Semiconductor Assembly and Packaging Equipment Market Report 2026

The semiconductor assembly and packaging equipment market size has grown strongly in recent years. It will grow from $13.15 billion in 2025 to $14.24 billion in 2026 at a compound annual growth rate (CAGR) of 8.3%. The growth in the historic period can be attributed to growth in consumer electronics demand, expansion of global semiconductor manufacturing, increasing chip miniaturization, rising investments in backend semiconductor processes, growth of outsourced assembly services.

The semiconductor assembly and packaging equipment market size is expected to see strong growth in the next few years. It will grow to $20.19 billion in 2030 at a compound annual growth rate (CAGR) of 9.1%. The growth in the forecast period can be attributed to AI accelerator chip demand growth, electric vehicle semiconductor adoption, expansion of advanced node packaging, rising demand for high performance computing, increased semiconductor manufacturing localization. Major trends in the forecast period include rising adoption of advanced packaging technologies, growing demand for high throughput assembly equipment, increased focus on miniaturized and high density packaging, expansion of automated inspection and testing, higher emphasis on yield enhancement processes.

Rising demand for consumer electronics is expected to support the expansion of the semiconductor assembly and packaging equipment market. Consumer electronics is a major segment that relies heavily on the semiconductor industry. For example, in May 2023, the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, reported that consumer electronics production reached $204.67 million (¥32,099 million), reflecting a 127% increase compared to the previous year. Therefore, the continued growth of consumer electronics is likely to increase the demand for semiconductor assembly and packaging equipment.

Major companies in the semiconductor assembly and packaging equipment market are advancing new technologies such as semiconductor package substrates to broaden their customer base, increase sales, and drive revenue. A semiconductor package substrate is a crucial component in the assembly of semiconductor devices, including integrated circuits (ICs), microprocessors, and other electronic components. For instance, in February 2023, LG Innotek Co. Ltd., a South Korea-based electronic components manufacturer, introduced the 2Metal Chip on Film (COF). COF, or Chip-on-Film, is an advanced semiconductor package substrate that connects displays to flexible printed circuit boards (PCBs). Its primary role is to help reduce bezels on TVs, notebook PCs, monitors, and smartphones while also supporting smaller module sizes. This innovation works by creating extremely small perforations, known as micro-via holes, on a thin film and embedding ultra-miniaturized circuits on both sides. This enables faster signal transmission between electronic components and supports the development of ultra-high-definition displays.

In April 2025, Applied Materials, Inc., a US-based semiconductor manufacturing company, acquired a 9% stake in BE Semiconductor Industries N.V. (BESI) for an undisclosed amount. Through this acquisition, Applied Materials seeks to strengthen its advanced packaging technology portfolio by collaborating with BESI to co-develop and deliver a fully integrated hybrid bonding solution. This move positions the company to better meet rising demand for high-performance logic and memory chips. BE Semiconductor Industries N.V. (BESI) is a Netherlands-based provider of semiconductor assembly and packaging equipment.

Major companies operating in the semiconductor assembly and packaging equipment market are Tokyo Electron Ltd, Applied Materials, Inc., Kulicke and Soffa Industries, Inc., BE Semiconductor Industries N.V., ASM Pacific Technology Ltd., Screen Holdings Co., Ltd., KLA Corporation, Lam Research Corporation, Hitachi High-Tech Corporation, Advantest Corporation, Teradyne, Inc., Tokyo Seimitsu Co., Ltd., DISCO Corporation, Canon Machinery Inc., SUSS MicroTec SE, EV Group (EVG), Nordson Corporation, Hanmi Semiconductor Co., Ltd., TOWA Corporation, Shinkawa Ltd., Mycronic AB, Besi Switzerland AG.

Asia-Pacific was the largest region in the semiconductor assembly and packaging equipment market in 2025. Western Europe was the second-largest region in the global semiconductor assembly and packaging equipment market share. The regions covered in the semiconductor assembly and packaging equipment market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the semiconductor assembly and packaging equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The semiconductor assembly and packaging equipment market consists of sales of precision ACCRETECH dicing blades, probing machines, polish grinders, high rigid grinder, CMP, edge shaping products, sliced wafer demounting and cleaning machine. Values in this market are factory gate values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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