The high density interconnect market size has grown rapidly in recent years. It will grow from $16.45 billion in 2024 to $18.12 billion in 2025 at a compound annual growth rate (CAGR) of 10.1%. The growth in the historic period can be attributed to miniaturization of electronics, consumer electronics boom, increase in mobile devices, performance enhancement, higher functionality requirements.
The high density interconnect market size is expected to see rapid growth in the next few years. It will grow to $27.04 billion in 2029 at a compound annual growth rate (CAGR) of 10.5%. The growth in the forecast period can be attributed to 5g technology implementation, rise in iot devices, emerging ai and machine learning applications, advancements in automotive electronics, growth in wearable devices. Major trends in the forecast period include technological advancements in pcb design, advancements in semiconductor technology, ultra-thin hdi solutions, increased layer count in hdi boards, rise in microvia technology.
The anticipated growth in the forecast period can be credited to the implementation of 5G technology, the upsurge in Internet of Things (IoT) devices, the emergence of artificial intelligence (AI) and machine learning applications, progress in automotive electronics, and the expansion of wearable devices. Noteworthy trends expected in the forecast period encompass technological advancements in PCB design, progress in semiconductor technology, the advent of ultra-thin HDI solutions, an increase in layer count in HDI boards, and the elevation of microvia technology.
The growing use of high-density interconnect (HDI) technology in the automotive industry is expected to drive the expansion of the HDI market. The automotive industry includes a wide range of organizations involved in the design, development, production, marketing, sales, and maintenance of motor vehicles. HDI technology offers several advantages for the automotive sector, such as improved performance, enhanced reliability, better signal transfer, smaller components, and cost reductions. For example, in December 2022, the National Association of Insurance Commissioners, a US-based non-profit organization, projected that there will be 3.5 million autonomous vehicles on American roads by 2025, increasing to 4.5 million by 2030. As a result, the expanding role of the automotive industry is fueling the growth of the high-density interconnect market.
The increasing demand for consumer electronics is also expected to contribute to the growth of the high-density interconnect market. Consumer electronics, encompassing electronic devices designed for everyday use, benefit from HDI technology by providing miniaturization, improved electrical performance, higher circuit density, enhanced signal integrity, multilayer construction, superior thermal performance, increased reliability, and support for advanced packaging techniques. For example, gfu Consumer & Home Electronics GmbH reported sales of $36.56 billion (Euro 33.7) in electronics products from January to September 2022. Consequently, the rising demand for consumer electronics is a significant driver for the growth of the high-density interconnect market.
Technological advancements are becoming a prominent trend in the high-density interconnect market, with major companies embracing innovations such as double-sided imaging (DSI) technology to maintain their market positions. DSI technology enables the imaging of both sides of the PCB panel, eliminating the need for multiple independent DI systems, loader/unloader systems, and flipper systems. For example, in October 2022, Orbotech Ltd., an Israel-based company specializing in solutions for the electronics manufacturing industry, introduced the 8M direct imaging (DI) system as part of the Orbotech Corus DI platform. This fully automated and scalable solution enhances accuracy and efficiency in patterning processes, offering the capability to replace an entire DI production line with a single Orbotech Corus 8M DI system. The platform is cost-effective, expandable, and facilitates ongoing innovation for PCBs and IC substrates, providing higher resolution and precision for patterning finer lines.
Leading companies in the high-density interconnect market are directing their efforts towards innovative products, such as a search engine for electronic design, to drive revenue growth. The search engine for electronic design aims to help engineers expedite time-to-market by providing access to an extensive collection of CAD models, including PCB footprints and schematic symbols for electronic components. For instance, in September 2022, Amphenol Corporation, a UK-based company specializing in interconnect systems, launched the SnapEDA viewer in collaboration with Amphenol Communication Solutions. This viewer offers over 21,000 free, usable CAD models for hardware design, including schematic symbols and PCB footprints. Engineers can download these models in various formats, such as Altium, Eagle, KiCad, and others, compatible with popular CAD programs. The user-friendly SnapEDA viewer interface enables engineers to easily browse, preview, and download CAD models.
In May 2022, Summit Interconnect Inc., a US-based manufacturer of printed circuit boards for innovative technologies, completed the acquisition of Royal Circuit Solutions for an undisclosed amount. This strategic move enhances Summit's engineering and service resources, providing expertise in CAM (computer-aided manufacturing), DFMA (design for manufacturing and assembly), and PCB design and layout. Royal Circuit Solutions, a US-based manufacturer of prototype printed circuits, brings valuable capabilities in complex 12-layer high-density interconnect and quick-turn prototype SMT (surface-mount technology) assembly services.
Major companies operating in the high density interconnect market include Unimicron Technology Corporation, TTM Technologies Inc., Austria Technologie & Systemtechnik AG, Zhen Ding Tech. Group, Meiko Electronics Co. Ltd., Fujitsu Limited, Multek Corporation, NCAB Group, Sierra Circuits Inc., Ibiden Co. Ltd., Samsung Electro-Mechanics, Unitech Printed Circuit Board Corp., CMK Corporation, Nan Ya Printed Circuit Board Corporation, RayMing Technology Co.Ltd, Advanced Circuits Inc., Calumet Electronics Corporation, ChinaPCBOne Technology Limited, Epec Engineered Technologies, Flex PCB Inc., Hemeixin Electronics Co. Limited, King Sun PCB Technology Co. Ltd., Moko Technology Limited, RUSH PCB Inc, XPCB Limited, Sunstone Circuits LLC, 3CEMS Group.
High-density interconnect (HDI) refers to a printed circuit board (PCB) designed to accommodate a greater number of components within the same board space, effectively minimizing the PCB's size while enhancing its functionality and incorporating additional features.
The primary types of high-density interconnect include single panels, double panels, and other variations. Single panels represent a PCB construction where all electronic components and circuitry are situated on a single layer of the board. This configuration is utilized when individual board sizes are substantial, commonly seen in assemblies of low-volume boards. Single panels can be crafted from rigid, flexible, and rigid-flex substrates, catering to diverse applications across industries such as automotive, consumer electronics, telecommunications, medical, and others.
The high-density interconnect research report is one of a series of new reports that provides high-density interconnect market statistics, including the high-density interconnect industry's global market size, regional shares, competitors with high-density interconnect market share, detailed high-density interconnect market segments, market trends and opportunities, and any further data you may need to thrive in the high-density interconnect industry. This high-density interconnect market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.
Asia-Pacific was the largest region in the high-density interconnect market in 2024 and is expected to be the fastest-growing region in the high-density interconnect market report during the forecast period. The regions covered in the high density interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the high density interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The high-density interconnect market consists of sales of dielectric or impedance, rogers PCB, rogers PCB with heavy copper, ENEPIG (electroless nickel electroless palladium immersion gold), and RoHS (restriction of hazardous substances) compliance. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
The high density interconnect market size is expected to see rapid growth in the next few years. It will grow to $27.04 billion in 2029 at a compound annual growth rate (CAGR) of 10.5%. The growth in the forecast period can be attributed to 5g technology implementation, rise in iot devices, emerging ai and machine learning applications, advancements in automotive electronics, growth in wearable devices. Major trends in the forecast period include technological advancements in pcb design, advancements in semiconductor technology, ultra-thin hdi solutions, increased layer count in hdi boards, rise in microvia technology.
The anticipated growth in the forecast period can be credited to the implementation of 5G technology, the upsurge in Internet of Things (IoT) devices, the emergence of artificial intelligence (AI) and machine learning applications, progress in automotive electronics, and the expansion of wearable devices. Noteworthy trends expected in the forecast period encompass technological advancements in PCB design, progress in semiconductor technology, the advent of ultra-thin HDI solutions, an increase in layer count in HDI boards, and the elevation of microvia technology.
The growing use of high-density interconnect (HDI) technology in the automotive industry is expected to drive the expansion of the HDI market. The automotive industry includes a wide range of organizations involved in the design, development, production, marketing, sales, and maintenance of motor vehicles. HDI technology offers several advantages for the automotive sector, such as improved performance, enhanced reliability, better signal transfer, smaller components, and cost reductions. For example, in December 2022, the National Association of Insurance Commissioners, a US-based non-profit organization, projected that there will be 3.5 million autonomous vehicles on American roads by 2025, increasing to 4.5 million by 2030. As a result, the expanding role of the automotive industry is fueling the growth of the high-density interconnect market.
The increasing demand for consumer electronics is also expected to contribute to the growth of the high-density interconnect market. Consumer electronics, encompassing electronic devices designed for everyday use, benefit from HDI technology by providing miniaturization, improved electrical performance, higher circuit density, enhanced signal integrity, multilayer construction, superior thermal performance, increased reliability, and support for advanced packaging techniques. For example, gfu Consumer & Home Electronics GmbH reported sales of $36.56 billion (Euro 33.7) in electronics products from January to September 2022. Consequently, the rising demand for consumer electronics is a significant driver for the growth of the high-density interconnect market.
Technological advancements are becoming a prominent trend in the high-density interconnect market, with major companies embracing innovations such as double-sided imaging (DSI) technology to maintain their market positions. DSI technology enables the imaging of both sides of the PCB panel, eliminating the need for multiple independent DI systems, loader/unloader systems, and flipper systems. For example, in October 2022, Orbotech Ltd., an Israel-based company specializing in solutions for the electronics manufacturing industry, introduced the 8M direct imaging (DI) system as part of the Orbotech Corus DI platform. This fully automated and scalable solution enhances accuracy and efficiency in patterning processes, offering the capability to replace an entire DI production line with a single Orbotech Corus 8M DI system. The platform is cost-effective, expandable, and facilitates ongoing innovation for PCBs and IC substrates, providing higher resolution and precision for patterning finer lines.
Leading companies in the high-density interconnect market are directing their efforts towards innovative products, such as a search engine for electronic design, to drive revenue growth. The search engine for electronic design aims to help engineers expedite time-to-market by providing access to an extensive collection of CAD models, including PCB footprints and schematic symbols for electronic components. For instance, in September 2022, Amphenol Corporation, a UK-based company specializing in interconnect systems, launched the SnapEDA viewer in collaboration with Amphenol Communication Solutions. This viewer offers over 21,000 free, usable CAD models for hardware design, including schematic symbols and PCB footprints. Engineers can download these models in various formats, such as Altium, Eagle, KiCad, and others, compatible with popular CAD programs. The user-friendly SnapEDA viewer interface enables engineers to easily browse, preview, and download CAD models.
In May 2022, Summit Interconnect Inc., a US-based manufacturer of printed circuit boards for innovative technologies, completed the acquisition of Royal Circuit Solutions for an undisclosed amount. This strategic move enhances Summit's engineering and service resources, providing expertise in CAM (computer-aided manufacturing), DFMA (design for manufacturing and assembly), and PCB design and layout. Royal Circuit Solutions, a US-based manufacturer of prototype printed circuits, brings valuable capabilities in complex 12-layer high-density interconnect and quick-turn prototype SMT (surface-mount technology) assembly services.
Major companies operating in the high density interconnect market include Unimicron Technology Corporation, TTM Technologies Inc., Austria Technologie & Systemtechnik AG, Zhen Ding Tech. Group, Meiko Electronics Co. Ltd., Fujitsu Limited, Multek Corporation, NCAB Group, Sierra Circuits Inc., Ibiden Co. Ltd., Samsung Electro-Mechanics, Unitech Printed Circuit Board Corp., CMK Corporation, Nan Ya Printed Circuit Board Corporation, RayMing Technology Co.Ltd, Advanced Circuits Inc., Calumet Electronics Corporation, ChinaPCBOne Technology Limited, Epec Engineered Technologies, Flex PCB Inc., Hemeixin Electronics Co. Limited, King Sun PCB Technology Co. Ltd., Moko Technology Limited, RUSH PCB Inc, XPCB Limited, Sunstone Circuits LLC, 3CEMS Group.
High-density interconnect (HDI) refers to a printed circuit board (PCB) designed to accommodate a greater number of components within the same board space, effectively minimizing the PCB's size while enhancing its functionality and incorporating additional features.
The primary types of high-density interconnect include single panels, double panels, and other variations. Single panels represent a PCB construction where all electronic components and circuitry are situated on a single layer of the board. This configuration is utilized when individual board sizes are substantial, commonly seen in assemblies of low-volume boards. Single panels can be crafted from rigid, flexible, and rigid-flex substrates, catering to diverse applications across industries such as automotive, consumer electronics, telecommunications, medical, and others.
The high-density interconnect research report is one of a series of new reports that provides high-density interconnect market statistics, including the high-density interconnect industry's global market size, regional shares, competitors with high-density interconnect market share, detailed high-density interconnect market segments, market trends and opportunities, and any further data you may need to thrive in the high-density interconnect industry. This high-density interconnect market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.
Asia-Pacific was the largest region in the high-density interconnect market in 2024 and is expected to be the fastest-growing region in the high-density interconnect market report during the forecast period. The regions covered in the high density interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the high density interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The high-density interconnect market consists of sales of dielectric or impedance, rogers PCB, rogers PCB with heavy copper, ENEPIG (electroless nickel electroless palladium immersion gold), and RoHS (restriction of hazardous substances) compliance. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
Table of Contents
1. Executive Summary2. High Density Interconnect Market Characteristics3. High Density Interconnect Market Trends and Strategies4. High Density Interconnect Market - Macro Economic Scenario including the impact of Interest Rates, Inflation, Geopolitics and Covid and Recovery on the Market32. Global High Density Interconnect Market Competitive Benchmarking and Dashboard33. Key Mergers and Acquisitions in the High Density Interconnect Market34. Recent Developments in the High Density Interconnect Market
5. Global High Density Interconnect Growth Analysis and Strategic Analysis Framework
6. High Density Interconnect Market Segmentation
7. High Density Interconnect Market Regional and Country Analysis
8. Asia-Pacific High Density Interconnect Market
9. China High Density Interconnect Market
10. India High Density Interconnect Market
11. Japan High Density Interconnect Market
12. Australia High Density Interconnect Market
13. Indonesia High Density Interconnect Market
14. South Korea High Density Interconnect Market
15. Western Europe High Density Interconnect Market
16. UK High Density Interconnect Market
17. Germany High Density Interconnect Market
18. France High Density Interconnect Market
19. Italy High Density Interconnect Market
20. Spain High Density Interconnect Market
21. Eastern Europe High Density Interconnect Market
22. Russia High Density Interconnect Market
23. North America High Density Interconnect Market
24. USA High Density Interconnect Market
25. Canada High Density Interconnect Market
26. South America High Density Interconnect Market
27. Brazil High Density Interconnect Market
28. Middle East High Density Interconnect Market
29. Africa High Density Interconnect Market
30. High Density Interconnect Market Competitive Landscape and Company Profiles
31. High Density Interconnect Market Other Major and Innovative Companies
35. High Density Interconnect Market High Potential Countries, Segments and Strategies
36. Appendix
Executive Summary
High Density Interconnect Global Market Report 2025 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on high density interconnect market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for high density interconnect? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The high density interconnect market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include:
- The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Scope
Markets Covered:
1) By Type: Single Panel; Double Panel; Other Types2) By Substrate: Rigid; Flexible; Rigid-Flex
3) By End User: Automotive; Consumer Electronics; Telecommunications; Medical; Other End-Users
Subsegments:
1) By Single Panel: Standard Single-Sided HDI; Advanced Single-Sided HDI2) By Double Panel: Standard Double-Sided HDI; Advanced Double-Sided HDI
3) By Other Types: Multi-layer HDI Boards; Flex and Rigid-Flex HDI Boards; Blind and Buried Via HDI Boards
Key Companies Mentioned: Unimicron Technology Corporation; TTM Technologies Inc.; Austria Technologie & Systemtechnik AG; Zhen Ding Tech. Group; Meiko Electronics Co. Ltd.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: PDF, Word and Excel Data Dashboard.
Companies Mentioned
- Unimicron Technology Corporation
- TTM Technologies Inc.
- Austria Technologie & Systemtechnik AG
- Zhen Ding Tech. Group
- Meiko Electronics Co. Ltd.
- Fujitsu Limited
- Multek Corporation
- NCAB Group
- Sierra Circuits Inc.
- Ibiden Co. Ltd.
- Samsung Electro-Mechanics
- Unitech Printed Circuit Board Corp.
- CMK Corporation
- Nan Ya Printed Circuit Board Corporation
- RayMing Technology Co.Ltd
- Advanced Circuits Inc.
- Calumet Electronics Corporation
- ChinaPCBOne Technology Limited
- Epec Engineered Technologies
- Flex PCB Inc.
- Hemeixin Electronics Co. Limited
- King Sun PCB Technology Co. Ltd.
- Moko Technology Limited
- RUSH PCB Inc
- XPCB Limited
- Sunstone Circuits LLC
- 3CEMS Group.
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 200 |
| Published | February 2025 |
| Forecast Period | 2025 - 2029 |
| Estimated Market Value ( USD | $ 18.12 Billion |
| Forecasted Market Value ( USD | $ 27.04 Billion |
| Compound Annual Growth Rate | 10.5% |
| Regions Covered | Global |
| No. of Companies Mentioned | 27 |
