Table of Contents
1. Development of China IC Packaging and Testing Industry1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
1.2 Regional Distribution of IC Packaging and Testing Industry Players in China
2. Development of major IC Packaging and Testing Players in China
2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
2.2.1 JCET
2.2.2 Tongfu Microelectronics
2.2.3 Huatian Technology
3. Outlook for the Industry
3.1 Effects of National Integrated Circuit Industry Investment Fund
3.2 Impact of US-China Conflict and Decoupling from China
3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology
Appendix
List of Companies
List of Tables
Table 1 Ranking of the Top 10 Chinese IC Packaging and Testing Companies in 2022
List of Figures
Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
Figure 3 Financial Information of JCET, 2018-2022
Figure 4 Revenue of JCET by Product Application, 2021-2022
Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
Figure 6 Financial Information of Huatian Technology, 2018-2022
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- AMD
- Amkor
- Ardentec Technology
- ASE Group
- ASEN Semiconductors
- Bosch
- Broadcom
- China Wafer Level
- Chipmore Technology
- Chrysler
- FlipChip International
- Ford
- Forehope Electronic
- General Motors
- Hana Microelectronics
- Hua Hong Semiconductor
- Huatian Technology
- Infineon
- Intel
- JCET
- Kore Semiconductor
- KYEC
- Lingsen Precision
- Micron
- Nepes
- NXP
- Onsemi
- Payton Technology
- Powertech Technology
- Qorvo
- Samsung
- SFA
- Sigurd Microelectronics
- Siliconware
- SJ Semiconductor
- SK Hynix
- Skyworks
- SMIC
- Sony
- STATS ChipPAC
- STMicro
- Texas Instruments
- Tongfu Electronics
- Unimos Microelectronics
- Unisem
- Unitech Holdings
- UTAC
- Walton Advanced Engineering
- Wise Road Capital
- Xilinx
- YTEC
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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