Composites 310
9.6.2 Fourth-Generation Electronic Packaging Material - Diamond/Cu(AI) Composite Material 311
9.7 Thermal Management of Electronic Devices 312
9.7.1 Electronic Device Heat Dissipation Technology 313
9.7.1.1 Direct Liquid Cooling 314
9.7.1.2 Indirect Liquid Cooling 314
9.7.1.3 Liquid Jet Cooling and Spraying, Drop Cooling 315
9.7.1.4 Microchannel Heat Transfer Microchannel 315
9.7.2 Phase Change Temperature Control 316
9.7.2.1 Inorganic Energy Storage Materials 317
9.7.2.2 Organic Energy Storage Materials 317
9.8 Methods for Improving Thermal Conductivity of Composite Materials 320
9.8.1 Choose a Reasonable Filling Amount 320
9.8.2 Change the Structure and Morphology of the Filling Phase 322
9.8.3 Change the Surface Morphology of the Filling Phase 322
9.8.4 Improving the Dispersion Form of Filling Phase 323
9.9 The Application of Composite Materials 324
9.9.1 Classification of Potting Materials 324
9.9.2 Research Status of Potting Materials 324
9.9.3 Research Status of Thermally Conductive Potting Composite Materials 326
9.9.4 Research on Fillers 327
9.9.4.1 The Effect of Filler Thermal Conductivity on Thermal Conductivity 327
9.9.4.2 The Effect of Filler Particle Size on Thermal Conductivity 328
9.9.4.3 Effect of Filler Surface Modification Treatment on Thermal Conductivity 329
9.9.4.4 Effects of Mixed Particle-Size Fillers on Thermal Conductivity 329
9.10 Conclusion 329
References 330
Index 335
