The North America High-Density Interconnect (HDI) PCB Market should witness market growth of 10.2% CAGR during the forecast period (2023-2030).
The high-density interconnect (HDI) printed circuit boards (PCBs) boost the effectiveness of HDI boards in comparison to traditional PCBs while requiring fewer resources and boards in their construction. Additionally, these boards take less time to manufacture, which contributes to speedier production. The efficiency of the devices into which HDI boards are incorporated is increased by these functionalities. High efficiency, decreasing weight and size, and rising sales of consumer electronics are the main drivers of the market. These HDI PCBs have 400 m capture pads, 150 m smaller vias, and 100 m finer lines and gaps. Additionally, HDI PCBs have a connection pad density of over 20 pads/cm2, which is far higher than that of traditional PCBs.
In a number of end-use industries, such as communications, consumer electronics, and automotive, rising product demand is the main factor driving the market. The rapid product adoption of a variety of electronic products, including touch-screen gadgets, laptop computers, mobile phones, and digital cameras, can be credited to this. Additionally, the growing demand for high-performance devices and the trend toward miniaturizing electronic devices are boosting the market.
The evolution of mobile broadband services is being shaped by consumer expectations. There will be a need for creative solutions to address the anticipated increases in traffic (expected to be 10-100 times during the period of 2020-2030), a rise in the number of services and devices, as well as the desire for improved affordability and user experience. In any case, by the year 2025, there will be 50 billion connected gadgets on the Internet.
The region has a solid position in the market because top providers have boosted their investment in smart solutions for consumer electronics, IT, and telecom applications. The average American family, according to the US Environmental Protection Agency (EPA), employs 28 electronic gadgets, including e-readers, mobile phones, televisions, and personal computers. With the steady flood of new electronic devices, the demand for HDI PCBs will unavoidably increase. The average age of all Canadians was 41.1 years old, and there are seven million people who are over 65. Therefore, with the increasing need for HDIs for medical devices and consumer electronics, the region offers strong growth prospects to the market.
The US market dominated the North America High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $5,345.9 million by 2029. The Canada market is experiencing a CAGR of 12.7% during (2023-2030). Additionally, The Mexico market would exhibit a CAGR of 11.7% during (2023-2030).
Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
The high-density interconnect (HDI) printed circuit boards (PCBs) boost the effectiveness of HDI boards in comparison to traditional PCBs while requiring fewer resources and boards in their construction. Additionally, these boards take less time to manufacture, which contributes to speedier production. The efficiency of the devices into which HDI boards are incorporated is increased by these functionalities. High efficiency, decreasing weight and size, and rising sales of consumer electronics are the main drivers of the market. These HDI PCBs have 400 m capture pads, 150 m smaller vias, and 100 m finer lines and gaps. Additionally, HDI PCBs have a connection pad density of over 20 pads/cm2, which is far higher than that of traditional PCBs.
In a number of end-use industries, such as communications, consumer electronics, and automotive, rising product demand is the main factor driving the market. The rapid product adoption of a variety of electronic products, including touch-screen gadgets, laptop computers, mobile phones, and digital cameras, can be credited to this. Additionally, the growing demand for high-performance devices and the trend toward miniaturizing electronic devices are boosting the market.
The evolution of mobile broadband services is being shaped by consumer expectations. There will be a need for creative solutions to address the anticipated increases in traffic (expected to be 10-100 times during the period of 2020-2030), a rise in the number of services and devices, as well as the desire for improved affordability and user experience. In any case, by the year 2025, there will be 50 billion connected gadgets on the Internet.
The region has a solid position in the market because top providers have boosted their investment in smart solutions for consumer electronics, IT, and telecom applications. The average American family, according to the US Environmental Protection Agency (EPA), employs 28 electronic gadgets, including e-readers, mobile phones, televisions, and personal computers. With the steady flood of new electronic devices, the demand for HDI PCBs will unavoidably increase. The average age of all Canadians was 41.1 years old, and there are seven million people who are over 65. Therefore, with the increasing need for HDIs for medical devices and consumer electronics, the region offers strong growth prospects to the market.
The US market dominated the North America High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $5,345.9 million by 2029. The Canada market is experiencing a CAGR of 12.7% during (2023-2030). Additionally, The Mexico market would exhibit a CAGR of 11.7% during (2023-2030).
Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
Scope of the Study
By End-user
- Consumer Electronics
- Automotive
- Industrial Electronics
- IT & Telecommunications
- Others
By Application
- Smartphone & Tablet
- PC & Laptop
- Smart Wearables
- Others
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. North America High-Density Interconnect (HDI) PCB Market by End User
Chapter 5. North America High-Density Interconnect (HDI) PCB Market by Application
Chapter 6. North America High-Density Interconnect (HDI) PCB Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
Methodology
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